Patents
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
01/2008
01/31/2008US20080023219 Electronic component and method for manufacturing same
01/31/2008DE102006038077A1 Solid electrolyte storage cell comprises cathode, anode and solid electrolytes, where anode has intercalation material and metal species, which are unfixed in intercalation material
01/31/2008DE102006035204A1 Monolithic integrated circuit e.g. e.g. hybrid circuit, arrangement, for processing high frequency signals in e.g. voltage controlled oscillator, has metallic connection unit connecting plate with loop in electrically conductive manner
01/31/2008DE102006035119A1 Verfahren zur Herstellung eines Transistors, Verfahren zur Herstellung einer Speicherzellenanordnung, Transistor und Speicherzellenanordnung A method of manufacturing a transistor, method of making a memory cell array transistor and memory cell arrangement
01/31/2008DE102006035073A1 Bauelement mit einem Dünnfilmtransistor und CMOS-Transistoren sowie Verfahren zur Herstellung Component having a thin film transistor and CMOS transistors, as well as process for preparing
01/31/2008DE102006019413A1 Semiconductor device structure formation method involves removing sacrificial material which is arranged in horizontal and vertical portions for structuring hardmask
01/31/2008DE10053962B4 Nichtflüchtiger ferroelektrischer Speicher und Verfahren zu seiner Herstellung A non-volatile ferroelectric memory and method for its preparation
01/30/2008EP1883113A1 Phase change memory device
01/30/2008EP1883112A1 Back illuminated image sensor with an uniform substrate temperature
01/30/2008EP1883111A2 Image pickup device and method of manufacturing the same
01/30/2008EP1883110A2 Thin-film transistor substrate, method of manufacturing the same and display panel having the same
01/30/2008EP1883109A1 Memory element and method of manufacturing thereof
01/30/2008EP1883036A1 Solid-state image pickup device
01/30/2008EP1882307A2 Integrated circuit with signal bus formed by cell abutment of logic cells
01/30/2008EP1882271A2 Non-volatile memory
01/30/2008EP1882270A1 Photolithography method for contacting thin-film semiconductor structures
01/30/2008EP1273017B1 Distributed capacitor
01/30/2008CN101116197A Composite material comprising organic compound and inorganic compound, light emitting element and light emitting device employing the composite material as well as manufacturing method of the light em
01/30/2008CN101116194A Pillar phase change memory cell
01/30/2008CN101116188A Method for producing metal/semiconductor contacts through a dielectric
01/30/2008CN101116186A Solid state image pickup device and manufacturing method thereof
01/30/2008CN101116185A Semiconductor device and method of manufacture
01/30/2008CN101116183A Method for manufacturing capacity element, method for manufacturing semiconductor device and semiconductor-manufacturing apparatus
01/30/2008CN101115702A Bisanthracene derivative and organic electroluminescence device using the same
01/30/2008CN101115127A Driving apparatus for driving and imaging device
01/30/2008CN101114793A Semiconductor integrated circuit supplying voltage to a load using a charge pump and electronic device including the same
01/30/2008CN101114702A System for displaying images
01/30/2008CN101114695A Memory element and method of manufacturing thereof
01/30/2008CN101114693A Semiconductor device using magnetic domain wall moving
01/30/2008CN101114677A Nonvolatile semiconductor memory device and method of manufacturing the same
01/30/2008CN101114668A Organic light emitting display device and method of fabricating the same
01/30/2008CN101114667A Organic thin film transistor substrate and fabrication thereof
01/30/2008CN101114666A Anti-irradiation high-reliability phase transition memory device unit and manufacturing method thereof
01/30/2008CN101114665A Solid-state image sensor
01/30/2008CN101114664A Image sensing device packaging digital camera module group using the same
01/30/2008CN101114663A Image sensing device packaging digital camera module group using the same
01/30/2008CN101114662A Single chip integrated CMOS imaging sensor with dual-focus microlens array
01/30/2008CN101114661A CMOS image sensor
01/30/2008CN101114660A CMOS imaging sensor and method of producing same
01/30/2008CN101114659A CMOS imaging sensor and method of producing same
01/30/2008CN101114658A Thin film transistor substrates and making method
01/30/2008CN101114657A Display panel, mask and method of manufacturing the same
01/30/2008CN101114656A Distortion resistant touch-sensitive display panel
