Patents for B24B 41 - Component parts of grinding machines or devices, such as frames, beds, carriages or headstocks (11,542)
01/2002
01/31/2002WO2002008636A2 An automatic balancer for balancing a mass rotating about an axis
01/31/2002WO2002007931A2 Multi-chamber carrier head with a flexible membrane
01/31/2002WO2002007920A1 Machine tool
01/31/2002WO2001072473A3 Carrier head with controllable edge pressure
01/31/2002US20020013122 Process and apparatus for chemimechanically polishing a substrate
01/30/2002EP1175963A1 Machine for external cylindrical grinding
01/30/2002EP1175961A2 Method and apparatus for machining workpiece surfaces
01/30/2002EP1175960A2 Method and device for aligning a workpiece axis with a tool axis in a machine tool
01/30/2002EP1175957A1 Suction table apparatus for supporting and retaining a sheet of glass
01/30/2002EP1175282A1 Method and apparatus for controlling a workrest
01/30/2002CN1078517C Double face abrading machine
01/30/2002CN1078516C Internal abrasive machine
01/29/2002US6341995 Chemical mechanical polishing apparatus
01/24/2002WO2002006005A1 Lens lathe with vibration cancelling arrangement
01/24/2002US20020009958 Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
01/24/2002DE10105672A1 Spindelvorrichtung mit Turbinenrotor Spindle apparatus with turbine rotor
01/23/2002EP1174214A1 Apparatus for working the edges of glass plates
01/23/2002EP0993350B1 Internal abrasive machine
01/23/2002CN1332665A Abrasive machine for machining flange on work piece
01/23/2002CN1332664A Abrasive machine for machining surface of cylindrical work piece
01/23/2002CN1332060A Abrading substances holding material and manufacturing method thereof
01/22/2002US6340326 System and method for controlled polishing and planarization of semiconductor wafers
01/17/2002WO2002004172A2 Carrier head with flexible membranes to control the applied load and the dimension of the loading area
01/17/2002WO2001056743B1 Interface assembly for lapping control feedback
01/17/2002US20020006771 Edging unit applicable to machines for working the edges of plates particularly of glass plates
01/17/2002US20020006764 Device for machining optical workpieces
01/17/2002US20020005240 Method of adhering wafers and wafer adhering device
01/17/2002DE10029967A1 Optical workpiece processing device has torque motor on side wall of frame to turn yoke
01/17/2002DE10029966A1 Vorrichtung zum Laden und Entladen optischer Werkstücke Apparatus for loading and unloading optical workpieces
01/16/2002EP1171262A1 Device for flat deburring by brushing
01/16/2002EP1034064B1 Improved grinding machine
01/16/2002CN2471473Y Granite grinding head of polishing machine
01/13/2002CA2313830A1 Single point diamond turning lathe with vibration cancelling feature
01/10/2002WO2002002276A2 Projected gimbal point drive
01/10/2002WO2002002275A1 Wafer carrier with groove for decoupling retainer ring from wafer
01/09/2002EP1170089A1 Polishing apparatus
01/09/2002EP0907461B1 Grinding machine spindle flexibly attached to platform
01/09/2002CN2470049Y Clamp for grinding star jacketed-ball groove
01/08/2002US6337281 Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
01/08/2002US6336853 Carrier having pistons for distributing a pressing force on the back surface of a workpiece
01/08/2002US6336849 Grinding spindle
01/08/2002US6336845 Method and apparatus for polishing semiconductor wafers
01/03/2002WO2002000392A1 Device for loading and unloading optical workpieces
01/03/2002WO2001038045A8 Loading system and collet assembly for grinding a workpiece
01/03/2002US20020002031 Projected gimbal point drive
01/03/2002DE10028791A1 Grinding machine for operating a grinding head sliding on a portal has a machine bed, a workpiece carrier and two props on each side of the workpiece carrier interconnecting via a lateral tie-bar to form a portal to overlap the carrier.
