Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2011
05/18/2011CN102067339A Method for fabricating InGaAlN light-emitting diodes with a metal substrate
05/18/2011CN102067338A Semiconductor light-emitting devices for generating arbitrary color
05/18/2011CN102067337A Semiconductor light-emitting device with silicone protective layer
05/18/2011CN102067336A Light-emitting device based on strain-adjustable InGaAlN film
05/18/2011CN102067335A Method for fabricating InGaAlN light-emitting device on a combined substrate
05/18/2011CN102067334A Semiconductor light emitting device
05/18/2011CN102067298A Packaging structure and method for manufacturing packaging structure
05/18/2011CN102067296A Jig for aligning leadframe
05/18/2011CN102067286A Crystal growth process for nitride semiconductor, and method for manufacturing semiconductor device
05/18/2011CN102065674A Full-automatic LED (Light Emitting Diode) and components mounting and inserting all-in-one machine and running method thereof
05/18/2011CN102064274A High-power LED radiating system
05/18/2011CN102064273A Light-emitting diode (LED) and preparation method thereof
05/18/2011CN102064272A Light-emitting diode (LED) and preparation method thereof
05/18/2011CN102064271A Light emitting diode and production method
05/18/2011CN102064270A Feedback control method for glue dispenser
05/18/2011CN102064269A Method for forming fluorescent adhesive layer of light-emitting diode (LED)
05/18/2011CN102064268A Light-emitting diode packaging structure
05/18/2011CN102064267A Light emitting diode (LED) support unit for display screen, LED support and method for manufacturing LED support unit
05/18/2011CN102064266A Backboard for LED (light-emitting diode) chip and preparation method thereof
05/18/2011CN102064265A Semiconductor chip assembly with post/base heat spreader and substrate
05/18/2011CN102064264A Packaging method of LED (Light Emitting Diode)
05/18/2011CN102064263A Package structure and manufacturing process of ceramic substrate type light emitting diode
05/18/2011CN102064262A Light emitting device and light emitting device package
05/18/2011CN102064261A GaN (gallium nitride)-based light-emitting diode (LED) device structure with grid modulated vertical structure and preparation method thereof
05/18/2011CN102064260A Device structure of grid modulation positively-mounted structure GaN base light emitting diode and manufacturing method
05/18/2011CN102064259A Light emitting device including second conductive type semiconductor layer and method of manufacturing the light emitting device
05/18/2011CN102064258A Manufacturing method for surface roughening of GaN-based optoelectronic device
05/18/2011CN102064257A Sapphire patterned substrate and preparation method thereof
05/18/2011CN102064256A GaN blue light LED device using 3C-SiC-Si as substrate
05/18/2011CN102064255A LED (Light Emitting Diode) and manufacturing method thereof
05/18/2011CN102064254A High-quality gallium nitride light-emitting diode
05/18/2011CN102064253A Light-emitting diode and manufacture method thereof
05/18/2011CN102064252A LED (Light Emitting Diode) and manufacturing method thereof
05/18/2011CN102064251A High-power SiC substrate vertical structure light-emitting diode and preparation method thereof
05/18/2011CN102064250A Substrate-glaring SiC substrate vertical structure light-emitting tube and preparation method thereof
05/18/2011CN102064249A Manufacturing method of novel gallium nitride LED (light emitting diode) chip electrode structure
05/18/2011CN102064248A High-power LED chip packaging method
05/18/2011CN102064247A Packaging method and packaging structure for embedded light emitting diode
05/18/2011CN102064246A Light emitting device and method for manufacturing the same
05/18/2011CN102064245A Method for manufacturing light-emitting diode
05/18/2011CN102064244A Layered encapsulating method of high-power LED (Light-Emitting Diode)
05/18/2011CN102064243A LED encapsulation method, LED and LED illumination device
05/18/2011CN102064242A Method for manufacturing high-extraction efficiency gallium nitride light-emitting diode
05/18/2011CN102064241A Lens-free LED lamp and encapsulation method thereof
05/18/2011CN102064240A Encapsulation process of white-light LED (Light-Emitting Diode) light source module
05/18/2011CN102064186A Semiconductor structure and forming method thereof
05/18/2011CN102064172A Light-emitting diode packaging structure
05/18/2011CN102064171A Light-emitting diode (LED) device
05/18/2011CN102064170A White LED chip and preparation method thereof
05/18/2011CN102064169A Single-chip white-light LED and preparation method thereof
