| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 03/31/2011 | US20110073870 Iii-nitride semiconductor light emitting device |
| 03/31/2011 | US20110073868 Electro-optical device and electronic apparatus |
| 03/31/2011 | US20110073867 Array substrate and manufacturing method thereof |
| 03/31/2011 | US20110073865 Display Device and Manufacturing Method Thereof |
| 03/31/2011 | US20110073864 Array substrate and manufacturing method |
| 03/31/2011 | US20110073862 Array structure and fabricating method thereof |
| 03/31/2011 | US20110073857 Semiconductor device, its manufacture method and template substrate |
| 03/31/2011 | US20110073855 Liquid crystal display panel and fabrication method thereof |
| 03/31/2011 | US20110073846 Organic electroluminescent element, method for manufacturing the organic electroluminescent element, and light emitting display device |
| 03/31/2011 | US20110073838 Ultraviolet light emitting diode with ac voltage operation |
| 03/31/2011 | US20110073837 High-performance single-crystalline n-type dopant-doped metal oxide nanowires for transparent thin film transistors and active matrix organic light-emitting diode displays |
| 03/31/2011 | DE102009055765A1 Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optical or optoelectronic component and method for its production |
| 03/31/2011 | DE102009051746A1 Optoelektronisches Bauelement Optoelectronic component |
| 03/31/2011 | DE102009047889A1 Optoelektronischer Halbleiterchip und Verfahren zum Anpassen einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for adjusting a contact structure for the electrical contacting of an optoelectronic semiconductor chip |
| 03/31/2011 | DE102009047888A1 Opto-electronic unit, has optical element designed as inorganic LED, organic LED, laser or sensor, and component made of silver or aluminum and enclosed with glass layer, where component is designed as layer or reflector |
| 03/31/2011 | DE102009047789A1 Mischlichtquelle Mixed light source |
| 03/31/2011 | DE102009042479A1 Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug Method for producing an arrangement with a component on a supporting substrate and assembly and methods of making a semi-finished and semi-finished |
| 03/31/2011 | DE102009042349A1 Semipolare wurtzitische Gruppe-III-Nitrid basierte Halbleiterschichten und darauf basierende Halbleiterbauelemente Semi-polar wurtzite-type group III nitride based semiconductor layers that form the basis semiconductor devices |
| 03/31/2011 | DE102009042205A1 Optoelektronisches Modul The optoelectronic module |
| 03/31/2011 | DE102004046850B4 Fahrzeugleuchte Vehicle light |
| 03/31/2011 | CA2774839A1 Encapsulated semiconductor nanoparticle-based materials |
| 03/31/2011 | CA2774838A1 Encapsulated semiconductor nanoparticle - based materials comprising an additive |
| 03/30/2011 | EP2302709A2 Light-emitting device |
| 03/30/2011 | EP2302708A2 Semiconductor light-emitting device and method for manufacturing same |
| 03/30/2011 | EP2302707A1 Led light assembly with active cooling |
| 03/30/2011 | EP2302706A1 Light emitting element driving circuit |
| 03/30/2011 | EP2302705A2 Supporting substrate for fabrication of semiconductor light emitting device and semiconductor light emitting device using the same |
| 03/30/2011 | EP2302704A2 Light emitting device and light emitting device package |
| 03/30/2011 | EP2302703A2 Method for manufacturing semiconductor light-emitting device and semiconductor light emitting device |
| 03/30/2011 | EP2302672A2 Semiconductor device with electrode pad and method for manufacturing same |
| 03/30/2011 | EP2302665A1 Pendeoepitaxial growth of gallium nitride layers on sapphire substrates |
| 03/30/2011 | EP2302108A1 Nanostructures and methods for manufacturing the same |
| 03/30/2011 | EP2301087A2 Light emitting diode with bonded semiconductor wavelength converter |
| 03/30/2011 | EP2301086A1 Light emitting device package, back-light unit, and liquid crystal display device using the same |
| 03/30/2011 | EP2301071A2 Light source with near field mixing |
| 03/30/2011 | EP2301054A1 Light emitting device |
| 03/30/2011 | EP1756876B1 High density led array |
| 03/30/2011 | EP1422975B9 Light-emitting diode based product |
| 03/30/2011 | CN201781723U Radiator with multiple radiating channels |
| 03/30/2011 | CN201780997U Heat radiating structure used in LED chip |
| 03/30/2011 | CN201780996U LED packaging structure |
| 03/30/2011 | CN201780995U Light emitting diode structure |
| 03/30/2011 | CN201780994U LED support |
| 03/30/2011 | CN201780993U Light emitting diode element with encircled wall on baseplate |
| 03/30/2011 | CN201780992U Packaging structure for serial flexible light-emitting diodes |
