| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 06/30/2011 | US20110156001 Nitride-based light-emitting device |
| 06/30/2011 | US20110156000 Method of manufacturing a semiconductor device and semiconductor device |
| 06/30/2011 | US20110155999 Semiconductor light-emitting devices having concave microstructures providing improved light extraction efficiency and method for producing same |
| 06/30/2011 | US20110155998 Oscillation device |
| 06/30/2011 | US20110155997 Vertical Light emitting diode and manufacturing method of the same |
| 06/30/2011 | DE112009000787T5 AlxGa(1-x)As-Substrat, Epitaxialwafer für Infrarot-LEDs, Infrarot-LED, Verfahren zur Herstellung eines AlxGa(1-x)As-Substrats, Verfahren zur Herstellung eines Epitaxialwafers für Infrarot-LEDs und Verfahren zur Herstellung von Infrarot-LEDs Al x Ga (1-x) As substrate, epitaxial wafer for infrared LEDs, infrared LEDs, process for preparing a Al x Ga (1-x) As substrate, process for producing an epitaxial wafer for infrared LEDs and method for the production of infrared LEDs |
| 06/30/2011 | DE10297286B4 Flexibles Beleuchtungssegment Flexible lighting segment |
| 06/30/2011 | DE102009060781A1 Lichtmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs sowie Beleuchtungseinrichtung mit einem solchen Lichtmodul Light module for a lighting device of a motor vehicle and lighting device with such a light module |
| 06/30/2011 | DE102009056712A1 LED for illumination of rooms, has electrical connection elements provided on ends of nano-columns, where contact material of electrical connection elements is applied only at ends of nano-columns and not applied between nano-columns |
| 06/30/2011 | DE102009055185A1 Leuchtstoff und Lichtquelle mit derartigen Leuchtstoff And fluorescent light source with such a phosphor |
| 06/29/2011 | EP2339762A1 Visible light communication transmitter and visible light communication system |
| 06/29/2011 | EP2339656A2 Light emitting device |
| 06/29/2011 | EP2339655A2 Multi-stack package led |
| 06/29/2011 | EP2339654A2 Light emitting diode |
| 06/29/2011 | EP2339653A1 Light emitting device, and manufacturing method thereof |
| 06/29/2011 | EP2339652A2 Light emitting device, light emitting device package, method of manufacturing light emitting device and lighting system |
| 06/29/2011 | EP2339651A2 Light emitting device, light emitting device package and illumination system |
| 06/29/2011 | EP2339650A1 Production method for light emitting devices |
| 06/29/2011 | EP2339393A1 Liquid crystal display device |
| 06/29/2011 | EP2338183A2 Series connected segmented led |
| 06/29/2011 | EP2338182A1 Optoelectronic semiconductor component |
| 06/29/2011 | EP2338181A2 Semiconductor light emitting device and method for manufacturing the same |
| 06/29/2011 | EP2338180A2 Adjustable color illumination source |
| 06/29/2011 | EP1794811B1 Illumination system |
| 06/29/2011 | EP1764402B1 Phosphor |
| 06/29/2011 | EP1753996B1 An apparatus and method for improved illumination area fill |
| 06/29/2011 | EP1369458B1 Curing agents, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and led's made by using the materials |
| 06/29/2011 | EP1275101B1 A flexible light track for signage |
| 06/29/2011 | CN201887085U High-power integrated LED |
| 06/29/2011 | CN201887084U Encapsulating structure for LED |
| 06/29/2011 | CN201887083U High-power LED bracket |
| 06/29/2011 | CN201887082U Easy-demolition LED encapsulating structure |
| 06/29/2011 | CN201887081U Light-emitting diode (LED) electrode welding plate |
| 06/29/2011 | CN201887080U Surface mounting type light-emitting diode |
| 06/29/2011 | CN201887079U Light emitting diode lead frame |
| 06/29/2011 | CN201887078U LED heat dissipation bracket |
| 06/29/2011 | CN201887077U Novel LED bracket |
| 06/29/2011 | CN201887076U Combining improvement of base plate and heat dissipation structure |
| 06/29/2011 | CN201887075U Led |
| 06/29/2011 | CN201887074U LED (light-emitting diode) light-unifying chip |
| 06/29/2011 | CN201887073U Semiconductor wafer encapsulation structure |
| 06/29/2011 | CN201887072U Abrasion resistant LED bracket mould |
| 06/29/2011 | CN201887046U Single-chip white light emitting diode based on sapphire substrate |
| 06/29/2011 | CN201887045U Encapsulating structure for high-power LED light source module |
| 06/29/2011 | CN201887044U Encapsulating structure for LED light source module |
| 06/29/2011 | CN201887043U Multi-chip light-emitting diode module |
| 06/29/2011 | CN201887042U LED array packaging structure with microstructural silica gel lenses |
| 06/29/2011 | CN201887041U High heat radiation patch type LED module |
