Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1982
05/18/1982US4330778 Device for detecting broken filaments in lamps
05/18/1982US4330684 Matrix board
05/18/1982US4330612 Photoresists
05/18/1982US4330165 Press-contact type interconnectors
05/18/1982US4329779 Methods of applying circuit elements to a substrate
05/18/1982US4329776 Component inserting apparatus
05/18/1982CA1123920A1 Laser soldering apparatus
05/12/1982EP0051378A2 Circuit board having cast circuitry and method of manufacture
05/12/1982EP0051304A2 Method and apparatus to facilitate electronic circuit design, testing and manufacturing
05/12/1982EP0051174A2 Electrode for a plasma etchings plant
05/11/1982US4328614 Method for the manufacture of porcelain coated metal boards having interconnections between the top and bottom surfaces
05/11/1982US4328613 Connector lead insertion method
05/05/1982EP0050903A1 Process for manufacturing multilayer ceramic chip carrier modules
05/05/1982EP0050701A1 Equipment for desoldering electronic components from printed circuits
05/05/1982EP0050694A2 Entry material and method for drilling circuit boards
05/05/1982EP0050693A2 Backup material for use in drilling printed circuit boards
05/04/1982US4328531 Thick film multilayer substrate
05/04/1982US4328530 Multiple layer, ceramic carrier for high switching speed VLSI chips
05/04/1982US4328410 Laser skiving system
05/04/1982US4328298 Thin metal on chromium, development of photoresist, electroless plating
05/04/1982US4328266 Method for rendering non-platable substrates platable
05/04/1982US4328081 Sulfided nickel, tungsten catalyst
05/04/1982US4328048 Method of forming copper conductor
05/04/1982CA1123116A1 Multi-layered glass-ceramic substrate for mounting of semiconductor device
05/04/1982CA1123115A1 Multi-layered glass-ceramic structures having an internal distribution of copper-based conductors
05/04/1982CA1122856A1 Process for in-situ modification of solder composition
04/1982
04/29/1982WO1982001382A1 A powder for use in dry sensitization for electroless plating
04/28/1982EP0050415A1 Process for forming a pattern of transparent conductive material
04/27/1982US4327277 Method for laser soldering
04/27/1982US4327247 Printed wiring board
04/27/1982US4327170 Photopolymerizable unsaturated polyesters and copying material prepared therewith
04/27/1982US4327167 Method of producing printed circuit boards
04/27/1982US4327131 Method of coating a ceramic substrate
04/27/1982US4327126 Method of making printed circuit boards
04/27/1982US4327125 Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product
04/27/1982US4327124 Method for manufacturing printed circuits comprising printing conductive ink on dielectric surface
04/27/1982US4326929 Coating a photoresist overlay
04/27/1982CA1122462A1 Stabilizing a catalytic metal image for deposition of an electroless metal using a solution containing a reducing agent, a complexing agent and a cyanide complex of a group viii metal
04/22/1982EP0032153A4 Plating resist with improved resistance to extraneous plating.