| 03/30/2011 | CN201780991U One-piece formed encapsulating structure for LED nixietube |
| 03/30/2011 | CN201780990U Light emitting diode packaging structure adopting secondary packaging |
| 03/30/2011 | CN201780989U Light-emitting diode |
| 03/30/2011 | CN201780988U LED microcavity structure suitable for special illumination |
| 03/30/2011 | CN201780987U Sapphire-based composite substrate for preparing nitride semiconductor epitaxy material |
| 03/30/2011 | CN201780986U Semi-transparent LED |
| 03/30/2011 | CN201780985U High-brightness light emitting diode |
| 03/30/2011 | CN201779522U LED lamp |
| 03/30/2011 | CN201779506U Semiconductor light source structure with improved heat diffusivity |
| 03/30/2011 | CN201779466U Three-dimensional luminous LED (light emitting diode) light source |
| 03/30/2011 | CN201776141U Heater for LED packaging adhesive reaction kettle |
| 03/30/2011 | CN101999179A Led with reduced electrode area |
| 03/30/2011 | CN101999178A Nitride semiconductor light-emitting device and method for fabrication thereof |
| 03/30/2011 | CN101999169A Broadband light emitting device lamps for providing white light output |
| 03/30/2011 | CN101999088A Optical communication module |
| 03/30/2011 | CN101998760A Heat-conducting copper-clad foil substrate |
| 03/30/2011 | CN101997079A Light-emitting device |
| 03/30/2011 | CN101997078A Substrate for light emitting device package and light emitting device package comprising the same |
| 03/30/2011 | CN101997077A Light emitting module |
| 03/30/2011 | CN101997076A Light emitting diode package |
| 03/30/2011 | CN101997075A Light emitting device and method of manufacturing light emitting device |
| 03/30/2011 | CN101997074A LED (Light Emitting Diode) surface patch type encapsulating structure based on silicon base plate and encapsulating method thereof |
| 03/30/2011 | CN101997073A Light emitting device and method for manufacturing same, lighting fixture, and lighting system |
| 03/30/2011 | CN101997072A Semiconductor light emitting device and method for manufacturing the same |
| 03/30/2011 | CN101997071A Substrate structures and methods of manufacturing the same |
| 03/30/2011 | CN101997070A High-reflection low-voltage inverted light-emitting diode and preparation method thereof |
| 03/30/2011 | CN101997069A Light emitting device and method for manufacturing same |
| 03/30/2011 | CN101997068A Method for preparing GaN base LED (Light Emitting Diode) |
| 03/30/2011 | CN101997067A Light emitting diode bracket structure |
| 03/30/2011 | CN101997066A High-power light-emitting diode (LED) package structure |
| 03/30/2011 | CN101997065A Packaging structure of light emitting diode |
| 03/30/2011 | CN101997064A Light-emitting diode (LED) |
| 03/30/2011 | CN101997063A Surface-mount light-emitting diode (LED) component, LED module and manufacturing methods thereof |
| 03/30/2011 | CN101997062A Manufacturing method of light-emitting diode (LED) circuit board |
| 03/30/2011 | CN101997061A Light-emitting diode structure and manufacturing method thereof |
| 03/30/2011 | CN101997024A 显示设备 Display device |
| 03/30/2011 | CN101997019A Light-emitting diode device and method of forming same |
| 03/30/2011 | CN101996987A Light emitting module |
| 03/30/2011 | CN101996986A White light-emitting diode packages with tunable colour temperature |
| 03/30/2011 | CN101996985A Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
| 03/30/2011 | CN101996984A Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof |
| 03/30/2011 | CN101996983A Light-emitting diode encapsulation structure and bracket structure |
| 03/30/2011 | CN101996961A Tourmaline chip |
| 03/30/2011 | CN101996915A Driving device and die bonder |
| 03/30/2011 | CN101996862A Nitride semiconductor free-standing substrate, method of manufacturing the same and nitride semiconductor device |
| 03/30/2011 | CN101995182A Uniform temperature plate and manufacturing method thereof |
| 03/30/2011 | CN101994988A Light flux controlling member, light emitting apparatus, surface light source apparatus and display apparatus |
| 03/30/2011 | CN101994925A Surface adhesion type light-emitting component structure and making method thereof |
| 03/30/2011 | CN101994923A Light-emitting diode (LED) module |
| 03/30/2011 | CN101994921A Light-emitting diode (LED) plane light source |
| 03/30/2011 | CN101994917A Quickly radiating high-power LED structure |
| 03/30/2011 | CN101993593A Composition for packaging optical semiconductor |
| 03/30/2011 | CN101993514A Polymer, optical component containing same and photoelectric device |
| 03/30/2011 | CN101993513A Packaging material composite and method for manufacturing packaging materials |
| 03/30/2011 | CN101719492B Encapsulating structure of light-emitting diode (LED) and encapsulating method thereof |