Patents for B23K 35 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting (23,588)
03/2004
03/23/2004US6708869 Method for production of heat exchanger
03/23/2004US6708864 “S” shaped cast in wire
03/18/2004WO2004023523A2 Apparatus and process for manufacturing solder balls
03/18/2004WO2004022816A1 Method for controlling the microstructure of a laser metal formed hard layer
03/18/2004US20040052678 Tin, silver, bismuth alloy
03/18/2004US20040052050 Polymer solder hybrid
03/18/2004US20040050913 High strength diffusion brazing utilizing nano-powders
03/18/2004US20040050912 Diffusion bonding process of two-phase metal alloys
03/18/2004US20040050909 Diffusion bond mixture for healing single crystal alloys
03/18/2004US20040050904 Solder hierarchy for lead free solder joint
03/18/2004US20040050903 Solder ball
03/18/2004US20040050835 Solid wire for arc welding
03/18/2004DE10240355A1 Composite component used in the production of optical lenses and filters comprises bodies joined together by a solder connection free from a fluxing agent
03/18/2004DE10239141A1 Laser soldering method for two sheet metal workpieces, involves heating solder using an electric current prior to its supply to the are to be joined
03/17/2004EP1398106A1 Method and apparatus for welding rails with a rotating welding steel disc
03/17/2004CN1482956A Solder foil, semiconductor device and electronic device
03/17/2004CN1482266A Industrial pure tin with resistance to liquid surface oxidizing and application
03/17/2004CN1481970A Tin-zinc base plumbum-free solder alloy and its preparing technology
03/17/2004CN1481969A Welding electrode for high manganese carbon steel rail
03/17/2004CN1481968A Process for preparing potassium titanate used for welding electrode
03/17/2004CN1481964A Weld anti-spatter compound
03/16/2004US6707005 Penetration flux
03/16/2004US6706417 Fluxing underfill compositions
03/16/2004US6706219 Comprises resin of vinyl terminated polydimethyl siloxane, methylhydrosiloxane-dimethylsiloxane copolymers, polysilicate, silicone rubber formed with use of karstedt cataylst; heat dissipation; heat resistant semiconductors
03/16/2004US6705848 Powder metal scrolls
03/16/2004CA2087109C Method of making a brazeable metal pipe having tube-insertion apertures formed with guide lugs
03/11/2004WO2004020191A1 Aluminum/nickel clad material and method for manufacture thereof, and exterior terminal for electric cell
03/11/2004WO2004020143A1 Fluxing agent preparation and method for effecting a solder-free joining of aluminum or aluminum alloys
03/11/2004US20040048096 Used as a core material for heat exchangers, reaction vessels for chemical plants, ships, paper industries, constructions, bridges, pressure vessels, desalination and electric facilities, flue gas desulfurization plants
03/11/2004US20040045643 Composite aluminium sheet
03/11/2004US20040045641 Wear-resistant copper-base alloy
03/10/2004EP1396556A1 Method for controlling the microstructure of a laser metal formed hard layer
03/10/2004EP1395387A1 High temperature melting braze materials for bonding niobium based alloys
03/10/2004CN1480290A Welding fluid applicable to weld in ultra narrow gap and coating method
03/10/2004CN1480289A Method for preparing microshere solder and micro spraying device utilized
03/10/2004CN1141200C Non-corrosive solder for soldering stainless iron and aluminium
03/09/2004US6703113 Pb-free solder composition and soldered article
03/09/2004US6702906 Nickel (ni); for cracking furnace tubes and reformer furnace tubes in ethylene plants; hot workability, weldability, and strength at high temperature
03/09/2004US6702177 Manufacturing process for a plated product comprising a support part in steel and an anticorrosion metallic coating
03/09/2004US6702176 Solder, method for processing surface of printed wiring board, and method for mounting electronic part
03/09/2004US6702175 Method of soldering using lead-free solder and bonded article prepared through soldering by the method
03/04/2004WO2004018719A1 Negative volume expansion lead-free electrical connection
03/04/2004WO2004018147A1 Phosphorus-copper base brazing alloy
03/04/2004WO2004018146A1 Tin-zinc lead-free solder and solder-joined part
03/04/2004WO2004018145A1 Tin-zinc lead-free solder, its mixture, and solder-joined part
03/04/2004WO2003004713A3 Lead-free solder alloy
03/04/2004US20040042181 Thermoelectric module and process for producing the same
03/04/2004US20040040153 Method for manufacturong heat exchanger