04/21/1982EP0049882A1 A powder for dry sensitization for electroless plating and procedure for its manufacture
04/21/1982EP0049828A1 Device for the recognition of the pour point of plastics laminates during the production of multi-layer printed-circuit boards
04/20/1982US4326239 Printed circuit board
04/20/1982US4325992 Alkaline conditioning, acid fluoride etching
04/20/1982US4325991 Alkaline conidtioning, acid fluoride etching
04/20/1982US4325983 Catalytic promoters in electroless plating catalysts added prior to a colloidal nucleation process
04/20/1982US4325780 Method of making a printed circuit board
04/20/1982US4325771 Method of making a die-stamped circuit board assembly for photoflash devices
04/20/1982CA1122285A1 Electrical connector
04/20/1982CA1122183A1 Holder for a baseless lamp
04/15/1982WO1982001295A1 Method of mounting interrelated components
04/14/1982EP0049451A1 A process and apparatus to provide the application of glue on preselected zones of printed circuit boards
04/14/1982EP0049350A2 Green sheet support fixture speed and position control system for a screening machine
04/14/1982EP0049349A1 Mask cleaning apparatus and automatic multilayer ceramic screening machine incorporating same
04/13/1982US4324854 Deposition of metal films and clusters by reactions of compounds with low energy electrons on surfaces
04/13/1982US4324815 Forming thick films
04/13/1982US4324589 Colorimetric analysis of electroless plating solution
04/13/1982CA1121900A1 Electrical component mounting package
04/13/1982CA1121624A1 Removable stud retaining fastener
04/07/1982EP0049007A1 Method for the direct bonding of copper foils to oxide-ceramic substrates
04/07/1982EP0048945A2 Production of metal clad laminates
04/07/1982EP0048938A1 Vertically pluggable "single-in-line" circuit module without case
04/06/1982US4323659 Non-flammable adhesive compositions
04/06/1982US4323652 Starting mixture for a dielectric composition, screen printing paste having such a starting mixture, and product obtained
04/06/1982US4323632 Metal composites and laminates formed therefrom
04/06/1982US4323594 Colloidal dispersions for activating non-conductors prior to electroless plating
04/06/1982US4323593 Method of printing a spot pattern in a printed circuit board
04/06/1982US4323441 Apparatus for electroplating strip material without current leakage
04/06/1982US4323421 Thermosetting resins
04/06/1982US4323293 Terminal lead with labyrinthine clip
04/06/1982CA1121204A1 Photopolymerizable mixture containing a polyurethane with two terminal acrylic or methyacrylic acid ester groups
04/01/1982WO1982001015A1 Electroless alloy plating
03/1982
03/31/1982EP0048491A2 Process for producing a resin reinforced laminate
03/31/1982EP0048406A2 Heat dissipating printed-circuit board
03/31/1982EP0048380A1 Process for making ring zones in narrow boreholes by etching and/or electroplating
03/31/1982EP0048328A2 Sublimation patterning process
03/31/1982EP0048315A2 Process for preparing high temperature polyimide film laminates
03/30/1982US4322778 High performance semiconductor package assembly
03/30/1982US4322777 Circuit board formed with spark gap
03/30/1982US4322491 Mixture which is polymerizable by radiation, and radiation-sensitive copying material prepared therewith
03/30/1982US4322457 Method of selectively depositing a metal on a surface
03/30/1982US4321738 Apparatus and method for rework dressing of a chip site
03/30/1982CA1121011A1 Dendritic electrical contacts and connectors
03/30/1982CA1120763A1 Enhancement of resist development
03/30/1982CA1120656A1 Maskless method for electroless plating patterns
03/24/1982EP0047935A2 Printed-circuit board
03/24/1982EP0047827A1 Device for holding components on a circuit board
03/23/1982US4321423 Heat sink fastenings
03/23/1982US4321290 Process for coating a metal article on and at an edge
03/23/1982US4321285 Electroless plating
03/23/1982US4320572 Die-stamped circuit board assembly having relief means-method of making
03/23/1982CA1120611A1 Forming interconnections for multilevel interconnection metallurgy systems
03/23/1982CA1120602A1 Method of making conductive via holes in printed circuit boards
03/23/1982CA1120601A1 Thin film lossy line package
03/18/1982WO1982000938A1 Printed circuit and manufacturing process thereof
03/18/1982WO1982000937A1 Single layer burn-in tape for integrated circuit
03/17/1982EP0047469A2 Contact insertable in a metallised aperture in a printed-circuit board and method of inserting this contact
03/17/1982EP0047441A1 Apparatus for applying solder to printed circuits
03/17/1982EP0047252A1 Solder mask composition
03/16/1982US4320438 Multi-layer ceramic package
03/16/1982US4320272 Connector for attaching an electrical component to a flat sheet
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