| Patents for C25F 7 - Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating (2,484) |
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| 07/06/2005 | CN1636267A Electrochemical edge and bevel cleaning process and system |
| 06/30/2005 | WO2005059970A2 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| 06/29/2005 | CN1633525A Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 06/29/2005 | CN1632914A Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers |
| 06/23/2005 | US20050133380 Electroetching methods and systems using chemical and mechanical influence |
| 06/23/2005 | US20050133379 Electrode immersed in solution configured proximate to conductive layer having a longitudinal dimension extending to edge of wafer; elongated contact electrode configured to receive a potential difference; isolator, voltage supplier |
| 06/22/2005 | CN1630738A Transfer and insulation device for electrolysis |
| 06/22/2005 | CN1629365A High silicon content ferrous alloy electrode plate for pickling cells and method for making same |
| 06/21/2005 | US6908860 Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
| 06/16/2005 | US20050129996 Regenerative electrochemical cell system and method for use thereof |
| 06/09/2005 | WO2004111314A3 Algorithm for real-time process control of electro-polishing |
| 06/09/2005 | WO2004108358A3 Conductive polishing article for electrochemical mechanical polishing |
| 06/09/2005 | US20050124262 Processing pad assembly with zone control |
| 06/09/2005 | US20050121335 Electropolishing apparatus, electropolishing method, and method of manufacturing semiconductor device |
| 06/09/2005 | US20050121328 Reduces electrical resistance and power consumption during chemical mechanical polishing |
| 06/09/2005 | US20050121317 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 06/08/2005 | EP1536919A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 06/08/2005 | CN1625612A Electrolytic processing apparatus and method |
| 06/02/2005 | US20050115838 Electrolytic processing apparatus and method |
| 06/02/2005 | US20050115670 Method and device for etching a thin conductive layer which is disposed on an insulating plate such as to form an electrode network thereon |
| 06/01/2005 | CN1204300C Circuitry and method for electroplating plant or etching plant pulse power supply |
| 05/31/2005 | US6899797 Apparatus for continuous processing of semiconductor wafers |
| 05/26/2005 | WO2005047572A1 Electropolishing apparatus and method for medical implants |
| 05/26/2005 | US20050112868 Method and apparatus for localized material removal by electrochemical polishing |
| 05/26/2005 | US20050109636 Generation. conditioning , reuse of metal containing electrolytes; surface treatment; ion exchanging |
| 05/25/2005 | EP1533398A1 Process for producing an electrolyte ready for use out of waste products containing metal ions |
| 05/19/2005 | DE202005001666U1 Holder with clamping elements and two spring U-bolts, for current supply unit for electrolytic cleaning useful for electrolytic cleaning of oxide layers and annealing colors on welded joints in stainless steel components |
| 05/18/2005 | CN1617955A Method and apparatus for regenerating ion exchanger and electrolytic processor |
| 05/17/2005 | US6893328 Conductive polishing pad with anode and cathode |
| 05/12/2005 | US20050101138 System and method for applying constant pressure during electroplating and electropolishing |
| 05/12/2005 | US20050098444 Electropolishing apparatus and method for medical implants |
| 05/10/2005 | US6890416 Copper electroplating method and apparatus |
| 05/05/2005 | US20050092434 Dynamic polishing fluid delivery system for a rotational polishing apparatus |
| 05/03/2005 | US6887601 Regenerative electrochemical cell system and method for use thereof |
| 04/28/2005 | WO2005038096A1 Electrode device with integrated electrolyte supply for the surface treatment of metals |
| 04/28/2005 | US20050087439 Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| 04/27/2005 | EP1525609A1 Device for etching semiconductors with a large surface area |
| 04/26/2005 | US6884301 Immersing the substrate to be cleaned and treated in the biological cleaning and treating bath for a sufficient time to clean and treat the substrate; removing the cleaned and treated substrate from bath; repeating procedure |
| 04/21/2005 | US20050082257 applying a potential between cathode and a printed circuit that acts as an anode, immersed in electrolytes; electrolysis |
| 04/21/2005 | US20050082165 Electro-chemical machining apparatus |
