Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
01/2013
01/24/2013WO2013011674A1 Semiconductor light emitting element
01/24/2013WO2013011628A1 Light emitting device and method for manufacturing same
01/24/2013WO2013011594A1 Circuit board for having semiconductor light emitting device mounted thereon, light emitting module, illuminating apparatus, and illuminating system
01/24/2013WO2013011415A1 Method of bonding a semiconductor device to a support substrate
01/24/2013WO2013010919A1 Lighting device
01/24/2013WO2013010765A1 Optoelectronic component and method for producing an optoelectronic component
01/24/2013WO2013010389A1 Light emitting diode encapsulation structure and manufacturing method thereof
01/24/2013WO2012166809A3 Solid state lighting devices having side reflectivity and associated methods of manufacture
01/24/2013WO2012164284A3 Semiconductor nanoparticle - based materials for use in light emitting diodes, optoelectronic displays and the like
01/24/2013WO2012157938A3 Thermosetting resin composition for light reflection, preparation method thereof, reflecting plate for loading photonic semiconductor prepared therefrom, and photonic semiconductor device containing same
01/24/2013US20130023080 Chemical vapor deposition and method of manufacturing light-emitting device using chemical vapor deposition
01/24/2013US20130023079 Fabrication of light emitting diodes (leds) using a degas process
01/24/2013US20130023078 Method of manufacturing a display substrate
01/24/2013US20130023077 Method for manufacturing semiconductor optical device and semiconductor optical device
01/24/2013US20130023076 Method for manufacturing light-emitting device
01/24/2013US20130023075 Method of Forming Process Substrate Using Thin Glass Substrate and Method of Fabricating Flat Display Device Using the Same
01/24/2013US20130023074 Using isolated epitaxial structures in glue bonding for multiple group-iii nitride leds on a single substrate
01/24/2013US20130023073 Using non-isolated epitaxial structures in glue bonding for multiple group-iii nitride leds on a single substrate
01/24/2013US20130023072 Substrate For Integrated Modules
01/24/2013US20130023071 Donor substrate, method of manufacturing a donor substrate and method of manufacturing an organic light emitting display device using a donor substrate
01/24/2013US20130022073 Single-Frequency Distributed Feedback Laser Diode with Complex-Coupling Coefficient and Transparent Conductive Cladding Layer
01/24/2013US20130022070 Semiconductor laser device and manufacturing method thereof
01/24/2013US20130021776 Led lighting systems with phosphor subassemblies, and/or methods of making the same
01/24/2013US20130021556 Display device and method of manufacturing the same
01/24/2013US20130021553 Liquid crystal display device and method of manufacturing the same
01/24/2013US20130021551 Ips liquid crystal display panel and method for manufacturing the same
01/24/2013US20130021549 Fluorescent substrate and method for producing the same, and display device
01/24/2013US20130020930 Yellow-green to yellow-emitting phosphors based on halogenated-aluminates
01/24/2013US20130020681 Process for preparing a bonding type semiconductor substrate
01/24/2013US20130020610 Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device
01/24/2013US20130020609 Semiconductor light-emitting device having stacked transparent electrodes
01/24/2013US20130020608 Group iii nitride semiconductor light-emitting device
01/24/2013US20130020607 Led module and method for manufacturing the same
01/24/2013US20130020606 Circuit board with thermo-conductive pillar
01/24/2013US20130020605 Led module
01/24/2013US20130020604 Slim led package
01/24/2013US20130020603 Light emitting device
01/24/2013US20130020602 Transparent light emitting diodes
01/24/2013US20130020601 Light emitting device
01/24/2013US20130020600 Light emitting diode package
01/24/2013US20130020599 Semiconductor light emitting device
01/24/2013US20130020598 Light emitting device package and fabrication method thereof
01/24/2013US20130020597 Posts in glue layer for group-iii nitride leds
01/24/2013US20130020596 Luminous devices, packages and systems containing the same, and fabricating methods thereof
01/24/2013US20130020595 Led module and led module mounting structure
01/24/2013US20130020594 Semiconductor template substrate, light-emitting element using a semiconductor template substrate, and a production method therefor
01/24/2013US20130020593 Ac light emitting diode and method for fabricating the same
01/24/2013US20130020592 Light-emitting device, light-emitting device array, optical recording head, image forming apparatus, and method of manufacturing light-emitting device
01/24/2013US20130020591 Display substrate and method of manufacturing the same
01/24/2013US20130020590 Light emitting devices and components having excellent chemical resistance and related methods
01/24/2013US20130020589 Wafer level photonic device die structure and method of making the same
