Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1980
11/11/1980US4233112 Printed circuits
11/11/1980US4233111 Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant
11/11/1980US4233106 Automatic, continuous
11/11/1980US4233103 Bonding semiconductor die to substrate
11/11/1980US4232815 Integrated circuit lead coupling device and method
11/11/1980CA1089279A1 Multilayer photosensitive tonable element and process for image reproduction
11/04/1980US4232060 Catalysis nickel or cobalt alloys
11/04/1980US4232059 Process of defining film patterns on microelectronic substrates by air abrading
11/04/1980US4231916 Potting and encapsulating material for electronic circuits
11/04/1980US4231848 Method for making a raw board for use in printed circuits
11/04/1980US4231692 Drill comprised of hard metal for drilling contact holes in circuit boards and the like
11/04/1980US4231154 Electronic package assembly method
11/04/1980CA1089112A1 Method of forming a compact multi-level interconnection metallurgy system for semiconductor devices
11/04/1980CA1089043A1 Electrical jumper cable formed from a rigid metallic sheet
10/1980
10/30/1980WO1980002353A1 Treating multilayer printed wiring boards
10/30/1980WO1980002237A1 Method for distributing a uniform coating on a surface
10/29/1980EP0017979A1 Electrical network and method of manufacturing same
10/28/1980US4230794 Improving etch resistance of a casein-based photoresist
10/28/1980US4230793 Process for the production of solder masks for printed circuits
10/28/1980US4230788 Method of manufacturing an external electrically conducting metal pattern
10/28/1980US4230781 Method for making etch-resistant stencil with dichromate-sensitized alkali-caseinate coating
10/28/1980US4230553 Lamination, metals, dielectrics
10/28/1980US4230385 Printed circuit board, electrical connector and method of assembly
10/28/1980US4229879 Two-sided, photodegradation of resin
10/28/1980CA1088641A1 Articles with internal conductors and method of making such articles
10/21/1980US4229269 Spray cell for selective metal deposition or removal
10/21/1980US4229218 Self-monitoring electroless plating solution
10/21/1980US4228582 Automatic production system for printed-wiring boards
10/21/1980CA1088211A1 Circuit board having printed thereon conductive patterns to be connected with input and output lead wires of acoustic surface wave filter element
10/21/1980CA1088210A1 Substrate assembly for an electronic circuit having multilayered wirings, each comprising thin titanium and nickel base films for a wiring metal film
10/21/1980CA1088169A1 Lamp socket for printed circuit
10/21/1980CA1088168A1 Electrical connector for conneecting a flat multiple conductor cable to a printed circuit board
10/16/1980WO1980002222A1 A method for drysensitization of an insulating surface and a powder for use with the method
10/15/1980EP0017358A1 Electrical connector housing with a mounting peg
10/15/1980EP0017137A1 Compact transport apparatus for removal of material by ultrasonic assist
10/15/1980EP0016984A1 Method of mounting at least one electronic component
10/15/1980EP0016952A1 Method of making prints provided with masks
10/15/1980EP0016925A1 Method of depositing metal on metal patterns on dielectric substrates
10/14/1980US4228201 Method for rendering a non-platable semiconductor substrate platable
10/14/1980US4227983 Method for making carrier tape
10/14/1980US4227963 Chemical etching of polymers for metallizing utilizing an aqueous sulfuric-carboxylic acid etchant
10/14/1980US4227300 Dip soldering
10/14/1980CA1087599A1 Method of depositing a metal on a surface
10/07/1980US4227238 Mounting and electrical connection means for operation unit for electric devices
10/07/1980US4227162 Electromagnet relay with specific housing structure
10/07/1980US4227039 Thin-film microcircuit board
10/07/1980US4226659 Method for bonding flexible printed circuitry to rigid support plane
10/02/1980WO1980002010A1 Method of and device for continuously fabricating laminate
10/01/1980EP0016498A1 Starting mixture for a dielectric composition, silk-screening ink containing such mixture and use of this ink
