| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 09/22/2011 | US20110227077 Repair method and active device array substrate |
| 09/22/2011 | US20110227063 Thin-film transistor, method of fabricating the thin-film transistor, and display substrate using the thin-film transistor |
| 09/22/2011 | US20110227039 Nitride-based light emitting device |
| 09/22/2011 | US20110227038 Semiconductor light emitting device and a production method thereof |
| 09/22/2011 | US20110227037 Enhancement of led light extraction with in-situ surface roughening |
| 09/22/2011 | US20110227036 High Efficiency Hybrid Light-Emitting Diode |
| 09/22/2011 | US20110227035 Nitride-based semiconductor light-emitting device |
| 09/22/2011 | US20110227034 Quantum dot-block copolymer hybrid, methods of fabricating and dispersing the same, light emitting device including the same, and fabrication method thereof |
| 09/22/2011 | US20110227033 Semiconductor light emitting device, wafer, method for manufacturing semiconductor light emitting device, and method for manufacturing wafer |
| 09/22/2011 | DE202007019302U1 Lichtemittierende Halbleitervorrichtung A semiconductor light emitting device |
| 09/22/2011 | DE102010012040A1 Conversion element for optoelectronic semiconductor chip for optoelectronic semiconductor device, has matrix material that is embedded with phosphors provided in the form of particles with specific emission wavelengths |
| 09/22/2011 | DE102010012039A1 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung Optoelectronic component and process for its preparation |
| 09/22/2011 | DE102010011895A1 Semipolarer Halbleiterkristall und Verfahren zur Herstellung desselben Semipolar semiconductor crystal and method of manufacturing the same |
| 09/22/2011 | DE102010011604A1 Foliensystem für LED-Anwendungen Film system for LED applications |
| 09/22/2011 | CA2791037A1 Led module and method of manufacturing the same |
| 09/21/2011 | EP2367400A2 Light emitting device for AC power operation |
| 09/21/2011 | EP2367212A2 Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system |
| 09/21/2011 | EP2367211A2 Light emitting diode and light emitting diode package |
| 09/21/2011 | EP2367210A2 Light emitting device and light emitting device package |
| 09/21/2011 | EP2367209A2 Method for manufacturing semiconductor light emitting device |
| 09/21/2011 | EP2367203A1 Semiconductor light emitting device having multi-cell array and method for manufacturing the same |
| 09/21/2011 | EP2366816A2 GaN Crystal Substrate with Distinguishable Front and Rear Surfaces |
| 09/21/2011 | EP2366198A1 Semiconductor device and fabrication method |
| 09/21/2011 | EP2366197A1 Transparent body with invisible led light source |
| 09/21/2011 | EP2366078A2 Lighting device |
| 09/21/2011 | EP1598450B1 Beta-Ga2O3 SINGLE CRYSTAL GROWING METHOD |
| 09/21/2011 | EP1525340B1 Method for producing by vapour-phase epitaxy a gallium nitride film with low defect density |
| 09/21/2011 | EP1437776B1 Light emitting device and method for manufacture thereof |
| 09/21/2011 | CN201986254U 带有绝缘微散热器的印刷电路板 A printed circuit board with the insulating microelements radiator |
| 09/21/2011 | CN201985176U 一种led结构 One kind of led structure |
| 09/21/2011 | CN201985175U 等距功率型led焊盘 Isometric power type led pad |
| 09/21/2011 | CN201985174U 一种led晶片的封装焊线结构及led晶片 One kind of led chip led chip package structure and bonding wire |
| 09/21/2011 | CN201985173U 一种led近红外光源器件的封装结构 One kind of led package structure of near-infrared light source device |
| 09/21/2011 | CN201985172U 一种led固定防水结构 One kind of led waterproof structure is fixed |
| 09/21/2011 | CN201985171U 发光二极管封装结构 A light emitting diode package structure |
| 09/21/2011 | CN201985170U LED heat radiation type support with big light output angle |
| 09/21/2011 | CN201985169U 一种led芯片封装结构 One kind of led chip package structure |
| 09/21/2011 | CN201985168U 一种透镜式led封装结构 A lens type led package structure |
| 09/21/2011 | CN201985167U 无焊接电极的led封装结构 No welding electrodes led package structure |
| 09/21/2011 | CN201985166U 一种led封装结构 One kind of led package structure |
| 09/21/2011 | CN201985165U Led支架 Led bracket |
| 09/21/2011 | CN201985164U 一种led支架 One kind of led bracket |
| 09/21/2011 | CN201985163U 交流led结构 AC led structure |
| 09/21/2011 | CN201985162U 一种led封装固晶结构 One kind of solid crystal structure led package |
| 09/21/2011 | CN201985161U 堆栈式散热模组 Stack cooling modules |
| 09/21/2011 | CN201985160U 白光led White led |
| 09/21/2011 | CN201985159U Led白光大角度高亮封装结构 Led white wide-angle highlight package |
| 09/21/2011 | CN201985158U 一种结构改良的led芯片 Improvement of a structure led chip |