01/30/2008CN101114655A Film transistor array substrates and its producing method, repairing method
01/30/2008CN101114654A Non-volatile memory device and methods of operating and fabricating the same
01/30/2008CN101114653A Nonvolatile memory devices and methods of fabricating the same
01/30/2008CN101114652A Semiconductor memory device and sram memory cell layout
01/30/2008CN101114651A Semiconductor device with a surrounded channel transistor
01/30/2008CN101114650A Method and structure for self-aligned device contacts
01/30/2008CN101114649A Semiconductor device used in step-up dc-dc converter, and step-up dc-dc converter
01/30/2008CN101114648A Semiconductor device
01/30/2008CN101114647A Semiconductor device with a wave-shaped trench or gate and method for manufacturing the same
01/30/2008CN101114646A Semiconductor device and method for fabricating the same
01/30/2008CN101114645A Integrated circuit and method for making the same
01/30/2008CN101114644A Layout architecture for a standard cell integrated circuit and forming method and digital system
01/30/2008CN101114643A Memory macro and circuit layout generating method
01/30/2008CN101114618A Photomask, active device array substrates and manufacturing method therefor
01/30/2008CN101114617A Flash memory and method for manufacturing the same
01/30/2008CN101114616A Capacitor contact structure and technique for dynamic random access memory
01/30/2008CN101114615A Structure and method to implement dual stressor layers with improved silicide control
01/30/2008CN101114596A MOSFET and manufacturing method thereof
01/30/2008CN101114585A Method of forming poly-si pattern, diode having poly-si pattern, multi-layer cross point resistive memory device having poly-si pattern, and method of manufacturing the diode and the memory device
01/30/2008CN101114570A Microlens, an image sensor including a microlens, method of forming a microlens and method for manufacturing an image sensor
01/30/2008CN101114520A Non-volatile memory device having pass transistors and method of operating the same
01/30/2008CN101114518A Sram device and operating method
01/30/2008CN101114099A Liquid crystal display and mfg. method therefor
01/30/2008CN101114098A Display device and a method for manufacturing the same
01/30/2008CN100366061C Solid photographic device and its driving method
01/30/2008CN100365936C Semiconductor integrated circuit
01/30/2008CN100365845C Displaying body, displaying panel and display
01/30/2008CN100365843C Spin switch and magnetic storage element using it
01/30/2008CN100365836C Nanowire light emitting device and method of fabricating the same
01/30/2008CN100365835C Flip-chip light emitting diode and method of manufacturing the same
01/30/2008CN100365827C Thin film transistor, circuit device and liquid crystal display
01/30/2008CN100365824C Electroluminescent display device and its driving method
01/30/2008CN100365823C Charge-transfer device
01/30/2008CN100365822C Cmos图像传感器 Cmos image sensor
01/30/2008CN100365821C Pseudo-mode for improving formation of microlens in image sensor
01/30/2008CN100365820C Solid-state image sensor, manufacturing method for solid-state image sensor, and camera
01/30/2008CN100365819C Flash memory structure and its preparation method
01/30/2008CN100365818C 3D polysilicon read only memory and preparation method
01/30/2008CN100365817C Non-volatile memory array structure
01/30/2008CN100365816C Capacitor element and method for fabricating the same
01/30/2008CN100365815C Non-volatile memory and method for manufacturing same
01/30/2008CN100365813C Stacking packaging structure for light sensitive chips and semiconductor chips
01/30/2008CN100365810C Diffusion and laser photoelectric coupling integrated circuit signal line
01/30/2008CN100365807C Plural semiconductor devices in monolithic flip chip
01/30/2008CN100365802C Method for manufacturing a flash memory device
01/30/2008CN100365800C Circuit layout structure
01/30/2008CN100365798C Electronic device, assembly and methods of manufacturing an electronic device
01/30/2008CN100365789C Method and apparatus for testing defective portion of semiconductor device
01/30/2008CN100365769C Semiconductor device and its manufacturing method
01/30/2008CN100365768C Flash memory with ultra thin vertical body transistors
01/30/2008CN100365734C MRAM arrangement
01/30/2008CN100365674C Flat panel display and method of fabricating the same
01/29/2008US7324397 Semiconductor integrated circuit
01/29/2008US7324384 Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout
01/29/2008US7324372 Storage device
01/29/2008US7324367 Memory cell and method for forming the same
01/29/2008US7324315 Protection device