Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
07/2011
07/20/2011CN102130282A Packaging structure and packaging method for white LED (light-emitting diode)
07/20/2011CN102130281A Light emitting diode package
07/20/2011CN102130280A LED (Light Emitting Diode) package solder joint structure and process
07/20/2011CN102130279A LED device with improved LED color rendering index (CRI) and manufacturing method thereof
07/20/2011CN102130278A Package of light emitting diode
07/20/2011CN102130277A Light-emitting diode package
07/20/2011CN102130276A Light emitting device and manufacturing method therefor
07/20/2011CN102130275A High-power light emitting diode encapsulation structure and encapsulation method
07/20/2011CN102130274A White LED light source for transparent fluorescent ceramic package
07/20/2011CN102130273A Light emitting diode packaging structure
07/20/2011CN102130272A Light emitting device package and light unit having the same
07/20/2011CN102130271A LED (light-emitting diode) chip packaging structure and white light LED light-emitting device
07/20/2011CN102130270A White LED luminous device
07/20/2011CN102130269A Solid-state luminous element and light source module
07/20/2011CN102130268A Solid-state light-emitting component and light source module
07/20/2011CN102130267A Encapsulation structure for light-emitting diode
07/20/2011CN102130266A Packaging structure and light emitting diode packaging structure
07/20/2011CN102130265A Light emitting device, light emitting device package and method for fabricating the same
07/20/2011CN102130264A Light-emitting element, manufacturing method thereof and light-emitting method
07/20/2011CN102130263A Light emitting element as well as manufacturing method and light emitting method thereof
07/20/2011CN102130262A Luminous element and manufacturing method and luminous method thereof
07/20/2011CN102130261A Semiconductor light-emitting element with protection layer
07/20/2011CN102130260A Luminous device and manufacturing method thereof
07/20/2011CN102130259A Composite electrode of light-emitting diode chip and manufacturing methods thereof
07/20/2011CN102130258A Light emitting device, light emitting device package and illumination system
07/20/2011CN102130257A Light emitting device, light emitting device package, and lighting system
07/20/2011CN102130256A 发光二极管及其制造方法 The method of manufacturing a light emitting diode and
07/20/2011CN102130255A Light-emitting diode (LED), light emitting device and LED manufacturing method
07/20/2011CN102130254A Light emitting device and manufacturing method thereof
07/20/2011CN102130253A LED crystal plate with high light-emitting efficiency and manufacturing method thereof
07/20/2011CN102130252A 发光二极管及其制造方法 The method of manufacturing a light emitting diode and
07/20/2011CN102130251A Light emitting diode (LED) and manufacturing method thereof
07/20/2011CN102130250A Light emitting diode (LED) and manufacturing method thereof
07/20/2011CN102130249A Super-luminance light-emitting diode and manufacturing method thereof
07/20/2011CN102130248A Light emitting device and manufacturing method thereof
07/20/2011CN102130247A Light emitting diode chip and package incorporating the same
07/20/2011CN102130246A Multiple quantum well (MQW) structure, light-emitting diode (LED) and LED package
07/20/2011CN102130245A Light emitting diode and manufacturing method thereof
07/20/2011CN102130244A LED (light-emitting diode) radiating substrate based on diamond film and manufacturing method thereof
07/20/2011CN102130243A Led device, manufacturing method and semiconductor device thereof
07/20/2011CN102130242A Single-color LED (light-emitting diode) chip and method for forming single-color LED chip
07/20/2011CN102130241A Light emitting diode array structure and manufacturing method thereof
07/20/2011CN102130240A Metal bracket LED chip packaging process
07/20/2011CN102130239A Omnibearing lighting LED (light-emitting diode) packaging method and LED packaging part
07/20/2011CN102130238A Method for cutting sapphire substrate LED chip
07/20/2011CN102130237A Method for cutting sapphire substrate LED chip
07/20/2011CN102130236A Packaging method of LED (light-emitting diode) chip and packaging device
07/20/2011CN102130235A Method and device for packaging LED chip
07/20/2011CN102130234A Fabricating method of semiconductor device
07/20/2011CN102130233A Method for spraying fluorescent powder on LED (light-emitting diode) reflection cup
