Patents
Patents for C25F 7 - Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating (2,484)
06/2004
06/01/2004US6743349 Electrochemical machining method and apparatus
05/2004
05/27/2004WO2004044273A1 Electropolishing system and process
05/26/2004EP1228267B1 Process and apparatus for cleaning and/or coating metal surfaces using electro-plasma technology
05/26/2004CN1499168A Movable type cathode and meters with measuring functions for expanding deep bore
05/20/2004US20040094403 Integrated plating and planarization apparatus having a variable-diameter counterelectrode
05/19/2004EP1419523A1 Dummy structures to reduce metal recess in electropolishing process
05/19/2004CN1498291A Electrolytic recycling device
05/19/2004CN1497068A Electrochemical covering layer removal controlled by single-loop
05/12/2004EP1418256A2 A method for partially stripping a coating from the surface of a substrate, and related apparatus and compositions
05/12/2004EP1418255A1 Electrochemical Process for the Simultaneous Stripping of Diverse Coatings From a Metal Substrate
05/12/2004EP1351782A4 Biological cleaning system
05/12/2004CN2614825Y Electric etching marking machine on metal objects utilizing high-frequency transformer
05/12/2004CN1495296A Electroplating method and device for wire stock, and electroplate wire stock
05/06/2004WO2003024172A8 A method of etching copper on cards
05/06/2004US20040084317 Periodic vibration of spatial position of cathode electrode, lamp, and/or targe substrate holder
05/05/2004CN1494736A Anodization apparatus and method
04/2004
04/28/2004EP1412546A1 A method for the removal of metals from an aqueous solution using lime precipitation
04/28/2004EP1051544B1 Process chamber and method for depositing and/or removing material on a substrate
04/27/2004US6726830 Steel strip descaling apparatus and a steel strip manufacturing apparatus using the descaling apparatus
04/27/2004US6726815 Electrochemical etching cell
04/22/2004WO2004034452A1 Electrolytic processing apparatus
04/22/2004WO2004033765A1 Electrode for electrolytic processing
04/22/2004WO2004033384A1 Method and system for removing thin metal film
04/22/2004WO2003060963A3 Electrochemical edge and bevel cleaning process and system
04/22/2004WO2003030223A3 Substrate processing apparatus and method
04/22/2004WO2003029531A3 Electrolytic processing apparatus and method
04/22/2004US20040074783 Method for partially stripping a coating from the surface of a substrate, and related articles and compositions
04/21/2004CN1491426A Integrated system for processing semiconductor wafers
04/21/2004CN1146966C Methods and appts. for electropolishing metal intennections on semiconductor devices
04/20/2004US6723224 Electro-chemical polishing apparatus
04/15/2004US20040069748 Electrochemical process for the simultaneous stripping of diverse coatings from a metal substrate
04/13/2004US6720263 Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection
04/09/2004CA2444177A1 The electrical process for the simultaneous stripping of diverse coatings from a metal substrate
04/07/2004EP1405935A2 Control loop for use in electrochemical stripping
04/01/2004US20040060827 Electrometer for measuring a potential between coated part and reference electrode; comparing voltage output signal to set point voltage
03/2004
03/31/2004CN1486362A Biological cleaning system
03/30/2004US6712668 System and method for electropolishing nonuniform pipes
03/25/2004DE10241619A1 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated
03/18/2004WO2004022814A2 Device and method for electrolytically treating an at least superficially electrically conducting work piece
03/18/2004US20040050715 Electrolyte mixture of alkylene glycol and chloride salt; etching using hydrogen fluoride; recovering, reuse
03/17/2004EP1397828A1 Electrolytic processing device and substrate processing apparatus
03/11/2004WO2004020148A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/04/2004US20040043608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
03/04/2004US20040043582 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
03/04/2004US20040040865 Process and apparatus for the superficial electrolytic treatment of metal strips
03/04/2004US20040040863 Dissolving, etching, polishing; using electrolytic cells
03/03/2004EP1392889A1 Anode assembly and process for supplying electrolyte to a planar substrate surface
02/2004
02/26/2004WO2004017384A1 Device for etching semiconductors with a large surface area
02/26/2004US20040035712 An electrical apparatus comprising tank, chucks, shaft and drives, for electrodepositing a copper layer on a substrate, cleaning or etching, uniformity deposition from a solution
02/24/2004US6695962 Used to deposit, polish, or electro-polish metal films on a substrate, or to remove such metal films from such a substrate
02/17/2004US6693365 Local electrochemical deplating of alignment mark regions of semiconductor wafers