03/04/2004DE10238551A1 Production of a composite component used as a sealing element in gas turbines comprises joining a structure to a support by soldering using aluminum as the solder material
03/04/2004CA2466949A1 Tin-zinc lead-free solder, its mixture, and solder-joined part
03/04/2004CA2466948A1 Tin-zinc lead-free solder and solder-joined part
03/03/2004CN1478632A High hardness high abrasive self protecting pile up welding flux core welding wire
03/03/2004CN1140379C Anticorrosion refractory tubular welding wire
03/03/2004CN1140378C Composition for preventing creeping of flux for soldering and its used welding method and welding products
03/03/2004CN1140373C Welding method
03/02/2004US6699306 Dip soldering printed circuit board with surfaced copper foil and component having a copper lead attached thereto; replenishment; lead-free solders
03/02/2004US6698644 Joins titanium to stainless steel in single tube coriolis mass flow sensor
03/02/2004CA2259826C Welding material for high-cr steels
02/2004
02/26/2004WO2003025237A8 Component repair materials
02/26/2004US20040038070 Fluxless brazing
02/26/2004US20040035911 Fluxless brazing
02/26/2004US20040035910 Low temperature fluxless brazing
02/26/2004US20040035909 For use with electronic/flip chip packaging; requires reflow temperatures compatible with circuit board assembly processes; improved reliability over eutectics under high temperature processing
02/26/2004US20040035247 Method and apparatus for manufacturing minutes metalic sphere
02/26/2004DE10235821A1 Process gas for laser hard soldering galvanized steel or heterogeneous material compounds contains active gas
02/25/2004EP1391537A1 COATING FORMING METHOD AND COATING FORMING MATERIAL, AND ABRASIVE COATING FORMING SHEET
02/25/2004EP1391536A2 Composition and process for plating silver onto a metallic substrate
02/25/2004EP1391261A1 Lead-based solder alloys containing copper
02/25/2004EP1390173A1 Highly ductile reduced imperfection weld for ductile iron and method for producing same
02/25/2004EP0958098B1 Multi-purpose, multi-transfer, multi-position shielding gas for arc welding
02/25/2004CN1478173A Metallic honeycomb cellular seal-structure for turbomachine
02/25/2004CN1478009A Solder pastes
02/25/2004CN1478008A Plate type heat exchanger and method for manufacture thereof
02/25/2004CN1476954A Production method of soldering tin ball for BGA and its equipment
02/25/2004CN1476953A Powder care solder wire for gas protective arc welding
02/25/2004CN1476952A Brazing copper heat exchanger and method for mfg. it through soldering
02/25/2004CN1139457C Multi-element Cu-base solder for soldering low-alloy chilled cast iron
02/24/2004US6696176 Superalloy material with improved weldability
02/24/2004US6696175 Unrecrystallized layer and associated alloys and methods
02/24/2004US6696170 Copper-free wire
02/24/2004US6696017 Ni-base brazing alloy
02/24/2004US6695200 Bumps made with adhesive film instead of gold plating
02/19/2004WO2004014599A1 Process gas and method for laser hard soldering
02/19/2004WO2004014598A1 Process gas and method for laser hard soldering
02/19/2004US20040031775 Shielding gas and arc-welding method
02/19/2004DE10235822A1 Process for laser beam hard soldering using a laser beam encased by a process gas stream directed onto the solder site
02/18/2004EP1069967B1 Composite powder for diffusion-welding
02/18/2004CN1475327A Antioxidation leadless welding material
02/17/2004US6692691 Prevents much copper comprised in the printed-circuit board from being reduced to be diffused in the soldering alloy, keeps mechanical strength at soldered part
02/17/2004US6692586 High temperature melting braze materials for bonding niobium based alloys
02/17/2004US6692581 Flux and metallic alloy powder
02/17/2004US6691911 Avoiding gold rich phases in the solder by using a solder consisting essentially of from 78 wt % to less than 79.5 wt % gold and the balance tin
02/17/2004CA2102071C Brazeable aluminum material and a method of producing same
02/17/2004CA2058150C Recharging bead incorporating fibres or at least one reinforcing wire
02/12/2004WO2003053621A3 Wire for high-speed electrical discharge machining
02/12/2004US20040028940 Aluminum alloy fin material for heat exchangers and heat exchanger including the fin material
02/12/2004US20040026670 Mixture of silicone anf head conductive fillers; electronic interface
02/12/2004US20040026484 Multi-functional solder and articles made therewith, such as microelectronic components
02/12/2004US20040026479 Continuous mode solder jet apparatus
02/12/2004US20040026396 Flux-cored wire formulation for welding