Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
08/2011
08/25/2011US20110204403 Light emitting device, light emitting device package, and lighting system
08/25/2011US20110204402 Light Emitting Device, Light Emitting Device Package, Method of Manufacturing Light Emitting Device and Illumination System
08/25/2011US20110204401 Light emitting device, light emitting device package, and lighting system
08/25/2011US20110204400 Light emitting device, method for manufacturing the same and apparatus for manufacturing light emitting device
08/25/2011US20110204399 Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
08/25/2011US20110204398 Substrate for mounting light-emitting element and light-emitting device
08/25/2011US20110204397 Light emitting device, light emitting device package, method of manufacturing light emitting device, and lighting system
08/25/2011US20110204396 Semiconductor light emitting device and method for manufacturing same
08/25/2011US20110204395 Hybrid light emitting diode chip and light emitting diode device having the same, and manufacturing method thereof
08/25/2011US20110204394 Semiconductor light emitting device and method of manufacturing the same
08/25/2011US20110204392 Led array grid, method and device for manufacturing said grid and led component for use in the same
08/25/2011US20110204390 Solid State Light Sheet Having Wide Support Substrate and Narrow Strips Enclosing LED Dies In Series
08/25/2011US20110204389 Illuminating device
08/25/2011US20110204388 Organic light emitting diode display and method for manufacturing the same
08/25/2011US20110204387 Semiconductor light emitting device having multi-cell array, light emitting module, and illumination apparatus
08/25/2011US20110204386 Metal based electronic component package and the method of manufacturing the same
08/25/2011US20110204385 Vapor Deposition of a Layer
08/25/2011US20110204378 Growth of group iii-v material layers by spatially confined epitaxy
08/25/2011US20110204376 Growth of multi-junction led film stacks with multi-chambered epitaxy system
08/25/2011US20110204373 Tft-lcd pixel unit and method for manufacturing the same
08/25/2011US20110204372 Display device
08/25/2011US20110204370 Thin-Film Transistor Substrate, Method of Manufacturing the Same, and Display Device Including the Same
08/25/2011US20110204367 Semiconductor device, method for manufacturing the same and image display
08/25/2011US20110204366 Semiconductor device, method for manufacturing the same and image display
08/25/2011US20110204361 Display device manufacturing method and laminated structure
08/25/2011US20110204329 NON-POLAR (Al,B,In,Ga)N QUANTUM WELL AND HETEROSTRUCTURE MATERIALS AND DEVICES
08/25/2011US20110204327 Semiconductor light-emitting element array and manufacturing method thereof
08/25/2011US20110204326 Light emitting diode having modulation doped layer
08/25/2011US20110204325 Light-emitting device, light-emitting element and method of manufacturing same
08/25/2011US20110204324 Light emitting device, light emitting device package, and lighting system
08/25/2011US20110204323 Source of photons resulting from a recombination of localized excitons
08/25/2011US20110204322 Optoelectronic Semiconductor Body and Method for Producing an Optoelectronic Semiconductor Body
08/25/2011DE202011100036U1 Lichterkette mit einem großen Leuchtspektrum Light chain with a large luminous spectrum
08/25/2011DE202011050374U1 LED-Kühlanordnung LED cooling arrangement
08/25/2011DE102010009016A1 Optoelectronic semiconductor chip used in optoelectronic semiconductor component, has litter layer which is provided on front side of semiconductor portion to scatter the radiation of semiconductor portion
08/25/2011DE102010009015A1 Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips A method for fabricating a plurality of optoelectronic semiconductor chips
08/25/2011DE102010008904A1 Halbleiterbauelement mit photonischer Strukturierung sowie Verwendungsmöglichkeiten A semiconductor device having a photonic structure and uses
08/25/2011DE102010008876A1 Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz Light source array LEDs for direct operation on AC power
08/25/2011DE102010008605A1 Optoelektronisches Bauteil The optoelectronic device
08/25/2011DE102010008603A1 Elektrisches Widerstandselement Electrical resistance element
08/25/2011DE102010002235A1 Kühlkörper für eine Lichtquelle Heat sink for a light source
08/25/2011DE102010002227A1 Schutz von LEDs gegen Überhitzung und zu hohem Durchgangsstrom Protection of LEDs from overheating and excessive through current
