Patents for B23K 35 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting (23,588) |
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11/18/2004 | US20040226982 Soldering iron tip and method of manufacturing same |
11/18/2004 | US20040226981 Soldering iron tip and method of manufacturing same |
11/18/2004 | US20040226831 Providing a substrate, electrodes that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy toand/or electrodes to generate electrons; contacting substrate with negatively charged reducing gas to reduce metal oxides |
11/18/2004 | DE102004014703A1 Wärmeverteilermodul und Verfahren zur Herstellung desselben Heat spreader module and method of manufacturing the same |
11/17/2004 | EP1194263B1 Process for the production of components coated with an aluminium-silicon alloy |
11/17/2004 | CN1547518A Nonleaded solder alloy and electronic parts using it |
11/17/2004 | CN1546275A Tungsten carbide - cobalt - copper based welding rod alloy and method for making same |
11/17/2004 | CN1546274A Process for preparing electronic soft-soldering alloy |
11/17/2004 | CN1546267A Welding method for ultra-thin composite layer low-carbon steel - austenitic stainless steel multiple tube adaptor |
11/17/2004 | CN1175957C Corrosion proof fluoride welding agent containing magnesium-aluminium alloy |
11/17/2004 | CN1175956C Leadfree SnZn-base alloy solder containing rare-earth elements |
11/17/2004 | CN1175955C Welding flux for welding golf club |
11/16/2004 | US6819004 Encapsulated with epoxy resin; fluid flow |
11/16/2004 | US6818861 Discharge electrode for a wire bonding apparatus |
11/16/2004 | US6818851 Break away fastening system |
11/16/2004 | US6818849 Apparatus and method for detecting abnormal balls |
11/16/2004 | US6818322 Surface treated steel sheet with less environmental impact for electronic components, excellent in solder wettability, a rust-proof property and a whisker-proof property |
11/16/2004 | US6818320 Welding method for welded members subjected to fluoride passivation treatment, fluoride passivation retreatment method, and welded parts |
11/16/2004 | US6817513 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method |
11/16/2004 | CA2262858C A high hardness and wear-resisting flux cored wire |
11/11/2004 | WO2004096484A2 Soldering material based on sn ag and cu |
11/11/2004 | WO2004096468A1 Composite rod and production method therefor and arc welding contact tip and resistance welding electrode comprising the composite rod |
11/11/2004 | US20040222206 Soldering iron tip and method of manufacturing same |
11/11/2004 | US20040222200 Brazed copper heat exchangers and process for manufacturing them by welding |
11/11/2004 | US20040221525 Method and apparatus for making a lid with an optically transmissive window |
11/11/2004 | US20040221449 Circuit board and method of manufacturing the same |
11/10/2004 | EP1475598A2 Heat exchange tube |
11/10/2004 | EP1475179A2 Electrode assembly for the removal of surface oxides by electron attachment |
11/10/2004 | EP1017747B1 Materials which can be thermally coated with a polymerizable component |
11/10/2004 | CN2654271Y Large diameter tubular wear resistant surfacing welding electrode |
11/10/2004 | CN1544199A Production method for unbroken core soft soldering welding wire |
11/10/2004 | CN1544198A Grain reinforced SnCu base composite solder ointment and preparation method thereof |
11/10/2004 | CN1544197A Low silver lead-free solder |
11/10/2004 | CN1544196A Mechanical alloying preparation method of ceramic grain reinforced composite solder |
11/10/2004 | CN1174934C Joining method for ceramic and metal and joined body of ceramics and metal joined by the method |
11/09/2004 | US6815635 Use of helium/nitrogen gas mixtures for laser welding tailored blanks |
11/09/2004 | US6815088 Copper preservative treatment |
11/09/2004 | US6815086 Methods for fluxless brazing |
11/09/2004 | US6814276 Process for soldering and connecting structure |
11/04/2004 | WO2004094678A2 Hardfacing alloy, methods, and products |
11/04/2004 | WO2004094097A1 Phase change lead-free super plastic solders |
11/04/2004 | WO2004071763A3 Method of producing metal composite materials comprising incompatible metals |
11/04/2004 | US20040217152 Lead-free solder paste for reflow soldering |
11/04/2004 | US20040217151 Method and apparatus for making a lid with an optically transmissive window |
11/04/2004 | DE10317056A1 Two-part welding electrode comprising a first part made from high quality alloy which contact the workpiece and a second part one side of which contacts the first part useful in spot welding |
11/04/2004 | DE10314876A1 Verfahren zum mehrstufigen Herstellen von Diffusionslötverbindungen für Leistungsbauteile mit Halbleiterchips A method for multistage manufacturing Diffusionslötverbindungen for power devices with semiconductor chips |
11/04/2004 | DE10017453B4 Verfahren zur Herstellung einer Schweiß- bzw. Lötverbindung A process for producing a welded or soldered joint |