07/20/2011CN102130232A Luminous chip package and method for packaging luminous chip
07/20/2011CN102130231A Process for manufacturing high-power LED radiator
07/20/2011CN102130230A Method for preparing light emitting diode
07/20/2011CN102130229A Method for improving electroluminescent performance of n-ZnO/AlN/p-GaN heterojunction light-emitting diode
07/20/2011CN102130228A LED bonding wire heating mold
07/20/2011CN102130227A Fluorescent powder coating process for LED optical lens and encapsulation process for white light LED with optical lens
07/20/2011CN102130226A Light emitting device and method of manufacture
07/20/2011CN102130225A Packaging method for improving light efficiency of integrated LED light source
07/20/2011CN102130224A Light-emitting diode and manufacturing method thereof
07/20/2011CN102130223A Method for coarsening surface of GaN-based LED epitaxial wafer
07/20/2011CN102130222A Manufacturing method of optical device
07/20/2011CN102130221A Method for forming light emitting diode
07/20/2011CN102130220A Photoelectric semiconductor device and manufacturing method thereof
07/20/2011CN102130144A White LED chip and forming method thereof
07/20/2011CN102130143A White LED chip and forming method thereof
07/20/2011CN102130115A White LED (light emitting diode) planar light source device
07/20/2011CN102130114A Surface mounted device (SMD) type light emitting diode (LED) device for outdoor display screen and display module using SMD type LED device
07/20/2011CN102130113A Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
07/20/2011CN102130112A LED (light-emitting diode) support, LED lamp with support and packaging method
07/20/2011CN102130111A Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device
07/20/2011CN102130110A Multi-chipset high-power LED encapsulation structure
07/20/2011CN102130109A Light emitting device and light unit using the same
07/20/2011CN102130108A Transparent ceramic packaged light emitting diode (LED) light source
07/20/2011CN102130107A Step array high-voltage light-emitting diode and preparation method thereof
07/20/2011CN102130105A Light emitting device and light unit using the same
07/20/2011CN102130104A Light emitting device and method of manufacture
07/20/2011CN102130084A Semiconductor chip assembly with a post/base heat spreader and a signal post
07/20/2011CN102130071A Chip package and fabrication method thereof
07/20/2011CN102130068A Alloy-type bonding wire with composite plating on surface
07/20/2011CN102130051A Light-emitting diode and manufacturing method thereof
07/20/2011CN102130017A Manufacturing method for composite substrate
07/20/2011CN102129820A Light-emitting diode device and display
07/20/2011CN102129817A Display panel, manufacturing method thereof and display apparatus
07/20/2011CN102127721A Aluminum alloy material and preparation method of aluminum alloy back plate
07/20/2011CN102127442A Zirconium phosphate-based luminescent material as well as preparation method and application thereof
07/20/2011CN102127436A Mixed fluorescent powder and preparation method of white light LED
07/20/2011CN102127429A Europium and manganese codoped and activated blue-green fluorescent powder and preparation method thereof
07/20/2011CN102127299A Composition for thermosetting silicone resin
07/20/2011CN101777610B Method for fast tuning angle of LED chip
07/20/2011CN101771113B Multi-unit synthesis type reflector based method for manufacturing power type light emitting diode
07/20/2011CN101728288B Direct die attach utilizing heated bond head
07/20/2011CN101702401B Preparation and batch processed encapsulation method of GaN-based LED thin film device
07/20/2011CN101685027B Dial module and meter employing the same
07/20/2011CN101682167B Optical communications module, process for manufacturing the same, and optical transmitter and receiver apparatus
07/20/2011CN101676616B Plane Fresnel LED optical lens and LED assembly thereof
07/20/2011CN101645467B Photoelectric transducering element
07/20/2011CN101572285B Light-emitting device packageing and method for fabricating the same
07/20/2011CN101533882B fluorescent powder prefabricated film for white light LED and preparation method thereof
07/20/2011CN101485003B Light emitting diode drive circuit
07/20/2011CN101409315B Upside-down mounting LED chip
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