Patents for B24B 41 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks (11,542)
07/2002
07/17/2002CN2500430Y High speed pneumatic main axle head
07/16/2002US6419563 Method of and an apparatus for machining a workpiece with plural tool heads
07/16/2002US6419555 Process and apparatus for polishing a workpiece
07/16/2002US6419430 Holder for collar of workpiece or tool
07/09/2002US6416394 Planar/grinder for glass
07/09/2002US6416385 Method and apparatus for polishing semiconductor wafers
07/04/2002WO2002016078A3 Polishing apparatus and methods controlling the polishing pressure as a function of the overlapping area between the polishing head and the semiconductor substrate
07/04/2002US20020086626 Seal for use with a chemical mechanical planarization apparatus
07/04/2002US20020086617 Rotary union for semiconductor wafer applications
07/04/2002DE10162945A1 Schleifmaschine Grinding machine
07/02/2002US6413148 Grinding jig for firearm recoil pads
07/02/2002US6413147 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
07/02/2002US6412766 High precision expanding mandrel with cylindrical or compensated gripping
06/2002
06/27/2002US20020081954 Grinding machine
06/27/2002US20020081948 Flexible bending member for a workpiece carrier apparatus
06/27/2002US20020078541 Machining apparatus and equipment of thin section long workpiece
06/26/2002EP1216793A1 Moving device of the skids of a steady rest for grinding
06/26/2002EP1216792A2 Belt conveyor for feeding sheets of glass on a grinding machine, and grinding machine comprising such a conveyor
06/26/2002CN1355084A On-site grinding polisher
06/25/2002US6410438 Method and device for polishing work edge
06/25/2002US6409585 Polishing apparatus and holder for holding an article to be polished
06/25/2002US6409582 Polishing apparatus
06/25/2002US6409581 Belt polishing pad method
06/25/2002US6409578 Adjustable grinding method and apparatus
06/20/2002WO2002047870A1 Arrangement and method for mounting a backing film to a polish head
06/20/2002WO2002016080A3 Substrate supporting carrier pad
06/20/2002WO2002008636A3 An automatic balancer for balancing a mass rotating about an axis
06/20/2002US20020077049 Reinforced CMP carrier bladders
06/20/2002US20020077046 Holder for polished work and manufacturing method thereof
06/20/2002US20020077045 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
06/20/2002US20020077036 Polishing pads and methods relating thereto
06/20/2002DE10134803A1 Twin grinding machine for truing tires has leading and trailing grinding discs whose positions relative to the tire can be controlled for optimum material removal
06/20/2002DE10062922A1 Werkstückaufnahme für eine Schleifmaschine Workpiece holder for polishing machine
06/19/2002EP1215012A2 Workpiece holder for grinding machine
06/19/2002EP1215011A1 Arrangement and method for mounting a backing film to a polish head
06/18/2002US6406362 Seal for use with a chemical mechanical planarization apparatus
06/18/2002US6406361 Carrier head for chemical mechanical polishing
06/18/2002US6405740 Accurate positioning of a wafer
06/12/2002CN1086164C 超声波振动刀具 Ultrasonic vibration tool
06/11/2002US6402605 Drilling device for brittle materials
06/11/2002US6402602 Rotary union for semiconductor wafer applications
06/11/2002US6402590 Carrier head with controllable struts for improved wafer planarity
06/06/2002US20020068517 Wafer polishing apparatus
06/06/2002US20020068515 Method and apparatus for machining workpiece surfaces
06/05/2002EP1100652B1 Sanding device for curved surfaces
06/04/2002US6398906 Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer
06/04/2002US6398629 Bilateral edge-type machine for edge-machining glass or stone-like plate materials and the like
06/04/2002US6398625 Apparatus and method of polishing with slurry delivery through a polishing pad
05/2002
05/30/2002WO2002042033A1 Semiconductor wafer, polishing apparatus and method
05/29/2002EP1208942A1 Peening of cooled turbine blade tip
05/29/2002EP1207981A1 Spindle assembly for force controlled polishing
05/29/2002DE10057228A1 Grinding optical lenses, involves only one changeable lens clamping device to hold lens fixed during processing with cup-shaped tools, enable gymbal movement for shaping tools
05/29/2002CN1350907A Support device for multiple chucks
