Patents for B23K 35 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting (23,588)
11/2004
11/18/2004US20040226982 Soldering iron tip and method of manufacturing same
11/18/2004US20040226981 Soldering iron tip and method of manufacturing same
11/18/2004US20040226831 Providing a substrate, electrodes that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy toand/or electrodes to generate electrons; contacting substrate with negatively charged reducing gas to reduce metal oxides
11/18/2004DE102004014703A1 Wärmeverteilermodul und Verfahren zur Herstellung desselben Heat spreader module and method of manufacturing the same
11/17/2004EP1194263B1 Process for the production of components coated with an aluminium-silicon alloy
11/17/2004CN1547518A Nonleaded solder alloy and electronic parts using it
11/17/2004CN1546275A Tungsten carbide - cobalt - copper based welding rod alloy and method for making same
11/17/2004CN1546274A Process for preparing electronic soft-soldering alloy
11/17/2004CN1546267A Welding method for ultra-thin composite layer low-carbon steel - austenitic stainless steel multiple tube adaptor
11/17/2004CN1175957C Corrosion proof fluoride welding agent containing magnesium-aluminium alloy
11/17/2004CN1175956C Leadfree SnZn-base alloy solder containing rare-earth elements
11/17/2004CN1175955C Welding flux for welding golf club
11/16/2004US6819004 Encapsulated with epoxy resin; fluid flow
11/16/2004US6818861 Discharge electrode for a wire bonding apparatus
11/16/2004US6818851 Break away fastening system
11/16/2004US6818849 Apparatus and method for detecting abnormal balls
11/16/2004US6818322 Surface treated steel sheet with less environmental impact for electronic components, excellent in solder wettability, a rust-proof property and a whisker-proof property
11/16/2004US6818320 Welding method for welded members subjected to fluoride passivation treatment, fluoride passivation retreatment method, and welded parts
11/16/2004US6817513 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method
11/16/2004CA2262858C A high hardness and wear-resisting flux cored wire
11/11/2004WO2004096484A2 Soldering material based on sn ag and cu
11/11/2004WO2004096468A1 Composite rod and production method therefor and arc welding contact tip and resistance welding electrode comprising the composite rod
11/11/2004US20040222206 Soldering iron tip and method of manufacturing same
11/11/2004US20040222200 Brazed copper heat exchangers and process for manufacturing them by welding
11/11/2004US20040221525 Method and apparatus for making a lid with an optically transmissive window
11/11/2004US20040221449 Circuit board and method of manufacturing the same
11/10/2004EP1475598A2 Heat exchange tube
11/10/2004EP1475179A2 Electrode assembly for the removal of surface oxides by electron attachment
11/10/2004EP1017747B1 Materials which can be thermally coated with a polymerizable component
11/10/2004CN2654271Y Large diameter tubular wear resistant surfacing welding electrode
11/10/2004CN1544199A Production method for unbroken core soft soldering welding wire
11/10/2004CN1544198A Grain reinforced SnCu base composite solder ointment and preparation method thereof
11/10/2004CN1544197A Low silver lead-free solder
11/10/2004CN1544196A Mechanical alloying preparation method of ceramic grain reinforced composite solder
11/10/2004CN1174934C Joining method for ceramic and metal and joined body of ceramics and metal joined by the method
11/09/2004US6815635 Use of helium/nitrogen gas mixtures for laser welding tailored blanks
11/09/2004US6815088 Copper preservative treatment
11/09/2004US6815086 Methods for fluxless brazing
11/09/2004US6814276 Process for soldering and connecting structure
11/04/2004WO2004094678A2 Hardfacing alloy, methods, and products
11/04/2004WO2004094097A1 Phase change lead-free super plastic solders
11/04/2004WO2004071763A3 Method of producing metal composite materials comprising incompatible metals
11/04/2004US20040217152 Lead-free solder paste for reflow soldering
11/04/2004US20040217151 Method and apparatus for making a lid with an optically transmissive window
11/04/2004DE10317056A1 Two-part welding electrode comprising a first part made from high quality alloy which contact the workpiece and a second part one side of which contacts the first part useful in spot welding
11/04/2004DE10314876A1 Verfahren zum mehrstufigen Herstellen von Diffusionslötverbindungen für Leistungsbauteile mit Halbleiterchips A method for multistage manufacturing Diffusionslötverbindungen for power devices with semiconductor chips
11/04/2004DE10017453B4 Verfahren zur Herstellung einer Schweiß- bzw. Lötverbindung A process for producing a welded or soldered joint
11/03/2004EP1473109A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor device and heat sink junction