08/25/2011DE102010002204A1 Halbleiterdiode und Verfahren zum Herstellen einer Halbleiterdiode Semiconductor diode and method of manufacturing a semiconductor diode
08/24/2011EP2360750A1 Semiconductor light emitting device and method for manufacturing same
08/24/2011EP2360749A2 Light emitting diode, LED package and lighting system incorporating the same
08/24/2011EP2360748A2 Light emitting device and light emitting device package
08/24/2011EP2360747A2 Light emitting device, light emitting device package, method of manufacturing light emitting device, and lighting system
08/24/2011EP2360746A1 Method for manufacturing gallium oxide substrate, light emitting device, and method for manufacturing the light emitting device
08/24/2011EP2360745A2 Semiconductor light emitting device
08/24/2011EP2360744A2 Light emitting diode and method of manufacturing the same
08/24/2011EP2360743A2 Method for forming semiconductor layer and method for manufacturing light emitting device
08/24/2011EP2360516A1 Light emitting device and display device having the same
08/24/2011EP2360418A2 Light-emitting device and illumination device
08/24/2011EP2360417A2 Light-emitting device and illumination device
08/24/2011EP2360298A2 Method for depositing a semiconductor nanowire
08/24/2011EP2360227A1 Phosphor and production method of the same, method of shifting emission wavelength of phosphor, and light source and LED
08/24/2011EP2360226A1 Phosphor and production method of the same, method of shifting emission wavelength of phosphor, and light source and LED
08/24/2011EP2360218A1 Bonding method, bonded structure, method for producing optical module, and optical module
08/24/2011EP2359416A1 A nanostructured device
08/24/2011EP1861884B1 Metal silicate-silica-based polymorphous phosphors and lighting devices
08/24/2011EP1728284B1 Etching of substrates of light emitting devices
08/24/2011EP1574558B1 Phosphor and optical device using same
08/24/2011CN201946633U 一种led散热结构 One kind of led heat dissipation structure
08/24/2011CN201946632U 贴片型led单晶支架及led光源 SMD led monocrystalline bracket and led light
08/24/2011CN201946631U 采用溅镀线路的led灯板 Using sputtering line led light board
08/24/2011CN201946630U 一种贴片式led支架 A patch style led bracket
08/24/2011CN201946629U 一种led及led基板 One kind of led and led board
08/24/2011CN201946628U 发光二极管封装及其模具 A light emitting diode package and the mold
08/24/2011CN201946627U 大功率发光二极管封装结构 High-power LED package structure
08/24/2011CN201946626U Led散热电路板 Led cooling circuit boards
08/24/2011CN201946625U High power light-emitting diode (LED)
08/24/2011CN201946624U 一种发光二极管 A light-emitting diode
08/24/2011CN201946623U 一种改进的led支架及采用该支架的led灯 An improved stent and the use of the scaffold led led lights
08/24/2011CN201946622U 一种发光半导体模块结构 A light-emitting semiconductor module structure
08/24/2011CN201946621U 一种发光二极管模架 A light-emitting diode mold
08/24/2011CN201946598U 一种led发光晶元芯片封装结构 A light-emitting Epistar led chip package
08/24/2011CN201946597U 带有红色led芯片的基于金属平板散热的led装置 Based on the flat metal plate cooling device with a red led led chip
08/24/2011CN201946596U 一种具有热能与电能分离式散热的led光源封装结构 Led light package structure having a separate heat and cooling energy
08/24/2011CN201946595U 一种整体封装式led A monolithic packaged led
08/24/2011CN201946594U 一种阵列式led模组 One kind of led module array
08/24/2011CN201946593U 一种组合式led器件 A modular led Devices
08/24/2011CN201946592U 白光led封装结构 White led package structure
08/24/2011CN201946591U 一种双晶led封装结构 A dual crystal led package structure
08/24/2011CN201946238U Led点阵显示板 Led dot matrix display panel
08/24/2011CN102165613A LED with controlled angular non-uniformity
08/24/2011CN102165612A LED module and production method
08/24/2011CN102165611A Coated light emitting device and method for coating thereof
08/24/2011CN102165610A Led模块 Led Module
08/24/2011CN102165609A Semiconductor light emitting devices grown on composite substrates
08/24/2011CN102165589A Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package
08/24/2011CN102165588A Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor components and method for the production thereof
08/24/2011CN102165502A Optoelectronic component
08/24/2011CN102164665A Light source device
08/24/2011CN102163686A Light emitting device, light emitting device package, and lighting system
08/24/2011CN102163685A Material sheet structure of support of light-emitting diode
08/24/2011CN102163684A Light emitting device package and lighting system
08/24/2011CN102163683A Optical-semiconductor device
08/24/2011CN102163682A Light emitting device package
08/24/2011CN102163681A Light emitting apparatus, method of manufacturing the same, and lighting system
08/24/2011CN102163680A Substrate for mounting light-emitting element and light-emitting device