Patents
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
04/2004
04/15/2004US20040072408 Methods of forming trench isolated integrated circuit devices including grooves, and trench isolated integrated circuit devices so formed
04/15/2004US20040072407 Ferroelectric capacitor memory device fabrication method
04/15/2004US20040072406 Structure and process for a capacitor and other devices
04/15/2004US20040072403 Method of manufacturing semiconductor device
04/15/2004US20040072402 Semiconductor device and method of fabricating the same
04/15/2004US20040072401 Method for forming capacitor
04/15/2004US20040072399 Method for fabricating BiCMOS transistor
04/15/2004US20040072393 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
04/15/2004US20040072391 Contactless uniform-tunneling separate p-well (cusp) non-volatile memory array architecture, fabrication and operation
04/15/2004US20040072384 Infrared detector packaged with improved antireflection element
04/15/2004US20040072380 Light emitting device and method for manufacturing the same
04/15/2004US20040072098 Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device
04/15/2004US20040071879 Method of film deposition, and fabrication of structures
04/15/2004US20040071875 Ferroelectric property, and therefore, it can be advantageously used in an electric or electronic device
04/15/2004US20040071189 Temperature measuring sensor incorporated in semiconductor substrate, and semiconductor device containing such temperature measuring sensor
04/15/2004US20040071034 Electrically isolated pillars in active devices
04/15/2004US20040071030 Semiconductor integrated circuits, fabrication method for the same and semiconductor integrated circuit systems
04/15/2004US20040071026 Semiconductor integrated circuit device operating with low power consumption
04/15/2004US20040071025 Flash memory device and fabricating method therefor
04/15/2004US20040071022 ROM embedded DRAM with dielectric removal/short
04/15/2004US20040071020 Multi-level flash EEPROM cell and method of manufacture thereof
04/15/2004US20040071011 Semiconductor memory device and control method and manufacturing method thereof
04/15/2004US20040071008 Contactless uniform-tunneling separate p-well (CUSP) non-volatile memory array architecture, fabrication and operation
04/15/2004US20040070918 Variable capactor structure and method of manufacture
04/15/2004US20040070902 Polycrystalline silicon diode string for ESD protection of different power supply connections
04/15/2004US20040070901 Electrostatic discharge protection circuit
04/15/2004US20040070900 Electrostatic discharge protection device for mixed voltage interface
04/15/2004US20040070893 Microtransformer for system-on-chip power supply
04/15/2004US20040070809 Self light emitting display device
04/15/2004US20040070808 Electro-optical device, method of manufacturing the same, and electronic apparatus
04/15/2004US20040070697 Method of forming an active matrix display
04/15/2004US20040070427 Semiconductor integrated circuit device having a leakage current cutoff circuit, constructed using MT-CMOS, for reducing standby leakage current
04/15/2004US20040070425 Semiconductor integrated circuit device having power reduction mechanism
04/15/2004US20040070421 Programmable logic devices with silicon-germanium circuitry and associated methods
04/15/2004US20040070407 Fingerprint detector with improved sensing surface layer
04/15/2004US20040070383 Integrated circuit driver having stable bootstrap power supply
04/15/2004US20040070336 Luminescent display and a method producing the same
04/15/2004US20040070335 Oled device having improved light output
04/15/2004US20040070332 Method of designing an OLED display with lifetime optimized primaries
04/15/2004US20040070315 Less-dust-generative piezoelectric/electrostrictive device and manufacturing method
04/15/2004US20040070312 Integrated circuit and process for fabricating the same
04/15/2004US20040070082 Method for manufacturing an interconnected circuit board assembly and system
04/15/2004US20040070076 Semiconductor chip package for image sensor and method of the same
04/15/2004US20040070063 Three dimensional structure integrated circuit
04/15/2004US20040070054 IC chip and semiconductor device
04/15/2004US20040070050 Structures of vertical resistors and FETs as controlled by electrical field penetration and a band-gap voltage reference using vertical FETs operating in accumulation through the field penetration effect
04/15/2004US20040070048 Etch-back or undercutting of the thin film resistor associated with wet etching reduced or eliminated completely, resulting in decreased width reduction and decreased variation in the overall width
04/15/2004US20040070047 Power semiconductor device
04/15/2004US20040070043 CMOS image sensors
04/15/2004US20040070039 Reduce the in-plane photoelectric conversion portion characteristic distribution that is created in forming color filters by a common photolithography; good uniformity between exposure regions in image
