| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 07/18/2013 | US20130181248 Optoelectronic Semiconductor Component |
| 07/18/2013 | US20130181247 Semiconductor Component and Method for Producing a Semiconductor Component |
| 07/18/2013 | US20130181246 Illuminating device with led surface light source covered with optical film |
| 07/18/2013 | US20130181245 Light-emitting device |
| 07/18/2013 | US20130181244 Semiconductor light-emitting device and method of forming electrode |
| 07/18/2013 | US20130181243 Solid State Lighting Device |
| 07/18/2013 | US20130181241 Method of molding structures in a plastic substrate |
| 07/18/2013 | US20130181240 Composite substrate, manufacturing method thereof and light emitting device having the same |
| 07/18/2013 | US20130181239 Semiconductor light emitting device |
| 07/18/2013 | US20130181238 Electronic devices with yielding substrates |
| 07/18/2013 | US20130181237 Light Emitting Systems and Methods |
| 07/18/2013 | US20130181236 Light emitting device and lighting equipment |
| 07/18/2013 | US20130181234 Lighting devices with prescribed colour emission |
| 07/18/2013 | US20130181233 Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer |
| 07/18/2013 | US20130181227 LED Package with Slanting Structure and Method of the Same |
| 07/18/2013 | US20130181219 Semiconductor growth substrates and associated systems and methods for die singulation |
| 07/18/2013 | US20130181209 Vapor deposition method, vapor deposition device and organic el display device |
| 07/18/2013 | US20130181197 Organic electroluminescent devices |
| 07/18/2013 | US20130181194 Organic light emitting device |
| 07/18/2013 | US20130181188 Iii nitride epitaxial substrate and deep ultraviolet light emitting device using the same |
| 07/18/2013 | US20130181187 Semiconductor light emitting device |
| 07/18/2013 | US20130181186 INTEGRATION OF CURRENT BLOCKING LAYER AND n-GaN CONTACT DOPING BY IMPLANTATION |
| 07/18/2013 | US20130181128 Photoconductive antenna, terahertz wave generating device, camera, imaging device, and measuring device |
| 07/18/2013 | US20130181110 Data transmission through optical vias |
| 07/18/2013 | DE112011103186T5 Lichtemittierende Diodeneinheit auf Waferebene und Verfahren zu ihrer Herstellung Light emitting diode unit on the wafer level, and methods for their preparation |
| 07/18/2013 | DE112011103148T5 Multichip-LED-Vorrichtungen mit hoher Dichte Multi-chip LED devices with high density |
| 07/18/2013 | DE112010005894T5 Herstellungsverfahren für Leuchtdioden mit Gehäuse Manufacturing process for light-emitting diodes with housing |
| 07/18/2013 | DE102012200493A1 Preparing a converter element for conversion of electromagnetic radiation, by providing first phosphor arrangement with individual particles of ceramic phosphor, and partially introducing an energy input into the first phosphor arrangement |
| 07/17/2013 | EP2615653A1 Led wiring board and light irradiation apparatus |
| 07/17/2013 | EP2615652A1 Light emitting apparatus, lighting apparatus, and lens |
| 07/17/2013 | EP2615651A1 Method for producing group iii nitride semiconductor light emitting element and group iii nitride semiconductor light emitting element |
| 07/17/2013 | EP2615650A2 III-nitride epitaxial substrate and deep ultraviolet light emiting device using the same |
| 07/17/2013 | EP2615154A1 METHOD FOR PRODUCING TYPE ß-SIALON |
| 07/17/2013 | EP2615140A2 Light emitting device package |
| 07/17/2013 | EP2614694A1 Coating method for an optoelectronic chip-on-board module |
| 07/17/2013 | EP2614693A1 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module |
| 07/17/2013 | EP2614683A1 Silicon carbidonitride based phosphors and lighting devices using the same |
| 07/17/2013 | EP2614539A1 Optoelectronic semiconductor component and method for producing it |
| 07/17/2013 | EP2614538A1 Method for producing an optoelectronic semiconductor component |
| 07/17/2013 | EP2614537A1 Method for applying a conversion means to an optoelectronic semiconductor chip and optoelectronic component |
| 07/17/2013 | EP2614536A1 Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation |
| 07/17/2013 | EP2614535A1 An optoelectronic device comprising nanostructures of hexagonal type crystals |
| 07/17/2013 | EP2614534A1 Light-emitting diode chip and method for producing the same |
| 07/17/2013 | EP2614528A1 An led array package covered with a highly thermal conductive plate |
| 07/17/2013 | EP2614518A1 Methods of fabricating optoelectronic devices using layers detached from semiconductor donors and devices made thereby |