11/03/2004 | EP1473109A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor device and heat sink junction |
11/03/2004 | EP1107846B1 Nickel-chromium-iron welding alloy |
11/03/2004 | CN1543385A 焊料组合物 Solder composition |
11/03/2004 | CN1541804A Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction |
11/03/2004 | CN1541803A High cellulose type electrode |
11/03/2004 | CN1174110C Welding method, filler metal composition and article made therefrom |
11/03/2004 | CN1173799C Components coated with aluminium-silicon alloy |
11/03/2004 | CN1173798C Wear-resistant tungsten carbide bead-welding material and welding rod |
11/02/2004 | US6813153 Polymer solder hybrid |
11/02/2004 | US6812570 Organic packages having low tin solder connections |
11/02/2004 | US6811892 For use with electronic/flip chip packaging; requires reflow temperatures compatible with circuit board assembly processes; improved reliability over eutectics under high temperature processing |
11/02/2004 | US6811821 Barrier coatings |
11/02/2004 | US6811725 Mixture of silicone anf head conductive fillers; electronic interface |
11/02/2004 | US6810573 Method for manufacturing fuel inlet |
11/01/2004 | CA2463645A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction |
10/28/2004 | WO2004079018A3 Adapter of chrome-nickel steel for weld connections and the method of its welding |
10/28/2004 | WO2004072331A3 Apparatus and method for highly controlled electrodeposition |
10/28/2004 | WO2004004958A3 Method for fault-free welding in the start/stop region |
10/28/2004 | US20040211675 Removal of surface oxides by electron attachment for wafer bumping applications |
10/28/2004 | US20040211291 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition |
10/27/2004 | EP1365882B1 High temperature aluminum alloy brazing sheet and methods of manufacturing and uses therefor |
10/27/2004 | EP1210204A4 Silver brazing flux and method of making |
10/27/2004 | CN1539592A Soldering flux in use for iron weldment |
10/27/2004 | CN1173371C Conductive formation and electronic equipment using such conductive formation |
10/27/2004 | CN1172769C High-cellulose welding electrode |
10/27/2004 | CN1172768C Iron electrodes for build-up welding |
10/27/2004 | CN1172767C Composite heat exchange pipe and its pipe plate welding method |
10/21/2004 | WO2004090288A2 Controller thermal expansion of welds to enhance toughness |
10/21/2004 | WO2004089573A1 Solder paste and printed board |
10/21/2004 | US20040209453 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
10/21/2004 | US20040209451 Solder deposition method and solder bump forming method |
10/21/2004 | US20040209105 Al or Al alloy substrate coupled to a carrier layer of uniform thickness composed of a copolymer of ethylene and methacrylic acid, maleic acid modified polyethylene, or ethylene-vinyl acetate copolymer filled with a fluoride or chloride flux having a particle size dimension of less than 5 mu m |
10/21/2004 | US20040208779 Lead-free alloy |
10/21/2004 | US20040206726 Hardfacing alloy, methods, and products |
10/20/2004 | EP1468778A2 Flux binder system |
10/20/2004 | EP1468777A1 Lead free solder |
10/20/2004 | EP1429884A4 Improved compositions, methods and devices for high temperature lead-free solder |
10/20/2004 | CN1172342C Electric switch with vacuum cavity and flexible connector |
10/19/2004 | US6805974 Coupling electroconductive pads |
10/14/2004 | WO2004088725A2 Method for the multi-stage production of diffusion soldered connections for power components comprising semiconductor chips |
10/14/2004 | WO2004087993A2 Method for producing pieces having a modified surface |
10/14/2004 | WO2004087366A1 Method for inert gas welding or inert gas soldering workpieces comprising identical or different metals or metal alloys by means of an additional zn/al metal |
10/14/2004 | WO2004058441A3 Method for arc welding of ductile cast iron |
10/14/2004 | US20040200888 Welding FIRST AND SECOND TITANIUM pieces together, by using a COPPER OR ZIRCONIUM material, heating to liquified, and DIFFUSED THOUGH WELDING FACES AND LEAVING NONE BETWEEN THEM, no interfaces at joints; alloying |
10/14/2004 | US20040200887 Method of fabricating a hollow mechanical part by diffusion welding and superplastic forming |
10/14/2004 | US20040200886 Tin antimony solder for MOSFET with TiNiAg back metal |
10/14/2004 | US20040200879 Thermal interface material and solder preforms |
10/14/2004 | US20040200820 Method and apparatus for welding |
10/14/2004 | DE202004010567U1 Welding material for joining aluminum workpieces consists mainly of aluminum and is heated by e.g. laser to produce welds without use of flux |
10/14/2004 | DE10314700A1 Verfahren zur Herstellung oberflächenmodifizierter Werkstücke Process for the preparation of surface-modified workpieces |
10/13/2004 | EP1467605A1 Process and apparatus for reflow soldering of electronic components limiting tilting phenomena (Manhattan effect) |
10/13/2004 | EP1466694A2 Method of forming a joint |
10/13/2004 | EP1466693A2 Method of joining ITM materials using a partially- or fully-transient liquid phase |