| 06/29/2011 | CN201885191U LED (light-emitting diode) improved heat-conducting plate |
| 06/29/2011 | CN201885071U Light-emitting diode (LED) packaging lamp, LED display panel and LED display |
| 06/29/2011 | CN201884982U Novel LED (light-emitting diode) light source module encapsulation structure |
| 06/29/2011 | CN201881053U Light-emitting diode (LED) wafer laser internal cutting scribing device |
| 06/29/2011 | CN1678252B Appliance for transmitting heat energy, device for providing light of predetermined direction and light emitting device |
| 06/29/2011 | CN102113140A Method for manufacturing iii nitride semiconductor light emitting element, iii nitride semiconductor light emitting element and lamp |
| 06/29/2011 | CN102113139A Light-emitting device |
| 06/29/2011 | CN102113119A Light source with near field mixing |
| 06/29/2011 | CN102113102A Relaxation of strained layers |
| 06/29/2011 | CN102113090A Relaxation and transfer of strained layers |
| 06/29/2011 | CN102112807A Color tunable light source |
| 06/29/2011 | CN102110765A Chip-on-board package structure and method for manufacturing the same |
| 06/29/2011 | CN102110764A LED (light emitting diode) and LED bracket |
| 06/29/2011 | CN102110763A Light emission device package and manufacturing method thereof |
| 06/29/2011 | CN102110762A Radiating device integrating radiating plate and electrode and manufacturing method thereof |
| 06/29/2011 | CN102110761A Connector |
| 06/29/2011 | CN102110760A Led package and rfid system including the same |
| 06/29/2011 | CN102110759A Structure and method for packaging light-emitting diode (LED) |
| 06/29/2011 | CN102110758A Light-emitting diode assembly and computer mouse containing light-emitting diode assembly |
| 06/29/2011 | CN102110757A White light LED and packaging method thereof |
| 06/29/2011 | CN102110756A White light LED (light-emitting diode) and packaging method thereof |
| 06/29/2011 | CN102110755A Light-emitting diode |
| 06/29/2011 | CN102110754A Light emitting diode |
| 06/29/2011 | CN102110753A Light emitting device, light emitting device package and illumination system |
| 06/29/2011 | CN102110752A Light emitting device, light emitting device package and lighting system |
| 06/29/2011 | CN102110751A Self-supporting GaN-based luminescent device and manufacturing method thereof |
| 06/29/2011 | CN102110750A Method for packaging wafer level glass micro-cavity of light-emitting diode (LED) |
| 06/29/2011 | CN102110749A Coarsening and etching method of large-area controllable surface of SiC substrate light emitting diode (LED) based on laser |
| 06/29/2011 | CN102110748A Laser spike annealing for GaN LEDs |
| 06/29/2011 | CN102110747A Method for manufacturing flip-chip type LEDs (light emitting diodes) |
| 06/29/2011 | CN102110746A Method for segmenting LED wafer |
| 06/29/2011 | CN102110705A Alternating current light emitting diode |
| 06/29/2011 | CN102110683A High-voltage vertical structure semiconductor light emitting diode |
| 06/29/2011 | CN102110682A Light-emitting device and method for producing the same |
| 06/29/2011 | CN102110681A Side emitting light emitting diode (LED) package structure |
| 06/29/2011 | CN102109150A Ultrathin LED light source plate and packaging method thereof |
| 06/29/2011 | CN102108297A Red fluorescent powder, preparation method thereof and luminescent device prepared therefrom |
| 06/29/2011 | CN102107178A Fluorescent material coating method and substrate prepared by same |
| 06/29/2011 | CN101949500B High-power LED lamp and manufacturing method thereof |
| 06/29/2011 | CN101783340B LED backlight integration and encapsulation structure and encapsulation method |
| 06/29/2011 | CN101783287B Method for bonding two materials |
| 06/29/2011 | CN101752480B Gallium nitride-based LED epitaxial wafer and growing method thereof |
| 06/29/2011 | CN101714594B Method for coarsening surface of epitaxial layer of gallium nitride-based light-emitting diode |
| 06/29/2011 | CN101636849B Iii-nitride light emitting devices grown on templates to reduce strain |
| 06/29/2011 | CN101582474B Semiconductor light emitting device |
| 06/29/2011 | CN101556939B Ceramic encapsulated base and manufacture method thereof |
| 06/29/2011 | CN101539282B Light-emitting diode module |
| 06/29/2011 | CN101510581B LED and relevant backlight module |
| 06/29/2011 | CN101496170B Integrating light source module |
| 06/29/2011 | CN101403485B LED luminous element for integrated control device |
| 06/29/2011 | CN101307183B Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 06/29/2011 | CN101281942B LED and backlight module using the same |