05/28/2002US6394892 Device for machining optical workpieces
05/28/2002US6394882 CMP method and substrate carrier head for polishing with improved uniformity
05/28/2002US6393712 Grinding jig for grinding gouge chisels
05/23/2002US20020061720 Carrier head with controllable pressure and loading area for chemical mechanical polishing
05/23/2002US20020061716 Workpiece carrier with adjustable pressure zones and barriers
05/23/2002US20020061712 Grinding machine for machining sheets of glass
05/21/2002US6390908 Determining when to replace a retaining ring used in substrate polishing operations
05/21/2002US6390907 Machine tool and machine tool spindle and workpiece mounting-apparatus and grinding process
05/21/2002US6390905 Workpiece carrier with adjustable pressure zones and barriers
05/21/2002US6390897 Cleaning station integral with polishing machine for semiconductor wafers
05/16/2002US20020056338 Cost effective and reliable automatic balancer for high speed applications
05/16/2002US20020056303 Method and apparatus for peening tops of cooled blades
05/16/2002DE10055246A1 Cam grinder with grinder plate and housing has rotary speed restrictor as hollow wheel, grinder plate, cam pin, two engaging parts and part-bearing.
05/16/2002DE10054304A1 Grinder and method of machining workpieces involve holders for workpieces, conveyor and grinding discs
05/16/2002DE10054122A1 Schleifwerkzeug Grinding tool
05/16/2002DE10053977A1 Tragvorrichtung für Aufnahmefutter Support means for receiving feed
05/15/2002EP1205280A1 Wafer polishing method and wafer polishing device
05/14/2002US6386962 Wafer carrier with groove for decoupling retainer ring from water
05/14/2002US6386956 Flattening polishing device and flattening polishing method
05/10/2002WO2002036306A2 Compensation device for a lens grinding apparatus
05/10/2002WO2002036305A1 Centreless cylindrical grinding machine
05/10/2002WO2001072472A3 Carrier head with a flexible membrane having parts made with different elastomers
05/09/2002US20020055326 Parallel alignment method and apparatus for chemical mechanical polishing
05/08/2002EP1007283A4 Mosaic polishing pads and methods relating thereto
05/08/2002CN1347780A Centring device and machine tool with the same centring device
05/07/2002US6383059 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
05/07/2002US6383056 Plane constructed shaft system used in precision polishing and polishing apparatuses
05/07/2002US6382790 Method for producing a multifocal correction lens, and system for implementing same
05/02/2002US20020052177 Supporting device for a plurality of adapter chucks
05/02/2002US20020052168 Method and apparatus for grinding rotors for hydraulic motors and apparatus therefor
05/02/2002EP1201362A1 Tool for machining a surface in a bore
05/02/2002EP1201361A1 Supporting device for optical lenses
04/2002
04/30/2002US6379230 Automatic polishing apparatus capable of polishing a substrate with a high planarization
04/30/2002US6379228 Polishing machine having a plurality of abrasive pads
04/30/2002US6379227 Abrasive-band grinding device and method for controlling an abrasive-band grinding device during grinding of faces of crowned rolls
04/30/2002US6379215 Eyeglass lens processing system
04/25/2002US20020049029 System and method for chemical mechanical polishing
04/25/2002US20020046919 Assembly for supporting and retaining sheets of glass, particularly in a machine for machining the said sheets of glass
04/25/2002DE10134808A1 Grinding unit for a tire truing machine comprises a linearly supported axially movable arm with a grinding disc and motor for rotation
04/24/2002CN2487500Y Improvement in fixing structure of grinding head
04/24/2002CN1345649A Double abrasive wheel
04/23/2002US6375559 Polishing system having a multi-phase polishing substrate and methods relating thereto
04/23/2002US6375556 Grinding apparatus for grinding workpieces
04/23/2002US6375555 Vane groove grinding apparatus for compressor cylinder
04/23/2002US6375553 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
04/23/2002US6375549 Polishing head for wafer, and method for polishing
04/23/2002US6375542 Hydrostatic spindle unit with automatic self centering of the workpiece
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