05/18/2011CN102064168A Electroluminescent/photoinduced mixed white LED chip and manufacturing method
05/18/2011CN102064167A Helical packaging structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof
05/18/2011CN102064166A Curved surface package structure of light-emitting semiconductor chip and light-emitting semiconductor light source device thereof
05/18/2011CN102064165A Novel LED (Light Emitting Diode) device
05/18/2011CN102064164A Freely combined lamp wick of flip-chip power LED tube core
05/18/2011CN102064113A No-wire bonding packaging method and finished products of power semiconductor chip
05/18/2011CN102064091A Nitride semiconductor component and method for the production thereof
05/18/2011CN102064088A Method for preparing sapphire-graph substrate by dry method and wet method
05/18/2011CN102063013A Method for manufacturing patterning substrate by nano-microspheres
05/18/2011CN102063000A Projector device, multilayer light-emitting diode device, and reflective light-emitting diode unit
05/18/2011CN102062983A Electrochromic rearview mirror assembly incorporating a display/signal light
05/18/2011CN102062346A Light-emitting module
05/18/2011CN102062312A 半导体发光结构以及半导体光源 The semiconductor light emitting structure and the semiconductor light source
05/18/2011CN102061173A Led fluorescent powder and preparation method thereof
05/18/2011CN102061171A Red nitride fluorescent powder for light-emitting diodes and preparation method thereof
05/18/2011CN102061169A Garnet monocrystal fluorescent material for white light LEDs (light emitting diodes) and preparation method thereof
05/18/2011CN102060963A Light-curable material for manufacturing LED (Light Emitting Diode) lens
05/18/2011CN101789424B LED circuit board fixedly connected by overbridge board
05/18/2011CN101710604B High-brightness superradiation light-emitting diode
05/18/2011CN101707220B PN junction array device arranged in plane manner
05/18/2011CN101660677B Lighting apparatus having light emitting diodes for light source
05/18/2011CN101641803B 发光装置 Light-emitting device
05/18/2011CN101641790B Compound semiconductor laminate, process for producing the compound semiconductor laminate, and semiconductor device
05/18/2011CN101629705B Encapsulating structure of LED element and manufacturing method thereof
05/18/2011CN101626054B Aspherical wide irradiation-angle optical lens and light-emitting diode (LED) component formed by same
05/18/2011CN101622689B Wide-bandgap semiconductor devices and the device manufacture method
05/18/2011CN101619812B 发光二极管 Led
05/18/2011CN101582478B Multi-quantum-well structure used in photoelectron device and manufacturing method thereof
05/18/2011CN101569020B Light-emitting apparatus with shaped wavelength converter
05/18/2011CN101562226B Gan-based semiconductor light-emitting element, driving method thereof, light-emitting element assembly, light-emitting apparatus and image display apparatus
05/18/2011CN101504123B Lens used for LED indoor lamp and grille lamp comprising the same
05/18/2011CN101449396B Process for preparing a semiconductor light-emitting device for mounting
05/18/2011CN101447645B Method for manufacturing semiconductor device
05/18/2011CN101436635B Light-emitting device and its manufacture method
05/18/2011CN101410997B Submount and its manufacturing method
05/18/2011CN101356214B Thermally stable transparent silicone resin compositions and methods for their preparation and use
05/18/2011CN101231975B Chip packaging body and method of manufacturing the same
05/18/2011CN101217175B A structure of semiconductor luminous device with wide spectrum photo-emission function and its manufacture method
05/18/2011CN101051444B Driving apparatus of light emitting diode and liquid crystal display using the same
05/18/2011CN101030617B Light emitting device package and method of fabricating the same
05/17/2011US7944142 Light-emitting device with improved brightness control and narrow frame and electronic apparatus with the light-emitting device
05/17/2011US7943964 AlxGayIn1−x−yN crystal substrate, semiconductor device, and method of manufacturing the same
05/17/2011US7943963 Organic light-emitting display device
05/17/2011US7943954 LED fabrication via ion implant isolation
05/17/2011US7943953 Light emitting device and light emitting module
05/17/2011US7943952 Method of uniform phosphor chip coating and LED package fabricated using method
05/17/2011US7943951 Light emitting device package
05/17/2011US7943950 Structured substrate for a LED
05/17/2011US7943949 III-nitride based on semiconductor device with low-resistance ohmic contacts
05/17/2011US7943948 High efficient phosphor-converted light emitting diode