| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 08/17/2011 | CN201936553U Led显示板及led显示器 Led display board and led display |
| 08/17/2011 | CN201936552U 与夜视系统兼容的发光显示器 Compatible with the night vision system light-emitting display |
| 08/17/2011 | CN201934930U 一种led灯泡 One kind of led bulb |
| 08/17/2011 | CN201930901U 一种平板支架点胶用模具 A flat bracket Dispensing with mold |
| 08/17/2011 | CN102160203A Lighting module |
| 08/17/2011 | CN102160202A Optical disk for lighting module |
| 08/17/2011 | CN102160201A Optical cup for lighting module |
| 08/17/2011 | CN102160200A Housing for an optoelectronic component |
| 08/17/2011 | CN102160199A Light-emitting element |
| 08/17/2011 | CN102160198A Lighting module |
| 08/17/2011 | CN102160197A Optoelectronic device submount |
| 08/17/2011 | CN102159647A Liquid die bonding agent |
| 08/17/2011 | CN102157671A Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 08/17/2011 | CN102157670A Light-emitting device |
| 08/17/2011 | CN102157669A Device including a textured substrate and method of fabricating a semiconductor device |
| 08/17/2011 | CN102157668A Fluorescent powder packaging structure of light-emitting diode and packaging method thereof |
| 08/17/2011 | CN102157667A Novel packaging method capable of controlling light-emitting colors of LED (light-emitting diode) and device thereof |
| 08/17/2011 | CN102157666A A method for manufacturing film pasted white light digital tube and film pasted white light digital tube |
| 08/17/2011 | CN102157665A Light-emitting diode (LED) chip packaging structure and packaging method thereof |
| 08/17/2011 | CN102157664A LED (light-emitting diode) lamp panel adopting sputtering circuit and production method thereof |
| 08/17/2011 | CN102157663A Vertical led chip package on tsv carrier |
| 08/17/2011 | CN102157662A Light-emitting devices with through-substrate via connections |
| 08/17/2011 | CN102157661A Light-emitting diode encapsulation structure and manufacturing method thereof |
| 08/17/2011 | CN102157660A Semiconductor encapsulation structure |
| 08/17/2011 | CN102157659A PLED (polymer light-emitting diode) device prepared by all-wet method and preparation method thereof |
| 08/17/2011 | CN102157658A Light emitting device and light emitting device package |
| 08/17/2011 | CN102157657A GaN-based light emitting diode and preparation method thereof |
| 08/17/2011 | CN102157656A Nitride light-emitting diode capable of enhancing carrier injection efficiency and manufacturing method thereof |
| 08/17/2011 | CN102157655A Strontium titanate/P-type silicon heterojunction-based electroluminescent device and preparation method thereof |
| 08/17/2011 | CN102157654A Inverted mounting LED chip based on double-faced shrinkage pool substrate and component gradual change buffer layer |
| 08/17/2011 | CN102157653A Light emitting diode and method of manufacturing the same |
| 08/17/2011 | CN102157652A Method for improving light emitting efficiency of light-emitting diode |
| 08/17/2011 | CN102157651A Light emitting device, method of manufacturing light emitting device, light emitting device package, and lighting system |
| 08/17/2011 | CN102157650A Method for manufacturing gallium nitride (GaN)-based light-emitting diode (LED) with vertical structure |
| 08/17/2011 | CN102157649A Gallium nitride light-emitting diode (GaN LED) chip with vertical structure and manufacturing method thereof |
| 08/17/2011 | CN102157648A Semiconductor light emitting device |
| 08/17/2011 | CN102157647A Nitride LED structure and preparation method thereof |
| 08/17/2011 | CN102157646A Nitride LED structure and preparation method thereof |
| 08/17/2011 | CN102157645A Light emitting diode and preparation method thereof |
| 08/17/2011 | CN102157644A Led having vertical structure and method for fabricating the same |
| 08/17/2011 | CN102157643A Method for preparing GaN-based photonic crystal LED based on nanoimprint lithography |
| 08/17/2011 | CN102157642A Nanoimprint based preparation method of LED with high light-emitting efficiency |
| 08/17/2011 | CN102157641A Method for manufacture LED (light-emitting diode) chip |
| 08/17/2011 | CN102157640A Method for manufacturing gallium nitride (GaN)-based light-emitting diode (LED) chip with p-GaN layer subjected to surface roughening |
| 08/17/2011 | CN102157639A LED (Light-Emitting Diode) chip and preparation method thereof |
| 08/17/2011 | CN102157638A Method for preparing substrate for epitaxial growth of GaN |
| 08/17/2011 | CN102157637A Method for roughening surface colloid of light-emitting device |
| 08/17/2011 | CN102157636A method for strengthening silicon-based thin film electroluminescence |
| 08/17/2011 | CN102157635A Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