| 09/21/2011 | CN201985157U 一种电流均匀分布的led晶片 Led chip a uniform current distribution |
| 09/21/2011 | CN201985156U 一种高出光效率的led晶片 A higher light efficiency led chip |
| 09/21/2011 | CN201985155U 新型led模块操作盘 The new operation panel led module |
| 09/21/2011 | CN201985154U Light emitting diode (LED) material supply equipment with automatic polarity detection function |
| 09/21/2011 | CN201985153U Led插件装置 Led plug-in device |
| 09/21/2011 | CN201985096U Structure of lead frame capable of improving luminous efficiency |
| 09/21/2011 | CN201985095U Led集成封装器件 Led integrated package devices |
| 09/21/2011 | CN201985094U Led直插式三基色浑光结构 Led-line tricolor muddy light structure |
| 09/21/2011 | CN201985093U 一种led铜支架 One kind of led copper bracket |
| 09/21/2011 | CN201983063U 稀土led灯具 RE led lamps |
| 09/21/2011 | CN201982991U Led面光源 Led surface light source |
| 09/21/2011 | CN201981291U 一种图形化衬底的结构以及发光二极管芯片 A graphical structure of the substrate and the light emitting diode chip |
| 09/21/2011 | CN1856561B Green-emitting led |
| 09/21/2011 | CN1812117B Semiconductor light emitting device and method of manufacturing the same |
| 09/21/2011 | CN102197501A Multi-chip LED package |
| 09/21/2011 | CN102197500A Monochromatic light source with high aspect ratio |
| 09/21/2011 | CN102197499A Light source with improved monochromaticity |
| 09/21/2011 | CN102197498A Substrate for light emitting element package, and light emitting element package |
| 09/21/2011 | CN102197330A Backlight unit, liquid crystal display device, data generating method, data generating program and recording medium |
| 09/21/2011 | CN102197089A Resin composition, reflector plate and light-emitting device |
| 09/21/2011 | CN102194988A Light emitting device |
| 09/21/2011 | CN102194987A Light-emitting device package component |
| 09/21/2011 | CN102194986A Semiconductor light emitting device and method of fabricating semiconductor light emitting device |
| 09/21/2011 | CN102194985A Wafer level package method |
| 09/21/2011 | CN102194984A Light emitting device, method for manufacturing the same and apparatus for manufacturing light emitting device |
| 09/21/2011 | CN102194983A Surface mounting light-emitting diode (LED) with high sealing property and production method thereof |
| 09/21/2011 | CN102194982A Insert-molding-type LED |
| 09/21/2011 | CN102194981A Light emitting device package, and display apparatus and lighting system having the same |
| 09/21/2011 | CN102194980A Light emitting diode package and lighting system including the same |
| 09/21/2011 | CN102194979A Light emitting device |
| 09/21/2011 | CN102194978A Light emitting device and light unit |
| 09/21/2011 | CN102194977A Metal composite substrate and manufacture method thereof |
| 09/21/2011 | CN102194976A Light-emitting device and illumination device |
| 09/21/2011 | CN102194975A Optical semiconductor package and optical semiconductor device |
| 09/21/2011 | CN102194974A Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system |
| 09/21/2011 | CN102194973A Ultraviolet LED packaging structure and wafer-grade packaging method thereof |
| 09/21/2011 | CN102194972A Light-emitting device (LED) package component |
| 09/21/2011 | CN102194971A Light-emitting device (LED) package structure and method for manufacturing the same |
| 09/21/2011 | CN102194970A White-light LED illuminating device driven by pulse current |
| 09/21/2011 | CN102194969A Welding-free large-power light-emitting diode (LED) packaging device without aluminium base plate |
| 09/21/2011 | CN102194968A Light-emitting diode (LED) |
| 09/21/2011 | CN102194967A Light-emitting diode (LED) packaging structure for promoting heat dissipation effect and manufacturing method thereof |
| 09/21/2011 | CN102194966A Light-emitting diode (LED) structure with efficient heat dissipation effect and manufacturing method thereof |
| 09/21/2011 | CN102194965A Compound semiconductor packaging structure and manufacturing method thereof |
| 09/21/2011 | CN102194964A Compound semi-conductor packaging structure and manufacturing method thereof |
| 09/21/2011 | CN102194963A Low thermal resistance light-emitting diode (LED) and packaging method thereof |
| 09/21/2011 | CN102194962A Packaging structure emitting light broadwise of semiconductor component |
| 09/21/2011 | CN102194961A Semiconductor light-emitting component packaging structure |
| 09/21/2011 | CN102194960A Packaging structure of semiconductor light-emitting assembly |
| 09/21/2011 | CN102194959A Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit |
| 09/21/2011 | CN102194958A Light emitting device and light emitting device package |
| 09/21/2011 | CN102194957A Bearing seat of light-emitting diode chip |