11/03/2004EP1107846B1 Nickel-chromium-iron welding alloy
11/03/2004CN1543385A 焊料组合物 Solder composition
11/03/2004CN1541804A Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
11/03/2004CN1541803A High cellulose type electrode
11/03/2004CN1174110C Welding method, filler metal composition and article made therefrom
11/03/2004CN1173799C Components coated with aluminium-silicon alloy
11/03/2004CN1173798C Wear-resistant tungsten carbide bead-welding material and welding rod
11/02/2004US6813153 Polymer solder hybrid
11/02/2004US6812570 Organic packages having low tin solder connections
11/02/2004US6811892 For use with electronic/flip chip packaging; requires reflow temperatures compatible with circuit board assembly processes; improved reliability over eutectics under high temperature processing
11/02/2004US6811821 Barrier coatings
11/02/2004US6811725 Mixture of silicone anf head conductive fillers; electronic interface
11/02/2004US6810573 Method for manufacturing fuel inlet
11/01/2004CA2463645A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
10/2004
10/28/2004WO2004079018A3 Adapter of chrome-nickel steel for weld connections and the method of its welding
10/28/2004WO2004072331A3 Apparatus and method for highly controlled electrodeposition
10/28/2004WO2004004958A3 Method for fault-free welding in the start/stop region
10/28/2004US20040211675 Removal of surface oxides by electron attachment for wafer bumping applications
10/28/2004US20040211291 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition
10/27/2004EP1365882B1 High temperature aluminum alloy brazing sheet and methods of manufacturing and uses therefor
10/27/2004EP1210204A4 Silver brazing flux and method of making
10/27/2004CN1539592A Soldering flux in use for iron weldment
10/27/2004CN1173371C Conductive formation and electronic equipment using such conductive formation
10/27/2004CN1172769C High-cellulose welding electrode
10/27/2004CN1172768C Iron electrodes for build-up welding
10/27/2004CN1172767C Composite heat exchange pipe and its pipe plate welding method
10/21/2004WO2004090288A2 Controller thermal expansion of welds to enhance toughness
10/21/2004WO2004089573A1 Solder paste and printed board
10/21/2004US20040209453 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
10/21/2004US20040209451 Solder deposition method and solder bump forming method
10/21/2004US20040209105 Al or Al alloy substrate coupled to a carrier layer of uniform thickness composed of a copolymer of ethylene and methacrylic acid, maleic acid modified polyethylene, or ethylene-vinyl acetate copolymer filled with a fluoride or chloride flux having a particle size dimension of less than 5 mu m
10/21/2004US20040208779 Lead-free alloy
10/21/2004US20040206726 Hardfacing alloy, methods, and products
10/20/2004EP1468778A2 Flux binder system
10/20/2004EP1468777A1 Lead free solder
10/20/2004EP1429884A4 Improved compositions, methods and devices for high temperature lead-free solder
10/20/2004CN1172342C Electric switch with vacuum cavity and flexible connector
10/19/2004US6805974 Coupling electroconductive pads
10/14/2004WO2004088725A2 Method for the multi-stage production of diffusion soldered connections for power components comprising semiconductor chips
10/14/2004WO2004087993A2 Method for producing pieces having a modified surface
10/14/2004WO2004087366A1 Method for inert gas welding or inert gas soldering workpieces comprising identical or different metals or metal alloys by means of an additional zn/al metal
10/14/2004WO2004058441A3 Method for arc welding of ductile cast iron
10/14/2004US20040200888 Welding FIRST AND SECOND TITANIUM pieces together, by using a COPPER OR ZIRCONIUM material, heating to liquified, and DIFFUSED THOUGH WELDING FACES AND LEAVING NONE BETWEEN THEM, no interfaces at joints; alloying
10/14/2004US20040200887 Method of fabricating a hollow mechanical part by diffusion welding and superplastic forming
10/14/2004US20040200886 Tin antimony solder for MOSFET with TiNiAg back metal
10/14/2004US20040200879 Thermal interface material and solder preforms
10/14/2004US20040200820 Method and apparatus for welding
10/14/2004DE202004010567U1 Welding material for joining aluminum workpieces consists mainly of aluminum and is heated by e.g. laser to produce welds without use of flux
10/14/2004DE10314700A1 Verfahren zur Herstellung oberflächenmodifizierter Werkstücke Process for the preparation of surface-modified workpieces
10/13/2004EP1467605A1 Process and apparatus for reflow soldering of electronic components limiting tilting phenomena (Manhattan effect)
10/13/2004EP1466694A2 Method of forming a joint
10/13/2004EP1466693A2 Method of joining ITM materials using a partially- or fully-transient liquid phase