Patents
Patents for C25F 7 - Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating (2,484)
12/2004
12/23/2004US20040256238 Capable of increasing the in-plane uniformity of film thickness by making a more uniform electric field distribution over the entire surface to be processed, even if the substrate has a large area, and more uniformly controlling the speed
12/23/2004US20040256237 Ion exchanger between a pair of electrodes and a section for supplying a liquid to the ion exchanger; can flatten or clean a workpiece, especially a semiconductor wafer, while eliminating or reducing a load upon a CMP treatment
12/22/2004EP1489204A1 Electrochemical machine and electrochemical machining method
12/21/2004US6833063 Electrochemical edge and bevel cleaning process and system
12/16/2004WO2004108358A2 Conductive polishing article for electrochemical mechanical polishing
12/16/2004US20040253810 Dummy structures to reduce metal recess in electropolishing process
12/09/2004US20040245119 Dispensing an electrolyte through an opening that is at least as long as the wafer and effecting relative movement between the opening and the wafer; wafer can be moved linearly across the opening and can also be rotated
12/08/2004CN1554215A A method of etching copper on cards
12/02/2004US20040238481 Rotating wafer chuck with sufficient speed that electrolyte fluid flows towards edge; eliminates unwanted metal removal and overpolishing
12/01/2004EP1481116A1 Conveyorized horizontal processing line and method of wet-processing a workpiece
12/01/2004EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
12/01/2004EP1230441B1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method
12/01/2004CN1551931A Method and apparatus for controlling thickness uniformity of electroplated layers
11/2004
11/25/2004US20040231994 Includes an anode, a mask with openings supported between the anode and the wafer surface defining active regions by which a rate of conductive material deposition onto the surface can be varied, a conductive mesh below the upper mask surface, and an electrolyte
11/25/2004US20040231989 Substrate processing appartus and method
11/24/2004EP1480252A1 Apparatus for treatment of semiconductor wafer
11/23/2004US6821409 Electroetching methods and systems using chemical and mechanical influence
11/23/2004US6821407 Anode and anode chamber for copper electroplating
11/18/2004WO2004099469A2 High resolution electrolytic lithography, apparatus therefor and resulting products
11/18/2004US20040226654 Substrate processing apparatus and substrate processing method
11/18/2004DE10210538B4 Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut Horizontal continuous flow system and method for electroplating treatment of treated
11/17/2004CN1547763A Dummy structures to reduce metal recess in electropolishing process
11/11/2004WO2004097078A1 Electrolytic processing apparatus and method
11/10/2004EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
11/10/2004CN2654622Y Running water mould electrolysis carving machine
11/04/2004WO2004094107A1 Conductive polishing pad with anode and cathode
11/04/2004US20040217013 Apparatus and method for electropolishing a metal wiring layer on a semiconductor device
11/03/2004EP1472710A1 Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon
11/03/2004EP1169162B1 Method and apparatus for plating and polishing a semiconductor substrate
11/02/2004US6811658 Apparatus for forming interconnects
10/2004
10/28/2004US20040214510 Conductive polishing pad with anode and cathode
10/28/2004US20040211664 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
10/28/2004US20040211662 Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface
10/27/2004EP1470576A1 Electrolytic processing apparatus and substrate processing apparatus and method
10/27/2004EP1470269A1 Electrolytic processing apparatus and method
10/26/2004US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing
10/21/2004US20040206634 Electrolytic processing apparatus and substrate processing apparatus and method
10/20/2004EP1467840A1 Process control in electro-chemical mechanical polishing
10/14/2004US20040200733 Method and apparatus for substrate polishing
10/14/2004US20040200728 Improved flatness when fine and large holes are present in the surface of a substrate and when subsequent chemical mechanical polishing is used; plating a film of a conductive material on the substrate surface in a plating liquid and electrolytic-etching a surface of the plated film formed
10/12/2004US6802955 Polishing pad, platen comprising first conductive layer in contact with polishing pad for coupling to first potential, second conductive layer for coupling to second potential, insulating layer, electrical contact, electrolyte reservoir
10/12/2004US6802946 Apparatus for controlling thickness uniformity of electroplated and electroetched layers
10/07/2004US20040195183 Forming easy to filter precipitates of metal hydroxide and gypsum; using multistage neutralizations and recirculation to produce separate crystals; suitable for neutralization of pickling waste from steel refining
10/07/2004US20040195111 Performs uniform electrodeposition and electroetching
