Patents for B23K 35 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting (23,588)
09/2003
09/02/2003US6613123 A powder mixture including a first constituent having a first melting point(lower than second), first mean particle size includes a metal or metal alloy powder, second constituent includes a metal powder having second melting point and
09/02/2003US6612480 Method of forming preforms for metal repairs
08/2003
08/28/2003WO2003070994A2 Lead-free tin-silver-copper alloy solder composition
08/28/2003US20030162051 Unrecrystallized layer and associated alloys and methods
08/28/2003US20030160089 Method of modifying tin to lead ratio in tin-lead bump
08/28/2003US20030159761 Tin, silver, copper alloy
08/27/2003EP1338663A1 Ni-base heat-resistant alloy and weld joint using the same
08/27/2003EP1337377A1 Solder material and electric or electronic device in which the same is used
08/27/2003EP1337376A1 Soldering flux for use in diffusion soldering process and method for producing soldered connections using said soldering flux
08/27/2003EP1337374A1 Method of manufacturing an assembly of brazed dissimilar metal components
08/27/2003CN1438734A Solder-holder for supplying solder to connector
08/27/2003CN1438088A Large rooler hard-surface build-up welding repairing method
08/26/2003US6610962 Method for producing a crack resistant weld
08/26/2003US6609652 Ball bumping substrates, particuarly wafers
08/21/2003WO2003068447A1 Solder paste formulations, methods of production and uses thereof
08/21/2003US20030157761 Method for forming bumps, semiconductor device, and solder paste
08/21/2003US20030157360 Bonded member comprising different materials and production method thereof
08/21/2003US20030156969 Coupling electroconductive pads
08/21/2003US20030155409 Fluxless brazing
08/21/2003US20030155408 Sacrificial seed layer process for forming c4 solder bumps
08/21/2003US20030155402 Solder process and solder alloy therefor
08/20/2003EP1335811A1 Slide bearing for a centrifugal pump
08/20/2003EP1207979A4 Cobalt-base composition and method for diffusion braze repair of superalloy articles
08/20/2003CN1118351C Composite sheet for brazing
08/19/2003US6608381 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
08/19/2003US6608286 Versatile continuous welding electrode for short circuit welding
08/19/2003US6608284 Weld wire with enhanced slag removal
08/19/2003US6608283 Apparatus and method for solder-sealing an active matrix organic light emitting diode
08/19/2003US6607847 Bonded niobium silicide and molybdenum silicide composite articles using brazes
08/19/2003US6607613 Solder ball with chemically and mechanically enhanced surface properties
08/19/2003US6607118 Apparatus and method for ball release
08/19/2003CA2154782C No-clean, low-residue, volatile organic compound free soldering flux and method of use
08/14/2003WO2003066274A1 Solder and solder connection
08/14/2003WO2003007312A3 Thermal interface material and heat sink configuration
08/13/2003EP1333958A1 Method of joining surfaces
08/13/2003EP1333957A1 Lead-free solders
08/13/2003EP1333952A1 Method for manufacturing heat exchanger
08/13/2003CN1435506A Method for cryogenic treatment of aluminium alloy resistance spot welding electrode
08/13/2003CN1435505A Method for cryogenic treatment of galvanized steel sheet resistance spot welding electrode
08/13/2003CN1435294A Rareearth-silver solder and producing method thereof
08/12/2003US6605371 Brazing alloy for stainless steel, structure braze-assembled with the brazing alloy, and brazing material for stainless steel
08/12/2003US6605370 Joining product having a base substrate of an aluminium alloy comprising silicon; nickel layer; welding; fuel tanks; no need for a vacuum atmosphere nor a protective gas
08/12/2003US6605238 Vinyl alcohol modified polydimethylsilanol, dimethyl silandiol-methylsilandiol copolymer, a dimethylvinylsilanol modified polysilicate, a platinum vinylsiloxane, a wetting agent and a thermoconductive filler; enhance heat dissipation
08/12/2003US6604669 Manifold for heat exchanger and process therefor
08/07/2003WO2003064818A2 Geothermal steam turbine
08/07/2003WO2003064713A1 Thermal interface materials; and compositions comprising indium and zinc
08/07/2003WO2003064103A1 Steel wire for carbon dioxide shielded arc welding and welding process using the same
08/07/2003WO2003064102A1 Solder metal, soldering flux and solder paste
