Patents for B23K 35 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting (23,588)
03/2003
03/04/2003US6527160 Method of producing metal composites which can be processed at high temperatures
03/04/2003US6527159 Surface mounting to an irregular surface
03/04/2003US6527041 Methods and apparatus for forming solder balls
02/2003
02/27/2003WO2003015979A1 Aluminium product having excellent brazing characteristics
02/27/2003US20030039811 Circuit board and production method thereof
02/27/2003US20030038166 Method for assembling parts made of materials based on sic by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method
02/27/2003US20030038165 Method for making an electroconductive joint
02/27/2003US20030038120 Method of butt-welding hot-rolled steel materials by laser beam and apparatus therefor
02/27/2003US20030037959 Bismaleimide- triazine copolymer and epoxy resin laminate having a plurality of solder pads on the surface and the solder pads contain no more than 20 weight % tin and has a reflow temperature of not greater than about 270 degree C.
02/26/2003EP1285719A1 Method for making wear-resistant surface layers using laser
02/26/2003EP1285717A2 Plating-free solid wire for MAG welding
02/26/2003CN1398698A Clean-free liquid flux
02/26/2003CN1398697A 无铅焊料 Lead-free solder
02/26/2003CN1398696A Lead-free solder
02/26/2003CN1398695A Aluminium welding tin wire
02/26/2003CN1398694A T91 steel welding process
02/25/2003US6524644 Process for selective deposition of OSP coating on copper, excluding deposition on gold
02/25/2003US6524398 Low-residue, low-solder-ball flux
02/25/2003US6523736 Methods and apparatus for forming solder balls
02/20/2003WO2003014405A1 Wrought aluminium-magnesium alloy product
02/20/2003WO2002070189A3 High temperature aluminum alloy brazing sheet and methods of manufacturing and uses therefor
02/20/2003US20030035975 Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method
02/20/2003US20030034382 Solder sheet with a bump grid array, process for manufacturing the solder sheet, and process for producing an electronic device using the sholder sheet
02/20/2003US20030034381 Packaging method using lead-free solder
02/19/2003CN1398212A Aluminium product with excellent brazing characteristics
02/18/2003US6521867 Flux-cored wire for gas-flow-shielded welding
02/18/2003US6521350 Application and manufacturing method for a ceramic to metal seal
02/18/2003US6521176 Tin, bismuth, silver
02/18/2003US6521108 Diffusion bonded sputter target assembly and method of making same
02/18/2003US6521060 Filler metal for tungsten-inert gas welding having sufficient hot workability for use as welding wire, ability to bend welded joint through 180 degrees, specified crack sensitivity index, producing weld having longer creep rupture time
02/18/2003US6520401 Diffusion bonding of gaps
02/18/2003CA2078178C Method of securing a conductor to a ceramic ptc
02/13/2003WO2003011984A2 Weldable coating compositions having improved intercoat adhesion
02/13/2003WO2002090031A3 Brazing sheet
02/13/2003WO2002039463A9 Methods and system for attaching substrates using solder structures
02/13/2003US20030029910 Joining of advanced materials by plastic deformation
02/13/2003US20030029908 Bumps made with adhesive film instead of gold plating
02/13/2003US20030029273 Method and apparatus for manufacturing minute metallic sphere
02/12/2003CN1396850A Method of linking steel tubes with aluminium ribs
02/12/2003CN1396039A Improved of solder
02/12/2003CN1396038A Al-alloy foil for soldering
02/11/2003US6518677 Semiconductor flip-chip package and method for the fabrication thereof
02/11/2003US6518534 Welding apparatus for forming chromium oxide passivated film at welded portion
02/11/2003US6518518 Resin substrate
02/11/2003US6518163 Method for forming bumps, semiconductor device, and solder paste
02/11/2003US6517602 Solder ball and method for producing same
02/06/2003US20030026724 Low temperature brazing; high strength, ductility
02/06/2003US20030026379 Joint construction of cobalt-based alloy
02/06/2003US20030024969 Phosphorus-copper base brazing alloy
02/06/2003US20030024965 Friction stir welding method and component part welded by the method
02/06/2003US20030024733 Lead-free solder, and connection lead and electrical component using said lead-free solder
02/05/2003CN1394978A Instantaneous liquid-phase diffusion welding iron base amorphous interlayer alloy