10/01/1980EP0016368A1 Component mounting apparatus
10/01/1980EP0016307A1 Method of making a multi-layer glass-ceramic structure having copper-based internal conductors
10/01/1980EP0016306A1 Method of manufacturing a multi-layered glass-ceramic package for the mounting of semiconductor devices
10/01/1980EP0016251A1 Thin-film electronic circuit and method of manufacturing same
10/01/1980EP0016231A1 Method of making thick film fine patterns
10/01/1980EP0016230A1 Substrate for flexible printed circuits and method of fabricating the same, and film
09/1980
09/30/1980US4225633 Method of making a line-shaped opening in a coating on a plastics foil
09/30/1980US4224744 Circuitry for teaching soldering and practice circuit board for use therewith
09/30/1980CA1086864A1 Method of manufacturing an electrical device
09/23/1980US4224637 Leaded mounting and connector unit for an electronic device
09/23/1980US4224361 High temperature lift-off technique
09/23/1980US4223435 Circuit board with self-locking terminals
09/23/1980CA1086414A1 Junction boxes
09/23/1980CA1086023A1 Method of obtaining nickel coated filled epoxy resin article
09/17/1980EP0015655A1 Process for coating articles by electrodeposition, compositions for use in the process and coated articles
09/16/1980US4223321 Planar-faced electrode for ink jet printer and method of manufacture
09/16/1980CA1085984A1 Hermetic polymeric topsealant coating for electronic circuitry
09/16/1980CA1085962A1 Packaging assembly for electronic mechanism
09/16/1980CA1085941A1 Substrate with terminal connections and method of making the same
09/09/1980US4221925 Printed circuit board
09/09/1980US4221840 Hydroxy terminated 1,2-polybutadiene, a diisocyanate and styrene or vinyltoluene at the a-stage
09/09/1980US4221165 Printing machine having registering means
09/09/1980US4221047 Multilayered glass-ceramic substrate for mounting of semiconductor device
09/09/1980CA1085275A1 Soldering
09/09/1980CA1085212A1 Use of volatile carboxylic acids in improved photoresists containing quinone diazides
09/09/1980CA1085143A1 Machine for inserting multi-lead components sequentially
09/09/1980CA1085114A1 Method of making a multi-circuit electrical interconnector
09/04/1980WO1980001846A1 Contrast colorant for photopolymerizable compositions
09/03/1980EP0015100A1 Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
09/03/1980EP0015004A2 Dry-developing photosensitive dry film resist, a solder mask made thereof, and process for using the dry film resist
09/03/1980EP0014940A1 Component inserting apparatus
09/02/1980US4220945 Printed circuit substrate with resistance coat
09/02/1980US4220845 Flat cable soldering apparatus
09/02/1980US4220810 Printed wiring board
09/02/1980US4220707 Amine curing agent, reductive metal compound
09/02/1980US4220678 Dispersions for activating non-conductors for electroless plating
09/02/1980US4220491 Method for forming an accurately assembled laminate utilizing a vacuum holding press
09/02/1980CA1085062A1 Method of manufacturing electric resistors from metal sheets or films, and the resistors obtained thereby
09/02/1980CA1085059A1 Method of providing printed circuits
08/1980
08/26/1980US4219172 Holder for electronic and electrical parts
08/26/1980CA1084326A1 Substituted indolinium polymethine dyestuff sensitizer used with an organic photoconductor
08/20/1980EP0014558A1 Assembly of an electrical component and a heat sink on a printed circuit board and method of assembling
08/19/1980US4218532 Photolithographic technique for depositing thin films
08/19/1980US4218522 Battery mounting device
08/19/1980US4218283 Method for fabricating semiconductor device and etchant for polymer resin
08/12/1980US4217183 Maskless, exposure to energy beam
08/12/1980US4217182 Semi-additive process of manufacturing a printed circuit
08/12/1980US4216717 Screen printing apparatus
08/12/1980US4216576 Dielectric coating
08/06/1980EP0014119A1 Positioning of micro components, especially in thin and thick film circuits
08/06/1980EP0013728A1 Method for forming electrical connections between conducting layers in semiconductor structures