02/12/2004DE10235020A1 Device for etching large surface semiconductor wafers in a trough-shaped receiver containing a liquid electrolyte used in semiconductor manufacture comprises a testing head provided with a device for holding at least one wafer
02/11/2004CN1473965A Method and its device for connection electric continuous electrolytic corrosion between metal belts
02/05/2004DE19837126B4 Verfahren und Vorrichtung zur elektrischen oder elektrochemischen Manipulation von Proben Method and apparatus for electrical or electrochemical manipulation of samples
02/05/2004DE10234136A1 Process for the electrochemical micro-processing of a workpiece comprises changing the current field formed by electrodes in an electrolytic liquid by changing the current
02/05/2004DE10234122A1 Device for electrochemically processing a workpiece for electrophoretic or galvanic deposition comprises separately arranged electrodes which are impinged with a current produced by a current source
02/05/2004DE10232612A1 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses Apparatus and method for monitoring an electrolytic process
02/04/2004EP1386695A2 Conductive polishing article for electrochemical mechanical polishing
02/04/2004EP1222321B1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
02/04/2004EP1220729B1 Method and tool for electrochemical machining
01/2004
01/29/2004WO2004010477A2 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
01/29/2004CA2491951A1 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
01/22/2004WO2004007811A2 Device and method for monitoring an electrolytic process
01/22/2004US20040011666 Positioning the counterelectrodes opposite the metal layer and spaced from metal layer and spaced from each other; passing an electric current for selectively removing a layer of electrolytically dissoluble metal from a substrate
01/21/2004EP1381491A2 Conductive polishing article for electrochemical mechanical polishing
01/20/2004US6679980 Apparatus for electropolishing a stent
01/15/2004US20040007478 Electroetching system and process
01/08/2004WO2004003260A1 Electrochemical method for cleaning the surfaces of metallic work pieces and cleaning electrode
01/08/2004US20040004006 Selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric interconnect
01/08/2004DE20317381U1 Electrogalvanic apparatus for galvanically pickling, etching and/or electrolytically inscribing metallic surfaces comprises a tubular housing with a cylindrical casing having four sides
12/2003
12/24/2003WO2003106090A1 Electrolytic etching of metal layers
12/24/2003CN1463467A Electrolytic processing device and substrate processing appts.
12/23/2003US6666959 Semiconductor workpiece proximity plating methods and apparatus
12/18/2003WO2003105546A1 Method and device for treating flat and flexible work pieces
12/11/2003WO2003008336A3 Reverse osmosis pretreatment using low pressure filtration
12/11/2003US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
12/10/2003EP1369099A2 Improvements in stent manufacture
12/10/2003EP1368848A2 Regenerative electrochemical cell system and method for use thereof
12/09/2003US6660156 Pipe electropolishing apparatus using an electrolyte heater and cooler
12/09/2003US6660138 Electropolishing process means for an inner surface of a long tube
11/2003
11/27/2003WO2003098676A1 Substrate processing apparatus and substrate processing method
11/27/2003WO2003098673A1 Polishing method and polishing system, and method for fabricating semiconductor device
11/27/2003US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/26/2003CN1458671A Conductive polishing article for electrochemical mechanical polishing
11/20/2003WO2003095704A1 Descaling method and descaling apparatus
11/20/2003US20030213703 Method and apparatus for substrate polishing
11/19/2003EP1362934A1 Method for removing a hard material layer deposited on a hard metal workpiece, and a fixing device for at least one workpiece
11/13/2003WO2003092891A1 Device and method for increasing mass transport at liquid-solid diffusion boundary layer
11/13/2003WO2003011521B1 Electro-chemical polishing apparatus
11/13/2003US20030209448 Forming grooves; fluid flow; polishing surfaces
11/13/2003US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits
11/13/2003US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/13/2003DE10019713C2 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems
11/12/2003EP1361023A2 Polishing articles for electrochemical mechanical polishing of substrates
11/12/2003EP1360348A1 Method and apparatus for controlling thickness uniformity of electroplated layer
11/12/2003CN1127587C Technology for electrolytically polishing net of stainless steel wire and its precial equipment
11/06/2003WO2003090965A1 Polishing method, polishing device, and method of manufacturing semiconductor equipment
11/06/2003US20030205484 Electrochemical/ mechanical polishing
11/05/2003CN1454266A Anode assembly for plating and planarizing a conductive layer
11/04/2003CA2191225C Strip treating apparatus
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