Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1979
07/31/1979US4162818 Interconnection for planar electronic circuits
07/31/1979CA1059648A1 Microelectronic circuit coating system
07/31/1979CA1059363A1 Method of electroless metal-plating
07/24/1979CA1059227A1 Heat-activated contacts and assembly on printed-circuit boards
07/17/1979US4161790 Programmable modular electronic register and method of implementing same
07/17/1979US4161064 Machines for board mounting and socket mounting components
07/17/1979CA1058457A1 Process for sensitizing surface of nonmetallic article for electroless deposition
07/11/1979EP0002884A1 Apparatus for soldering chips singly to a substrate providing a multiplicity of chip sites
07/11/1979EP0002795A2 Process for the fabrication of masks for lithographic processes using a photoresist
07/11/1979EP0002738A1 Method for applying a layer of a material to a surface of a platelike workpiece by means of a laser beam
07/11/1979EP0002725A1 Film forming composition for coating the pins of a module
07/10/1979US4160893 Individual chip joining machine
07/10/1979CA1058330A1 Process for depositing conductive layers on substrates
07/03/1979US4160210 Printed circuit impedance transformation network with an integral spark gap
07/03/1979US4160049 Bright electroless plating process producing two-layer nickel coatings on dielectric substrates
07/03/1979US4159921 Method of connecting an element having multiple terminals and a multi-lead flexible connector
07/03/1979CA1057763A1 Polymerisable esters
07/03/1979CA1057596A1 Catalyzing polymer for metal deposition with film of palladium or platinum complex
06/1979
06/27/1979EP0002496A1 Method and apparatus for aligning flat and thin workpieces
06/26/1979US4159508 Multilayer printed wiring board
06/26/1979US4159507 Stripline circuit requiring high dielectrical constant/high G-force resistance
06/26/1979US4159506 Mounting arrangement for chassis and printed circuit board with method of assembly
06/26/1979US4159505 Packaging assembly for electronic mechanism
06/26/1979US4159414 Method for forming electrically conductive paths
06/26/1979US4159222 Placing photoresist on substrate, applying lubricating wax, developing, laminating a dielectric
06/26/1979US4159176 Device for aligning a photomask on a printed circuit board
06/26/1979US4158987 Pressure foot for machine tool
06/26/1979CA1057134A1 Pneumatic system for solder leveling apparatus
06/19/1979US4158877 Connecting and supporting clamp for two adjacently situated printed circuit cards
06/19/1979US4158593 Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with selenium compounds
06/19/1979US4158592 Dissolution of metals utilizing a H2 O2 -sulfuric acid solution catalyzed with ketone compounds
06/19/1979CA1056761A1 Methods of providing contact between two members normally separable by an intervening member
06/19/1979CA1056701A1 Selectively stripping tin or tin lead alloys from copper substrates
06/12/1979US4158220 Printed circuit card construction
06/12/1979US4158218 Ceramic capacitor device
06/12/1979US4157936 Modifying powder comprising a petroleum resin
06/12/1979US4157932 Connecting method
06/12/1979CA1056189A1 Polymeric binders for aqueous processable photopolymer compositions
06/05/1979US4157407 Printed circuits
06/05/1979US4157284 Process to obtain conductive and resistive elements in microwave microcircuits
06/05/1979US4157261 Photoinitiator, chlorinated polyolefin binder
06/05/1979CA1056031A1 Layered strip connector
05/1979
05/30/1979EP0002105A1 Process for increasing the solubility rate ratio of a positive-working resist
05/30/1979EP0002040A1 Process for the application of soldering masks to printed circuits with through holes for contacting
05/29/1979CA1055327A Process for sensitizing hole walls in non-metallic articles for metallization
05/22/1979US4155826 Process for surface treating molded articles of fluorine resins
05/22/1979US4155815 Endless treads with clamping shoes that serves as masking means and electrical contacts
05/22/1979US4155801 Process for masking sheet metal for chemical milling