01/02/2002EP1166961A1 Grinding machine for simultaneously grinding the four edges of a glass sheet
01/02/2002EP1165286A1 Receiving chuck for optical components for the purpose of precision-grinding and/or polishing
01/02/2002CN2468664Y Polishing machine grinding head
01/02/2002CN2468663Y Chamfering angle grinding head
01/02/2002CN1329528A Method and device for grinding workpieces with centers which comprise form variations
12/2001
12/27/2001WO2001098026A1 Grinding machine
12/27/2001WO2001098025A1 Ferrule holder assembly for optical fiber end face polishing machine
12/27/2001US20010055933 Machining apparatus for workpiece and method therefor
12/27/2001US20010055459 Ferrule holder assembly for optical-fiber-end-face grinding apparatus
12/27/2001CA2411188A1 Grinding machine
12/26/2001CN1076651C Method for deburring itmes, particularly itmes of metal, and use of same
12/25/2001US6332834 Method and apparatus for grinding a workpiece
12/25/2001US6332830 Polishing method and polishing device
12/25/2001US6332386 Transmission mechanism for spindle head of five-axis machine tool
12/20/2001WO2001096066A1 Wafer polishing method
12/20/2001WO2001096063A1 Magnetic head grinding device and method
12/20/2001US20010053661 Apparatus and method for ELID grinding a large-diameter workpiece to produce a mirror surface finish
12/18/2001US6331138 Grinding machine
12/13/2001WO2001094075A1 Orbital polishing apparatus
12/13/2001WO2001094073A1 Ergonomically friendly orbital sander construction
12/13/2001WO1999062671A9 Apparatus for polishing silicon wafers
12/13/2001DE10010108C1 Exentertellerschleifer Exentertellerschleifer
12/06/2001WO2001091967A1 Centerless grinding machine
12/06/2001US20010049256 Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same
12/06/2001US20010049251 Interface assembly for lapping control feedback
12/06/2001US20010048874 Microelectronic workpiece support and apparatus using the support
12/06/2001US20010047978 Using plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 mu m of semiconductor material is removed; accuracy
12/05/2001EP1160054A1 Apparatus for machining cylindrical journals on workpieces by means of an abrasive belt
12/05/2001EP0971810B1 Method and apparatus for polishing ophthalmic lenses
12/05/2001EP0833718B1 Improvements in and relating to grinding
12/05/2001CN1324709A Grinding method and grinding apparatus
11/2001
11/29/2001WO2001089763A2 Multilayer retaining ring for chemical mechanical polishing
11/29/2001US20010046774 Planarization system with multiple polishing pads
11/29/2001DE10023002A1 Verfahren zur beidseitigen Politur von Halbleiterscheiben und Läuferscheiben zur Durchführung des Verfahrens Method for two-sided polishing of semiconductor wafers and rotor disks for performing the method
11/28/2001EP0994763B1 Grinding machine spindle
11/27/2001US6322432 Sander assembly having adjustable working table
11/27/2001US6322428 Working device and working method for magnet member
11/27/2001US6322423 Internal abrasive machine
11/22/2001US20010044270 Polishing apparatus
11/22/2001US20010044258 Method for lapping and a lapping apparatus
11/21/2001EP1155780A2 Grinding machine with direct drive rotary wheelhead
11/21/2001EP1155779A2 Grinding machine with a harmonic drive reducer wheelhead
11/21/2001EP1154877A2 A polishing machine and method
11/21/2001CN1074968C Grinding apparatus
11/15/2001WO2001047665B1 Method and device for grinding fluted tools
11/15/2001US20010041650 Polishing device and polishing pad component exchange device and method
11/15/2001US20010041526 Carrier head with a flexible membrane for a chemical mechanical polishing system
11/15/2001US20010041523 Machine for grinding cylindrical bearing surfaces on parts using an abrasive belt
11/15/2001US20010041521 Adjustable and extended guide rings
11/15/2001US20010041512 End face polishing apparatus
11/15/2001US20010041319 Prcocessing jig
11/14/2001CN2459079Y Multi-function disintegrator
11/13/2001US6315649 Wafer mounting plate for a polishing apparatus and method of using
11/13/2001US6315641 Method and apparatus for chemical mechanical polishing
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