08/07/2003US20030148138 First step of preparing a lower layer paste with the use of a first mixture comprising nickel, tungsten and molybdenum, applying the lower layer paste to a surface of a ceramic base which is a sintered ceramic, and drying the resultant coating
08/07/2003US20030146206 Ceramic heater
08/07/2003US20030146192 Long life welding electrode and its fixing structure, welding head, and welding method
08/07/2003US20030145977 Directionally solidified superalloy weld wire
08/07/2003US20030145912 Formable, high strength aluminium-magnesium alloy material for application in welded structures
08/06/2003EP1332831A1 Alloy for solder and solder joint
08/06/2003EP1332830A1 Lead pin with Au-Ge based brazing material
08/06/2003EP1332727A2 Orthodontic appliance
08/06/2003EP1242643B1 Aluminium brazing alloy
08/06/2003CN1434213A Powder metal scrolls
08/06/2003CN1433869A Low-alloy high-strength high-toughness electric welding rod
08/06/2003CN1433868A Tube shape tungsten carbide welding rod containing cubic boron nitride grain
08/06/2003CN1116957C Welding rod resulting in high fatigue strength of welded joint
08/06/2003CN1116955C Medium flash welding method for high manganese steel switch and carbon steel rail
08/05/2003US6603205 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components
08/05/2003US6603090 Pulverulent filler and method for applying a wear-resistant layer
08/05/2003US6602777 Method for controlling the formation of intermetallic compounds in solder joints
08/05/2003US6601753 Void-free die attachment method with low melting metal
07/2003
07/31/2003WO2003061962A1 Unrecrystallized layer and associated alloys and methods
07/31/2003WO2003061897A1 Lead-free solder material
07/31/2003WO2003061896A1 Solder alloy and soldered joint
07/31/2003WO2003061894A1 Solder-bearing components including a solder-bearing electromagnetic shield and method of retaining a solder mass therein
07/31/2003US20030143419 Structure for interconnecting conductors and connecting method
07/31/2003US20030143104 Solder alloy and soldered bond
07/31/2003US20030141602 Lead pin with Au-Ge based brazing material
07/31/2003US20030141351 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
07/31/2003US20030141345 Bonded member comprising different materials, and production method thereof
07/31/2003US20030141344 Friction welding
07/31/2003US20030141342 Minute copper balls and a method for their manufacture
07/31/2003CA2473573A1 Unrecrystallized layer and associated alloys and methods
07/30/2003EP1331395A2 Powder metal scrolls
07/30/2003EP1331362A2 Geothermal steam turbine
07/30/2003CN1433351A Hardening flux, soldering resist, remicondctor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
07/30/2003CN1432448A Low-carbon high-speed metal welding wire
07/30/2003CN1116512C Nozzle for gas turbine
07/30/2003CN1116147C Sinter omlding flux for submerged arc welding and its manufacture
07/29/2003US6599645 Metal plates brazened to corrugated, honeycomb structure aluminium stiffener sheet
07/29/2003US6599372 Water insoluble resin dispersed in water, activating agent is organic acid or halogen compound; resin is pentaerythritol ester of hydrogenated rosin; printed circuit board
07/29/2003US6598782 Metal foil connection, honeycomb body, metal foil brazing medium particle fraction for metal foils and method for manufacturing a metal foil connection
07/29/2003US6598781 Article having turbulation and method of providing turbulation on an article
07/29/2003US6598779 Electronic component mounting method
07/29/2003CA2165408C Brazing sheet having increased silicon content in aluminium core sheet
07/29/2003CA2060889C Tungsten carbide-containing hard alloy that may be processed by melting
07/24/2003WO2003059843A1 Method of joining ceramic and metal parts
07/24/2003WO2003059566A1 Welding material assembly with conductive flexible carrier sheet and method of welding tubular members
07/24/2003WO2003059565A1 Welding material and method without carrier
07/24/2003WO2003059564A1 Soldering method and solder alloy for additional supply
07/24/2003US20030138339 Powder metal scrolls
07/24/2003US20030136818 Solder-bearing components and method of retaining a solder mass therein
07/24/2003US20030136811 Liquid phase diffusion bonding to a superalloy component
07/24/2003US20030136774 Straight polarity metal cored wire
07/24/2003US20030136765 Process for making heterogeneous joints under shielding gas