| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 04/20/2011 | EP2311107A2 Semiconductor light emitting device and method for manufacturing the same |
| 04/20/2011 | EP2311106A2 Lithium or barium based film getters |
| 04/20/2011 | EP2311105A2 Light-emitting diode housing comprising fluoropolymer |
| 04/20/2011 | EP2311104A1 Conversion led |
| 04/20/2011 | EP2310175A1 A method for manufacturing a lens to be added to a led, and a lens obtained with that method |
| 04/20/2011 | EP2140504B1 Method for obtaining high-quality boundary for semiconductor devices fabricated on a partitioned substrate |
| 04/20/2011 | CN201804917U High-power and high-color-rendering LED |
| 04/20/2011 | CN201804916U Novel light emitting diode (LED) |
| 04/20/2011 | CN201804915U LED and LED support |
| 04/20/2011 | CN201804914U Aluminum substrate capable of effectively improving light efficiency for chip on board (COB) packaging |
| 04/20/2011 | CN201804913U Wafer-level light emitting diode (LED) packaging structure |
| 04/20/2011 | CN201804912U LED encapsulation structure with high heat-conducting property |
| 04/20/2011 | CN201804911U LED chip with ceramic substrate |
| 04/20/2011 | CN201804910U Moisture retardant type patch light emitting diode |
| 04/20/2011 | CN201804909U Light emitting diode (LED) bracket structure |
| 04/20/2011 | CN201804908U Encapsulating structure of LED |
| 04/20/2011 | CN201804907U High-power LED |
| 04/20/2011 | CN201804906U LED bracket disc strip |
| 04/20/2011 | CN201804905U Highlight and efficient LED |
| 04/20/2011 | CN201804904U High-light and high-efficiency LED |
| 04/20/2011 | CN201804903U LED circuit board with good heat dissipation performance |
| 04/20/2011 | CN201804902U Electrode of high-power LED |
| 04/20/2011 | CN201804901U Three-dimensional light emitting chip with multiple light emitting surfaces |
| 04/20/2011 | CN201804900U Automatic loading/unloading system for LED equipment |
| 04/20/2011 | CN201804899U Feeding system for LED die bonder or welding wire machine |
| 04/20/2011 | CN201804898U Positioning device of LED bracket |
| 04/20/2011 | CN201804897U LED bracket clamping and conveying device |
| 04/20/2011 | CN201804867U Light-emitting device consisting of inverted light-emitting unit array |
| 04/20/2011 | CN201804865U LED (light-emitting diode) integrated structure with cooling device |
| 04/20/2011 | CN201804862U Single three-chip LED particle |
| 04/20/2011 | CN201804861U White light LED package structure with high color rendering index |
| 04/20/2011 | CN201803228U LED integrated structure |
| 04/20/2011 | CN201803210U 半导体路灯 Semiconductor lights |
| 04/20/2011 | CN201803147U Microfluid cooled silicon wafer LED lighting system |
| 04/20/2011 | CN1906269B Fluorescent substance and light bulb color light emitting diode lamp using the fluorescent substance and emitting light bulb color light |
| 04/20/2011 | CN102027608A Light emitting device and a method of manufacturing the same |
| 04/20/2011 | CN102027607A LED package, lead frame and method for producing the same |
| 04/20/2011 | CN102027606A Semiconductor light-emitting device |
| 04/20/2011 | CN102027605A Device comprising a multilayer board and light-emitting diodes |
| 04/20/2011 | CN102027604A Light-emitting device and manufacturing method thereof |
| 04/20/2011 | CN102027285A Lead frame by wire binding method and LED power lamp using same |
| 04/20/2011 | CN102026935A Alumina ceramic |
| 04/20/2011 | CN102024898A LED (light-emitting diode) and manufacturing method thereof |
| 04/20/2011 | CN102024897A Wafer-level package structure of light emitting diode and manufacturing method thereof |
| 04/20/2011 | CN102024896A Light-emitting diode epitaxial wafer and manufacturing method thereof |
| 04/20/2011 | CN102024895A Light emitting device, system and package |
| 04/20/2011 | CN102024894A Light emitting device and light emitting device package |
| 04/20/2011 | CN102024893A Substrate and preparation method thereof, and LED chip with vertical structure and preparation method thereof |
| 04/20/2011 | CN102024892A Group iii nitride semiconductor light-emitting device |
| 04/20/2011 | CN102024891A Light-emitting element |
| 04/20/2011 | CN102024890A Light-emitting diode, light-emitting device, lighting apparatus, display, and signal light |