| 07/17/2013 | CN203071136U Wafer level LED packaging structure |
| 07/17/2013 | CN203071135U Transition electrode used in LED integrated packaging module |
| 07/17/2013 | CN203071134U LED integrated packaging module realized by using transition electrode |
| 07/17/2013 | CN203071133U Four-edge bonding wire structure of high-power LED lamp |
| 07/17/2013 | CN203071132U LED light source for illumination |
| 07/17/2013 | CN203071131U Patch type infrared receiving tube |
| 07/17/2013 | CN203071130U LED light packaging structure |
| 07/17/2013 | CN203071129U Light emitting device |
| 07/17/2013 | CN203071128U LED packaging structure |
| 07/17/2013 | CN203071127U Broadband LED light source and light displacement sensor |
| 07/17/2013 | CN203071126U Inorganic substrate |
| 07/17/2013 | CN203071125U LED light-emitting device with reflecting mirror structure |
| 07/17/2013 | CN203071124U Patch type infrared transmitting tube |
| 07/17/2013 | CN203071123U Three-primary-color light emitting diode support |
| 07/17/2013 | CN203071122U LED luminescent device |
| 07/17/2013 | CN203071121U LED lamp bead with good heat resistance performance |
| 07/17/2013 | CN203071120U LED support and terminal material tape |
| 07/17/2013 | CN203071119U LED chip |
| 07/17/2013 | CN203071118U LED light-emitting device |
| 07/17/2013 | CN203071069U Three-cup LED lamp |
| 07/17/2013 | CN203071068U Convex-type packaging structure of LED light source |
| 07/17/2013 | CN203071067U Anti-dazzling color temperature adjustable high-voltage LED lamp bead and lamp formed by same |
| 07/17/2013 | CN203071066U Parallelly connected welding wire structure of LED lamp |
| 07/17/2013 | CN203071065U White LED source structure |
| 07/17/2013 | CN203071064U Light emitting element packaging device |
| 07/17/2013 | CN203071063U Novel MCOB light source |
| 07/17/2013 | CN203071062U Light emitting diode package module |
| 07/17/2013 | CN203068236U LED lamp with separated welding wire structure |
| 07/17/2013 | CN203068198U Integrated light-emitting diode (LED) lamp structure |
| 07/17/2013 | CN203068175U Integrated light-emitting diode (LED) lighting component |
| 07/17/2013 | CN203065632U Reusable LED (Light-Emitting Diode) extension epitaxial substrate |
| 07/17/2013 | CN1501493B Combined semiconductor apparatus with thin semiconductor films |
| 07/17/2013 | CN103210512A Light-emitting device, and method for manufacturing circuit board |
| 07/17/2013 | CN103210511A Reflective body and a light-emitting device equipped with the same |
| 07/17/2013 | CN103210510A Optoelectronic semiconductor device |
| 07/17/2013 | CN103210509A Wavelength conversion element and light source provided with same |
| 07/17/2013 | CN103210508A Light emitting device and method for manufacturing same |
| 07/17/2013 | CN103210507A 光学器件 Optics |
| 07/17/2013 | CN103210490A Solid state light sheet or strip for general illumination |
| 07/17/2013 | CN103210041A Thermosetting silicone resin composition, and silicone resin-containing structure and optical semiconductor element encapsulant obtained using same |
| 07/17/2013 | CN103208585A Chip package structure and manufacturing method thereof |
| 07/17/2013 | CN103208584A Semiconductor device package with slanting structures |
| 07/17/2013 | CN103208583A Warm white light-emitting diode (LED) plane light source luminous body and manufacturing method thereof |
| 07/17/2013 | CN103208582A High-power White Leds And Manufacturing Method Thereof |
| 07/17/2013 | CN103208581A Light emitting diode lens |
| 07/17/2013 | CN103208580A Light emitting device package |
| 07/17/2013 | CN103208579A Method Of Forming Phosphor Layer On Light-emitting Device Chip Wafer Using Wafer Level Mold |
| 07/17/2013 | CN103208578A All-angle luminous light-emitting diode (LED) light source |
| 07/17/2013 | CN103208577A Manufacturing method of light-emitting diode aluminum nitride ceramic support with concave cup |
| 07/17/2013 | CN103208576A Low-heat-resistance and high-light-efficiency light-emitting diode (LED) integrated light source |
| 07/17/2013 | CN103208575A High-transmittance packaged LED (light emitting diode) |
| 07/17/2013 | CN103208574A Light emitting diode (LED) packaging structure |
| 07/17/2013 | CN103208573A Semiconductor Light-emitting Device And Method Of Forming Electrode |
| 07/17/2013 | CN103208572A Iii-nitride Epitaxial Substrate And Deep Ultraviolet Light Emiting Device Using The Same |
| 07/17/2013 | CN103208571A GaN-based LED (light emitting diode) epitaxial wafer and production method thereof |