| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 07/04/2013 | DE112011102680T5 Metallfolienlaminat, Substrat zur Befestigung von LED und Lichtquellenvorrichtung Metal foil laminate substrate for mounting LED light source device and |
| 07/04/2013 | DE102012200011A1 Leuchtstoffkörper zur konversion von pumplicht Phosphor-conversion of pump body for light |
| 07/04/2013 | DE102012112126A1 Form für Leuchtdiodengehäuse Form for LEDs Housing |
| 07/03/2013 | EP2610933A2 Molded package for light emitting device |
| 07/03/2013 | EP2610932A1 Encapsulating sheet, producing method of optical semiconductor device, optical semiconductor device, and lighting device |
| 07/03/2013 | EP2610931A1 Deposition of phosphor on die top by stencil printing |
| 07/03/2013 | EP2610930A2 Multichip white led device |
| 07/03/2013 | EP2610929A2 Light emitting device |
| 07/03/2013 | EP2610928A2 Light emitting device |
| 07/03/2013 | EP2610927A2 Nitride-based light emitting device with excellent light emitting efficiency using strain buffer layer |
| 07/03/2013 | EP2610926A1 Method of manufacturing light emitting device, and light emitting device |
| 07/03/2013 | EP2610925A2 Producing method of light emitting diode device |
| 07/03/2013 | EP2610919A1 Woven mesh substrate with semiconductors, and method and device for manufacturing same |
| 07/03/2013 | EP2610910A1 Semicondcuctor apparatus with thin semiconductor film |
| 07/03/2013 | EP2610323A1 Phosphor, lighting fixture, and image display device |
| 07/03/2013 | EP2610322A1 Semiconductor nanoparticle assembly |
| 07/03/2013 | EP2610314A1 Phosphor-containing sheet, led light emitting device using same, and method for manufacturing led light emitting device |
| 07/03/2013 | EP2610058A1 Resin sheet laminated body, method for producing same, and method for producing led chip with phosphor-containing resin sheet using same |
| 07/03/2013 | EP2609634A2 Light source mount |
| 07/03/2013 | EP2609633A1 Radiation-emitting component and method for producing a radiation-emitting component |
| 07/03/2013 | EP2609632A1 Semiconductor component and method for producing a semiconductor component |
| 07/03/2013 | EP2609624A2 Solid state light sheet or strip for general illumination |
| 07/03/2013 | EP2609171A1 Silicate-based phosphor |
| 07/03/2013 | CN203038980U Paster type high power LED |
| 07/03/2013 | CN203038979U Moisture-proof full-color surface mount device |
| 07/03/2013 | CN203038978U Integrated LED light source lens capable of color matching |
| 07/03/2013 | CN203038977U Light-emitting diode structure |
| 07/03/2013 | CN203038976U Light emitting diode |
| 07/03/2013 | CN203038975U Color-changing integrated LED lamp |
| 07/03/2013 | CN203038974U Large power COB-LED light source device structure with adjustable light and color |
| 07/03/2013 | CN203038973U Printed circuit board of LED lamp |
| 07/03/2013 | CN203038972U LED module packaging structure |
| 07/03/2013 | CN203038971U LED module |
| 07/03/2013 | CN203038970U LED lamp assembly and its packaging structure |
| 07/03/2013 | CN203038969U Sapphire substrate flip-chip-structure LED |
| 07/03/2013 | CN203038968U LED illumination module |
| 07/03/2013 | CN203038967U Anti-leakage led lead frame |
| 07/03/2013 | CN203038966U LED preventing fluorescent glue from diffusing |
| 07/03/2013 | CN203038965U 发光元件 Light-emitting element |
| 07/03/2013 | CN203038964U Patterned substrate capable of improving forward light output quantity |
| 07/03/2013 | CN203038963U Novel light emitting diode based on photonic crystal |
| 07/03/2013 | CN203038962U LED support feeding and receiving machine |
| 07/03/2013 | CN203038919U High-power bicrystal LED lamp |
| 07/03/2013 | CN203038900U LED ceramic substrate protective supporting plate |
| 07/03/2013 | CN203030542U Light-splitting surface-mounting integrated machine |
| 07/03/2013 | CN103190205A Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module |
| 07/03/2013 | CN103190042A Group III nitride semiconductor device, method of manufacturing group III nitride semiconductor devices, and epitaxial substrate |
| 07/03/2013 | CN103190010A Optoelectronic semiconductor component comprising a semiconductor chip, a carrier substrate and a film and a method for producing said component |
| 07/03/2013 | CN103190009A Light emitting device, and package array for light emitting device |
| 07/03/2013 | CN103190008A LED-element mounting lead frame, resin-attached lead frame, method of manufacturing semiconductor device, and semiconductor-element mounting lead frame |