10/07/2004US20040195109 Electrochemical machining method and apparatus
10/07/2004US20040195104 Method and apparatus for controlling concentration of electrolytic solution
10/06/2004EP1309740B1 Elastic contact element
10/06/2004CN1535321A Method for removal of metal from aqueous solution using lime precipitation
10/05/2004US6800181 Device for cleaning jewelry
09/2004
09/30/2004WO2004083494A1 Composite machining device and method
09/30/2004US20040188259 Design of deposits to ajust for defects in working surfaces; electrochemistry
09/30/2004US20040188244 Electro-chemical machining apparatus
09/28/2004US6797623 Methods of producing and polishing semiconductor device and polishing apparatus
09/28/2004US6797132 Apparatus for plating and polishing a semiconductor workpiece
09/23/2004US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing
09/23/2004US20040182715 Process and apparatus for air bubble removal during electrochemical processing
09/23/2004US20040182712 Process and system for eliminating gas bubbles during electrochemical processing
09/22/2004CN1531473A Conductive polishing article for electrochemical mechanical polishing
09/22/2004CN1530472A Improvement of electric paste etching frame
09/16/2004WO2004078411A2 Method and apparatus for local polishing control
09/16/2004US20040178061 Comprehensive cleaning device for jewelry and the like
09/15/2004EP1456868A2 Electrochemical process and system for cleaning edge and bevel of workpieces
09/15/2004EP1222321B8 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
09/15/2004CN1529769A Anode Assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte
09/09/2004US20040173461 Method and apparatus for local polishing control
09/08/2004EP1453991A1 Electrolytic processing apparatus and method
09/07/2004US6787008 Hydrogen generating cell with cathode
09/02/2004WO2004073926A1 Polishing article for electro-chemical mechanical polishing
09/02/2004US20040168926 Electrodeposition; supplying solution; rotating wafers
08/2004
08/31/2004US6783658 Electropolishing method
08/26/2004US20040163963 Filter divides internal housing volume; fluid flow to second chamber is higher speed than to first chamber; flows are blended in second chamber; rotates at controlled speed
08/26/2004DE10235020B4 Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben Apparatus and method for etching large-surface semiconductor wafers
08/25/2004EP1448812A1 Hydrogen generating cell with cathode subassembly construction
08/25/2004EP1448811A1 Method and device for regenerating ion exchanger, and electrolytic processing apparatus
08/25/2004CN1523647A Apparatus for electropolishing metal interconnections on semiconductor devices
08/19/2004US20040159558 Electricoconductive compound formed into layer comprising mixture of polymer and filler; semiconductors, integrated circuits
08/18/2004EP1446514A1 Electropolishing assembly and methods for electropolishing conductive layers
08/17/2004US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode
08/17/2004US6776884 Electropolishing process means for inner and outer surfaces of a metal
08/10/2004US6773576 Anode assembly for plating and planarizing a conductive layer
08/05/2004WO2004065665A1 Method and devices for electrochemical treatment of articles
08/05/2004WO2004065049A1 System and method for holding and releasing a workpiece for electrochemical machining
08/05/2004US20040149592 Electropolishing apparatus and polishing method
07/2004
07/28/2004CN1515704A Strip processing device
07/22/2004US20040140224 Plenum located within holder has proximal end capable of being removably coupled; piston is configured to move upward in plenum and to lift workpiece off
07/22/2004DE10241619B4 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated
07/15/2004US20040134793 for plating conductive material on semiconductor substrate by rotating pad/blade/anode; eliminates dishing and voids; for production of integrated circuits
07/15/2004US20040134792 electroplating; ball assemblies comprises interior housing, annular seat, conductive adapter, and coupled conductive contact
07/14/2004CN1157505C Electrode structure, electrolytic etching process and apparatus using same
07/13/2004US6761807 Molded tooling for use in airfoil stripping processes
07/08/2004WO2004007811A3 Device and method for monitoring an electrolytic process
07/01/2004US20040123949 Method and apparatus for on-demand stencil chemical etch direct parts marking automation and carrier for chemical etch stencil mesh
06/2004
06/30/2004EP1432852A2 Electrolytic processing apparatus and method
06/30/2004EP1356138B1 Process and apparatus for the superficial electrolytic treatment of metal strips
06/30/2004CN1155737C Method of preparing zinc plating solvent by utilizing waste liquid
06/17/2004US20040112761 Method and device for regenerating ion exchanger, and electrolytic processing apparatus
06/15/2004US6749728 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
06/10/2004US20040108277 Waste water treatment; precipitation, floculation
06/09/2004EP1425948A2 A method of etching copper on cards
06/02/2004CN1500917A The electrical process for the simultaneous stripping of diverse coatings from a metal substrate
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