02/05/2003CN1394713A Winding drum solder wire and welding device and method thereof
02/05/2003CN1100889C Method for mfg. brazed assembling using brazed joint metal sheet containing aluminium alloy, and use of aluminium alloy
02/05/2003CN1100642C Weld repair process and articles repaired thereby
02/04/2003US6514846 Method of fabricating soldering balls for semiconductor encapsulation
02/04/2003US6513728 Thermal spray apparatus and method having a wire electrode with core of multiplex composite powder its method of manufacture and use
02/04/2003US6513702 Automatic wave soldering apparatus and method
02/03/2003WO2002042031A1 Layered heat-resistant alloy plate and method of producing the same
01/2003
01/30/2003WO2002040212A3 Brazing foil preforms and their use in the manufacture of heat exchangers
01/30/2003WO2001026165A9 Method and apparatus for forming buffer layers
01/30/2003US20030022058 Power generating method using seawater and power generating apparatus using the method
01/30/2003US20030021719 Zinc, bismuth, phosphorous, germanium and tin alloy
01/30/2003US20030021718 Lead-free solder alloy
01/30/2003US20030021717 Phosphorus-copper-antimony-tin brazing alloy
01/30/2003US20030020213 Device for producing spherical balls
01/30/2003US20030019915 Layer of a zinc-aluminum alloy is applied onto surface of the steel tube or the aluminum rib, and then a fluxing agent of cesium-aluminum tetrafluoride is deposited between the steel tube and the rib then heated to solder
01/30/2003US20030019856 Shielding gas mixture for MIG brazing
01/30/2003US20030019761 Immersing brazed nickel-base alloy components joined by nickel alloy brazing composition in electrolyte, applying potential at magnitude wherein nickel base alloy components are electrochemically passive and brazing alloy dissolves
01/29/2003EP1279461A2 Process and gas for laser treating materials
01/29/2003EP1279458A2 Friction stir welding method and component part welded by the method
01/29/2003EP1279450A1 Device for the production of spherical balls
01/29/2003EP1278631A2 Method of making reactive multilayer foil and resulting product
01/29/2003EP1151205A4 Improved weldable aluminum stud
01/29/2003CN1394362A Cell, cell production method, welded article production method and pedestal
01/29/2003CN1394359A Method for hermetic sealing of electronic parts
01/29/2003CN1394155A Alloy for solder and solder joint
01/28/2003US6512210 Ceramic heater
01/28/2003US6511759 Means and method for producing multi-element laminar structures
01/28/2003US6511524 Method and device for producing ball-shaped metallic particles at least almost equal in diameter
01/28/2003US6510984 Coded and electronically tagged welding wire
01/28/2003US6510977 Method and apparatus using laminated foils for placing conductive preforms
01/28/2003CA2150408C Azeotrope and azeotrope-like compositions of octamethyltrisiloxane
01/28/2003CA2142924C Steam-turbine power plant and steam turbine
01/28/2003CA2068583C A joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal
01/26/2003CA2393862A1 Device for producing spherical balls
01/23/2003WO2003007312A2 Thermal interface material and heat sink configuration
01/23/2003WO2003006200A1 Improvements in or relating to solders
01/23/2003WO2002102590A8 Ceramic to metal seal
01/23/2003US20030015575 Solder material and electric or electronic device in which the same is used
01/23/2003US20030015574 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate
01/23/2003US20030015572 Successive integration of multiple devices process and product
01/23/2003US20030015511 Copper-free wire
01/23/2003US20030015257 Flux essentially consists of, metal or ferroalloy containing atleast silicon, magnesium and aluminum acting as a deoxidizing agent and two or more components selected from chromium, nickel, molybdenum and niobium
01/23/2003US20030015220 Useful for preparing dilute hydrogen fluoride for fluxless soldering, to provide very dilute anhydrous hydrogen fluoride to effect surface modification of the parts to be soldered
01/22/2003EP1278404A1 Circuit board and production method thereof
01/22/2003EP1277539A1 "Ti-base wire rod for forming molten metal"
01/22/2003EP1277538A1 Flux-contained welding wire
01/22/2003EP1078109B1 Formable, high strength aluminium-magnesium alloy material for application in welded structures
01/22/2003CN1392817A Solder material and electric or electronic device in which same is used