| 08/17/2011 | CN102157634A Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| 08/17/2011 | CN102157633A Separation method of LED (light emitting diode) epitaxy chip |
| 08/17/2011 | CN102157632A Method for improving luminous efficiency of LED (light-emitting diode) by utilizing ZnO nano-cone array |
| 08/17/2011 | CN102157631A Method for forming semiconductor layer and method for manufacturing light emitting device |
| 08/17/2011 | CN102157630A Single-substrate multi-chipset high-power LED (Light-Emitting Diode) encapsulation one-step bonding method |
| 08/17/2011 | CN102157629A Method for manufacturing graphical sapphire substrate |
| 08/17/2011 | CN102157508A Novel LED packaging light-reflecting method and device |
| 08/17/2011 | CN102157507A White LED integration module with adjustable color temperature and color rendering indexes |
| 08/17/2011 | CN102157506A Light emitting device |
| 08/17/2011 | CN102157505A Light-emitting module |
| 08/17/2011 | CN102157504A Light emitting diode package and light unit having the same |
| 08/17/2011 | CN102157503A Light-emitting diode structure capable of emitting light and enhancing heat radiation efficiency and LED (light-emitting diode) lamp |
| 08/17/2011 | CN102157467A Cooling heat-dissipation system and cooling device thereof |
| 08/17/2011 | CN102155673A LED (Light Emitting Diode) backlight source |
| 08/17/2011 | CN102154689A Vapor deposition system, method of manufacturing light emitting device and light emitting device |
| 08/17/2011 | CN102154010A Photo-enhancement photoluminescence material as well as preparation method and application thereof |
| 08/17/2011 | CN102154008A Red fluorescent material and preparation method thereof |
| 08/17/2011 | CN102154006A Phosphor, light emitting device and white light emitting diode |
| 08/17/2011 | CN102154002A Method for manufacturing phosphor and light emitting device comprising the phosphor |
| 08/17/2011 | CN102153865A Organic silicon material for packaging high-power light-emitting diode |
| 08/17/2011 | CN102153863A Resin composition for encapsulating optical semiconductor element and optical semiconductor device |
| 08/17/2011 | CN102153576A Rare earth complex coated with silicon dioxide and preparation method of rare earth complex |
| 08/17/2011 | CN101888740B Convex metal printed circuit board and manufacturing method thereof |
| 08/17/2011 | CN101847652B Electroluminescent display panel |
| 08/17/2011 | CN101673789B Light emitting diode package substrate structure, manufacturing method thereof and packaging structure thereof |
| 08/17/2011 | CN101621105B LED flip chip integration encapsulation method and LED encapsulated by same |
| 08/17/2011 | CN101559629B Coaxial image system applied to LED laser cutting device |
| 08/17/2011 | CN101486854B Ink composition of optical color conversion film and preparation thereof |
| 08/17/2011 | CN101477982B Photoconverter, manufacturing process thereof, and LED |
| 08/17/2011 | CN101466795B Curable organopolysiloxane composition and semiconductor device |
| 08/17/2011 | CN101438426B LED package with converging optical element |
| 08/17/2011 | CN101427295B Driver for controlling light emitting polymer and method thereof |
| 08/17/2011 | CN101350383B Method for packaging high-power white light LED |
| 08/17/2011 | CN101313415B Light-emitting device and its manufacture method |
| 08/17/2011 | CN101312227B Heat dissipation method and apparatus for LED |
| 08/17/2011 | CN101276861B Led |
| 08/16/2011 | US8000364 Nitride semiconductor light emitting device and method of manufacturing the same |
| 08/16/2011 | US7999785 Light-source module for display device and display device having the same |
| 08/16/2011 | US7999456 White light emitting diode with yellow, green and red light emitting phosphor |
| 08/16/2011 | US7999450 Electroluminescent module with thermal-conducting carrier substrate |
| 08/16/2011 | US7999398 Solid state device |
| 08/16/2011 | US7999283 Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
| 08/16/2011 | US7999282 Semiconductor light emitting device |
| 08/16/2011 | US7999281 Optical semiconductor device and method of manufacturing optical semiconductor device |
| 08/16/2011 | US7999280 Light emitting diode package employing lead terminal with reflecting surface |
| 08/16/2011 | US7999279 GaN compound semiconductor light emitting element and method of manufacturing the same |
| 08/16/2011 | US7999278 Light emitting diode package |
| 08/16/2011 | US7999277 Light emitting device and production method of same |
| 08/16/2011 | US7999276 Chip-type LED package and light emitting apparatus having the same |
| 08/16/2011 | US7999275 Composite semiconductor device, LED head that employs the composite semiconductor device, and image forming apparatus that employs the LED head |
| 08/16/2011 | US7999274 White light emitting device |