| 04/20/2011 | CN102024889A Light emitting device, light emitting device package and lighting system including the same |
| 04/20/2011 | CN102024888A Light-emitting diode and manufacturing method thereof |
| 04/20/2011 | CN102024887A Method for manufacturing aluminum-containing nitride intermediate layer, method for manufacturing nitride layer, and method for manufacturing nitride semiconductor element |
| 04/20/2011 | CN102024886A Method for processing wafer |
| 04/20/2011 | CN102024885A Nitride semiconductor light-emitting component |
| 04/20/2011 | CN102024884A 光电半导体装置 Optoelectronic semiconductor device |
| 04/20/2011 | CN102024883A Light-emitting diode radiating substrate and preparation method thereof |
| 04/20/2011 | CN102024882A LED device and manufacturing method thereof |
| 04/20/2011 | CN102024881A Light emitting diode |
| 04/20/2011 | CN102024853A Thinned photoelectric element structure and metalized transparent substrate thereof |
| 04/20/2011 | CN102024835A Light-emitting element |
| 04/20/2011 | CN102024805A Illumination device |
| 04/20/2011 | CN102024804A Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness |
| 04/20/2011 | CN102024717A Eutectic method and eutectic structure of semiconductor chip |
| 04/20/2011 | CN102024710A Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof |
| 04/20/2011 | CN102024389A LED display panel and LED display |
| 04/20/2011 | CN102023469A 投影机 Projector |
| 04/20/2011 | CN102023467A 投影机 Projector |
| 04/20/2011 | CN102022703A Electrode structure of LED (Light-Emitting Diode) lamp |
| 04/20/2011 | CN102022702A Protective circuit of luminescence module, light emitting diode wafer and alternating current light emitting diode |
| 04/20/2011 | CN102022630A Space isolation technology for LED and phosphor powder |
| 04/20/2011 | CN102022625A Led packaging structure |
| 04/20/2011 | CN102020961A High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate |
| 04/20/2011 | CN102020853A Composition for encapsulating optical semiconductor element |
| 04/20/2011 | CN102020852A Underfill composition and an optical semiconductor device |
| 04/20/2011 | CN102020851A Light conversion flexible high molecular material and application thereof |
| 04/20/2011 | CN101684917B Non-imaging optical directional light distribution method for LED lighting source |
| 04/20/2011 | CN101632181B Illumination system comprising a compound with low thermal expansion coefficient |
| 04/20/2011 | CN101523624B Semiconductor light emitting device |
| 04/20/2011 | CN101507004B Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die |
| 04/20/2011 | CN101501947B Semiconductor element and method for manufacturing same |
| 04/20/2011 | CN101499505B Semiconductor luminous element with thinning structure and its production method |
| 04/20/2011 | CN101494258B Light-emitting element, backlight module apparatus and lighting device |
| 04/20/2011 | CN101485002B Lighting device package with frame and optical transmission components |
| 04/20/2011 | CN101454911B Apparatus, system and method for use in mounting electronic elements |
| 04/20/2011 | CN101452837B Semiconductor element manufacture method |
| 04/20/2011 | CN101438427B Vehicle headlight |
| 04/20/2011 | CN101438422B Laser lift-off led with improved light extraction |
| 04/20/2011 | CN101438408B Composite LED modules |
| 04/20/2011 | CN101438406B Light-emitting device with inorganic housing |
| 04/20/2011 | CN101432897B Fluorescent lighting creating white light |
| 04/20/2011 | CN101432896B Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same |
| 04/20/2011 | CN101366127B Optical element, production method therefor, and composite component provided with an optical element |
| 04/20/2011 | CN101322254B Electronic parts packages and method for forming a cavity thereof |
| 04/20/2011 | CN101313417B Arrays of light emitting articles and method of manufacturing same |
| 04/20/2011 | CN101295753B Low temperature Au-In-Au bonding method for III-V family compounds |
| 04/20/2011 | CN101273472B Method for manufacturing semiconductor light-emitting device |
| 04/20/2011 | CN101271884B Luminous source encapsulation body |
| 04/19/2011 | US7929008 Line head and an image forming apparatus |