04/15/2004US20040070034 Semiconductor device and method of forming the same
04/15/2004US20040070033 Semiconductor device with resistor pattern and method of fabricating the same
04/15/2004US20040070032 LSI device and manufacturing method of the above
04/15/2004US20040070029 Low voltage transient voltage suppressor and method of making
04/15/2004US20040070026 Semiconductor integrated circuit
04/15/2004US20040070025 NROM memory cell
04/15/2004US20040070024 MOSFET with a thin gate insulating film
04/15/2004US20040070023 Semiconductor device and method of manufacturing the same
04/15/2004US20040070022 EEPROM and EEPROM manufacturing method
04/15/2004US20040070021 Flash memory array with increased coupling between floating and control gates
04/15/2004US20040070020 Nonvolatile semiconductor memory device and method for operating the same
04/15/2004US20040070019 Integrated circuit metal-insulator-metal capacitors including hemispherical grain lumps
04/15/2004US20040070018 Semiconductor memory circuitry
04/15/2004US20040070016 Methods of forming semiconductor constructions
04/15/2004US20040070015 Ferroelectric device and method for making
04/15/2004US20040070008 High speed dual-port memory cell having capacitive coupling isolation and layout design
04/15/2004US20040070005 Compact high voltage ESD protection diode
04/15/2004US20040069998 Solid-state imaging apparatus and manufacturing method thereof
04/15/2004US20040069995 Feedback enhanced light emitting device
04/15/2004US20040069991 Perovskite cuprate electronic device structure and process
04/15/2004US20040069990 Charge storage region comprises a tunneling dielectric located adjacent to the active layer, a blocking dielectric located adjacent to the gate electrode and a charge storage dielectric located between the tunneling and blocking dielectrics
04/15/2004US20040069989 With vertical transistors; also detecting word lines in a wafer with a scribe line region and a memory region
04/15/2004US20040069987 Organic electroluminescence panel
04/15/2004US20040069986 Dual panel-type organic electroluminescent display device
04/15/2004US20040069982 Compositionally modified resistive electrode
04/15/2004US20040069929 Output-compensating device for image sensor
04/15/2004US20040069608 Switch and method for manufacturing the same
04/15/2004US20040069289 Ignition device of internal combustion engine
04/15/2004DE3736379B4 Gepulster Komparator hoher Verstärkung Pulsed high-gain comparator
04/15/2004DE10346002A1 Etching resist layer, e.g. to make capacitor, forms intermediate layer and opening, coats resist over them and patterns resist in shape of opening for etching
04/15/2004DE10344862A1 Verfahren zur Herstellung eines dicken Isolationskragens mit reduzierter Länge A method for producing a thick insulating collar with reduced length
04/15/2004DE10334836A1 Halbleiterwafer und ein entsprechendes Herstellungsverfahren Semiconductor wafer, and a corresponding production method
04/15/2004DE10311824A1 Periphere Schaltkreisstruktur eines Halbleiterbauelements Peripheral circuit structure of a semiconductor device
04/15/2004DE10246368A1 Kameramodul und Verfahren zum elektronischen Aufnehmen von Bildern Camera module and method for electronically capturing images
04/15/2004DE10245153A1 Integrierter Feldeffekttransistor mit zwei Steuerbereichen, Verwendung dieses Feldeffekttranistors und Herstellungsverfahren Integrated field-effect transistor having two control areas, the use of this manufacturing method and Feldeffekttranistors
04/15/2004DE10244889A1 Signal transmission device for digital information transfer or measuring has tunnel magnetoresistive elements forming a chain of individual elements
04/15/2004DE10196819T5 Implantierte verdeckte Verbindungen in einer Halbleitervorrichtung zum Schutz gegen reverse engineering Implanted hidden connections in a semiconductor device for protection against reverse engineering
04/15/2004CA2499965A1 Large-area nanoenabled macroelectronic substrates and uses therefor
04/15/2004CA2499950A1 Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
04/15/2004CA2499944A1 Integrated displays using nanowire transistors
04/14/2004EP1408722A1 Method of designing an oled display with optimized lifetime
04/14/2004EP1408612A1 Integrated circuit driver with stable bootstrap power supply
04/14/2004EP1408563A2 Cascaded organic electroluminescent devices with improved voltage stability
04/14/2004EP1408561A2 Less-dust-generative piezoelectric/electrostrictive device and manufacturing method
04/14/2004EP1408558A1 Photoelectric conversion device
04/14/2004EP1408556A2 Image pickup device and portable terminal equipped therewith
04/14/2004EP1408555A2 Method of fabricating variable length vertical CMOS transistors
04/14/2004EP1408551A1 Method for producing bonding wafer
04/14/2004EP1408550A1 Array of cells including a selection bipolar transistor and fabrication method thereof
04/14/2004EP1408549A1 Process for manufacturing an array of cells including selection bipolar junction transistors