01/24/2013US20130020588 Optical device with through-hole cavity
01/24/2013US20130020580 Heteroepitaxial growth using ion implantation
01/24/2013US20130020574 Display device and method of manufacturing the same
01/24/2013US20130020558 Organic electroluminescence device
01/24/2013US20130020555 Nitride-based semiconductor light emiting device
01/24/2013US20130020553 Semiconductor light emitting device
01/24/2013US20130020552 Semiconductor light-emitting element
01/24/2013US20130020551 Group iii nitride semiconductor light emitting device and method of fabricating group iii nitride semiconductor light emitting device
01/24/2013US20130020550 Nanostructured Electroluminescent Device and Display
01/24/2013DE112011101156T5 Leuchtdiodenelement und Leuchtdiodenvorrichtung Light-emitting element and light emitting diode device
01/24/2013DE102012212709A1 Verfahren zum Herstellen einer Lichtemissions-Vorrichtung A method of manufacturing a light emitting device
01/24/2013DE102012106456A1 Eine weißes Licht aussendende Vorrichtung, sowie Anzeigegerät und Beleuchtungsgerät, die diese nutzen A white light emitting device and display device and illumination device, which they use
01/24/2013DE102012106146A1 Verfahren zur chemischen Gasphasenabscheidung und Verfahren zur Herstellung lichtabgebender Vorrichtungen, das dieses nutzt A process for chemical vapor deposition and methods of preparing lichtabgebender devices that uses this
01/24/2013DE102011108089A1 Verfahren zur Herstellung dünner elektrisch leitfähiger Schichten aus Silber, eine Silber-Schicht, einen Silberkomplex, dessen Lösung sowie eine Verwendung des Silberkomplexes in einer Lösung A process for the production of thin electrically conductive layers of silver, a silver layer, a silver complex, the solution and a use of the silver complex in a solution
01/24/2013DE102011108080A1 Gruppe-III-Nitrid-basierte Schichtenfolge, Bauelement und Verfahren zur Herstellung Group III-nitride based layer sequence component and methods for making
01/24/2013DE102011107895A1 Optoelektronisches Modul mit Linsensystem The optoelectronic module with lens system
01/24/2013DE102011079403A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component
01/23/2013EP2549599A1 Nitride semiconductor light-emitting element
01/23/2013EP2549555A2 White light emitting device, display apparatus and illumination apparatus
01/23/2013EP2549554A1 White light emitting lamp, and white light led lighting device equipped with same
01/23/2013EP2549553A2 Led module and manufacturing method thereof
01/23/2013EP2548235A1 Lighting apparatus
01/23/2013EP2548234A2 Improved multi-junction led
01/23/2013EP2548233A1 Light-emitting device with heterophase boundaries
01/23/2013EP2548222A2 Optoelectronic component and method for the production thereof
01/23/2013CN202695553U LED (light emitting-diode) packaging and heat radiating integrated structure
01/23/2013CN202695552U Packaging structure with good anti-glare and cooling performances for high-power light-emitting diode (LED) lamp
01/23/2013CN202695551U Heat dissipation structure for LED (Light Emitting Diode)
01/23/2013CN202695550U Ceramic heat dissipation substrate structure of light emitting diode (LED)
01/23/2013CN202695549U Chip on board (COB) substrate beneficial for pattern recognition (PR)
01/23/2013CN202695548U Support for power light-emitting diode (LED) encapsulation
01/23/2013CN202695547U Light-emitting diode (LED) circuit component with LED chip directly encapsulated on wire circuit board
01/23/2013CN202695546U Light emitting diode (LED) support with surface mount device resistors and LED device with same
01/23/2013CN202695545U Light-emitting diode (LED) lead frame
01/23/2013CN202695544U Light-emitting diode (LED) lead frame and combination thereof
01/23/2013CN202695543U Full-color direct-inserting LED (Light Emitting Diode) lamp bead and display screen thereof
01/23/2013CN202695542U Asymmetrical light beam straight insertion type LED (Light-emitting Diode)
01/23/2013CN202695541U 发光装置及光学装置 Light-emitting devices and optical devices
01/23/2013CN202695540U LED lamp bead used in display screen
01/23/2013CN202695539U Direct inset type LED packaging structure
01/23/2013CN202695538U Light emitting diode used for mouse
01/23/2013CN202695537U Fluorescent patch applied to fluorescent conversion type LED lamp
01/23/2013CN202695536U Polycrystalline integrated high-power light-emitting diode (LED) packaging structure
01/23/2013CN202695535U Infrared ceramics high-power LED light source
01/23/2013CN202695534U Light-emitting diode (LED) support with asymmetric lamp cups
01/23/2013CN202695533U Thermoelectricity separation light-emitting diode (LED) support
01/23/2013CN202695532U Moisture-proof and waterproof LED (Light Emitting Diode) support
01/23/2013CN202695531U Small direct-inserting LED lamp bead
01/23/2013CN202695530U Light-emitting diode (LED) module capable of directly forming LED supports on wire circuit boards