| 07/03/2013 | CN103190007A Optic assembly utilizing quantum dots |
| 07/03/2013 | CN103190006A White ceramic LED package |
| 07/03/2013 | CN103190005A Solid state light emitting devices based on crystallographically relaxed structures |
| 07/03/2013 | CN103190004A Light emitting element and production method for same, production method for light-emitting device, illumination device, backlight, display device, and diode |
| 07/03/2013 | CN103190003A Optoelectronic semiconductor chip and method for producing same |
| 07/03/2013 | CN103190002A Led lighting circuit, led illuminating device, and socket for led illuminating unit |
| 07/03/2013 | CN103189981A High density multi-chip LED devices |
| 07/03/2013 | CN103189980A Multi-chip LED devices |
| 07/03/2013 | CN103189681A 灯 Light |
| 07/03/2013 | CN103189421A Organosiloxane block copolymer |
| 07/03/2013 | CN103187518A Novel light emitting diode (LED) heat dissipation system |
| 07/03/2013 | CN103187517A Encapsulating sheet, producing method of optical semiconductor device, optical semiconductor device, and lighting device |
| 07/03/2013 | CN103187516A Deposition of phosphor on die top using dry film photoresist |
| 07/03/2013 | CN103187515A Optical converting structure and led packing structure employing the optical converting structure |
| 07/03/2013 | CN103187514A LED (light-emitting diode) package structure |
| 07/03/2013 | CN103187513A Intensity scattering light-emitting diode (LED) device |
| 07/03/2013 | CN103187512A Light emitting device |
| 07/03/2013 | CN103187511A Molded package for light emitting device |
| 07/03/2013 | CN103187510A Solid-state light-emitting device and solid-state light-emitting package thereof |
| 07/03/2013 | CN103187509A Light emitting diode apparatus |
| 07/03/2013 | CN103187508A Size encapsulation structure and encapsulation technology of light-emitting diode (LED) wafer level chip |
| 07/03/2013 | CN103187507A Light-emitting diode packaging structure |
| 07/03/2013 | CN103187506A Light-emitting diode device |
| 07/03/2013 | CN103187505A LED with heat-dissipation substrate device |
| 07/03/2013 | CN103187504A Package structure of light emitting diode |
| 07/03/2013 | CN103187503A Efficient light-emitting diode containing metal photonic crystal |
| 07/03/2013 | CN103187502A Nitride semiconductor light-emitting element |
| 07/03/2013 | CN103187501A Epitaxial structure in high-brightness gallium nitride (GaN)-based green-light light emitting diode (LED) |
| 07/03/2013 | CN103187500A Nitride-based light emitting device with excellent light emitting efficiency using strain buffer layer |
| 07/03/2013 | CN103187499A Light-emitting diode and manufacturing method thereof |
| 07/03/2013 | CN103187498A Semiconductor structure and forming method thereof |
| 07/03/2013 | CN103187497A Epitaxial structure capable of improving light effect of large-sized chip and growing method thereof |
| 07/03/2013 | CN103187496A Light emitting diode |
| 07/03/2013 | CN103187495A 发光二极管芯片及其制造方法 The light emitting diode chip and its manufacturing method |
| 07/03/2013 | CN103187494A High voltage light-emitting diode and manufacturing method thereof |
| 07/03/2013 | CN103187493A Method for manufacturing light emitting diode |
| 07/03/2013 | CN103187492A Tool cutting method |
| 07/03/2013 | CN103187491A Manufacturing method for chip-level led structure and led chip |
| 07/03/2013 | CN103187490A Conducting layer attachment processing method in ceramic substrate concave area and conducting adhesive component |
| 07/03/2013 | CN103187489A Semiconductor packaging method and semiconductor packaging structure |
| 07/03/2013 | CN103187488A White LED chip and manufacturing method thereof |
| 07/03/2013 | CN103187487A Semiconductor encapsulation process and semiconductor encapsulation structure |
| 07/03/2013 | CN103187486A Manufacturing methods of package structure of light emitting diode and fluorescent thin films of package structure |
| 07/03/2013 | CN103187485A Manufacturing method of light emitting diode |
| 07/03/2013 | CN103187484A Package method for light emitting diode |
| 07/03/2013 | CN103187425A Semiconductor light emitting device and led module |
| 07/03/2013 | CN103187409A Light-emitting diode (LED) array packaging light source module based on lead frame |
| 07/03/2013 | CN103187408A Light-emitting diode packaging structure |
| 07/03/2013 | CN103187407A Method and structure for packaging light-emitting module of diffusion excitation fluorescent agent |
| 07/03/2013 | CN103187406A Package structure and package method of light emitting diode |