05/22/1979US4155775 Cleaning of high aspect ratio through holes in multilayer printed circuit boards
05/22/1979US4155321 Method for making an interconnection pin for multilayer printed circuit boards
05/22/1979CA1055164A1 Multilayer circuit board
05/22/1979CA1055134A1 Terminal lead construction for electrical circuit substrate
05/22/1979CA1054969A1 Coating aluminum with a strippable copper deposit
05/15/1979US4154869 Electroless plating method with inspection for an unbroken layer of water prior to plating
05/08/1979US4153531 Conveying means
05/08/1979US4153518 Electrodeposition
05/08/1979CA1054259A1 Printed circuit board carrying protective mask having improved adhesion
05/08/1979CA1053994A1 Sensitization of polyimide polymer for electroless metal deposition
05/08/1979CA1053866A1 Microcellular heterocyclic polymer structures
05/02/1979EP0001555A1 Housing containing a flat cable as cable harness for an internal wiring
05/01/1979US4152751 Photoflash unit with secured insulator
05/01/1979US4152477 Adhesive consisting of acrylonitrile-butadiene rubber and phenolic resin, etching to expose microcapsules, sensitizing, chemical metal plating
05/01/1979US4152467 Electroless copper plating process with dissolved oxygen maintained in bath
05/01/1979US4152282 Silk-screening dielectric paste for multilayer circuit fabrication comprising aluminum oxide and a borosilicate glass
05/01/1979US4152195 Polyamides, two-step cure
05/01/1979US4151945 Automated hybrid circuit board assembly apparatus
04/1979
04/24/1979US4151579 Chip capacitor device
04/24/1979US4151313 Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
04/24/1979US4150995 Vitreous enamel composition containing palladium powder
04/24/1979CA1053090A1 Resist reflow method for making submicron patterned resist masks
04/18/1979EP0001477A1 Method of manufacture of an electrical multi-contact connector
04/18/1979EP0001429A1 Process for forming thin film patterns by use of lift-off processing
04/17/1979US4150421 Multi-layer printed circuit board
04/17/1979US4150420 Electrical connector
04/17/1979US4150177 Method for selectively nickeling a layer of polymerized polyester resin
04/17/1979US4149764 Stacked printed circuit board assembly and contacts therefor
04/17/1979US4149665 Bonding machine for forming a solar array strip
04/17/1979US4149641 Component feed mechanism
04/17/1979CA1052912A1 Gang bonding interconnect tape for semiconductive devices and method of making same
04/17/1979CA1052671A1 Wax-flux composition containing alkylaryl sulfonic acid for soldering
04/17/1979CA1052665A1 Fluid agitation cleaning system
04/10/1979US4149219 Flexible printed circuit board assembly
04/10/1979US4149064 Method and apparatus for adjusting electrical networks consisting of synthetic foils
04/10/1979US4148945 Process of metal plating on plastics
04/10/1979CA1052493A1 Polymeric film adhesive for metal-clad sheeting
04/10/1979CA1052474A1 Method and apparatus for the production of conductor plates
04/10/1979CA1052056A1 Composition for sensitizing articles for metallization
04/04/1979EP0001254A1 Positively working light-sensitive composition comprising a halogenated naphthoquinone-diazide
04/03/1979US4147669 Conductive adhesive for providing electrical and thermal conductivity
04/03/1979US4147397 Electrical assembly in combination with printed circuit board
04/03/1979CA1051707A1 Photoresist film with non-photosensitive resist layer
03/1979
03/27/1979CA1051559A1 Process for the production of printed circuits with solder rejecting sub-zones
03/20/1979US4145460 Method of fabricating a printed circuit board with etched through holes
03/20/1979US4145390 Process for mounting components on a base by means of thixotropic material
03/20/1979US4144648 Connector
03/20/1979CA1050924A1 Electrodeposition of copper
03/13/1979US4144119 Sulfuric acid, hydrogen peroxide, molybdenum compound, phosphates, for printed circuits
03/13/1979US4144118 Deposition of copper layer, oxidation, etching, masking
03/13/1979CA1050665A1 Fail-safe printed circuit board connections
03/13/1979CA1050357A1 Process for the formation of real images and products produced thereby