| 04/14/2005 | US20050077188 Establishing electrically conductive path through electrolyte between exposed layer of barrier material on substrate and electrode, electrochemically removing portion of exposed layer during first processing step in barrier processing station, detecting endpoint, processing exposed barrier layer |
| 04/14/2005 | US20050077183 Anodic oxidation apparatus, anodic oxidation method, and panel for display device |
| 04/14/2005 | US20050076837 Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 04/14/2005 | DE10224817B4 Verfahren und Vorrichtung zum vertikalen Eintauchen von folienartigem Behandlungsgut in Bädern von Galvanisier- und Ätzanlagen Method and apparatus for vertical dipping sheet-treated in baths of electroplating and etching equipment |
| 04/13/2005 | EP1521868A2 Device and method for monitoring an electrolytic process |
| 04/06/2005 | CN1195906C Metal fine machining apparatus and method |
| 04/06/2005 | CN1195905C Process and device for electrolytic pickling of metallic strip |
| 04/06/2005 | CN1195879C Method of recovering metal from metal-containing sludge |
| 03/31/2005 | WO2005002794A3 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 03/31/2005 | US20050067289 Ion exchanger; surface smoothness; removing residues from workpiece |
| 03/30/2005 | EP1518008A1 Electrochemical method for cleaning the surfaces of metallic work pieces and cleaning electrode |
| 03/24/2005 | US20050061676 System for electrochemically processing a workpiece |
| 03/17/2005 | US20050059324 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 03/17/2005 | US20050056550 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 03/10/2005 | US20050051432 Electrolytic processing apparatus and method |
| 03/10/2005 | DE202004018048U1 Device for electrochemically processing workpieces comprises a cleaning unit consisting of a permeable flexible tube and through which contaminated electrolyte is conveyed under pressure, and a filtering auxiliary layer |
| 03/09/2005 | EP1512774A1 A method and apparatus for the electrodissolution of elements |
| 03/03/2005 | US20050045491 Alkylene glycol and alkali and/or alkaline earth chlorides; smoothness; lower cost and corrosion; environmentally friendly; recycling spent electrolyte |
| 03/03/2005 | DE10212436B4 Vorrichtung zur Behandlung von strangförmigem metallischen Gut und ihre Verwendung Apparatus for treating strand-metallic material and their use |
| 03/02/2005 | EP1510111A1 Method and device for treating flat and flexible work pieces |
| 03/02/2005 | CN1191605C Method and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 02/23/2005 | CN1585835A Electropolishing assembly and methods for electropolishing conductive layers |
| 02/17/2005 | US20050035001 Electrolytic processing apparatus and electrolytic processing method |
| 02/17/2005 | US20050034994 Method and apparatus for full surface electrotreating of a wafer |
| 02/17/2005 | US20050034976 Method and apparatus for plating and polishing semiconductor substrate |
| 02/16/2005 | EP1506572A1 Substrate processing apparatus and substrate processing method |
| 02/16/2005 | EP1506056A1 Device and method for increasing mass transport at liquid-solid diffusion boundary layer |
| 02/16/2005 | CN2679169Y Adsorption electrolytic bath bag |
| 02/10/2005 | WO2005012600A1 Electrolytic processing apparatus and electrolytic processing method |
| 02/10/2005 | US20050029122 purification of electrolytic polishing bath; loop feedback system; power source; controllers; for semiconductor wafer |
| 02/08/2005 | US6852208 Method and apparatus for full surface electrotreating of a wafer |
| 02/02/2005 | EP1502971A2 Improved process and device for cleaning metal surfaces |
| 01/27/2005 | WO2005008806A2 Photoelectrolysis of water using proton exchange membranes |
| 01/27/2005 | US20050020004 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates |
| 01/27/2005 | US20050016868 Providing a wafer electrical connection by holding the conductive surface against the surface of the belt pad, applying a potential difference between the electrode and the wafer electrical connection and establishing a relative motion between the surface of the belt pad and the wafer |
| 01/27/2005 | US20050016681 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
| 01/26/2005 | CN1572009A Process and device for etching a thin conducting layer deposited on an insulating plate, so as to form an array of electrodes thereon |
| 01/25/2005 | US6846227 Electro-chemical machining appartus |
| 01/20/2005 | WO2005006425A1 Electrolytic processing apparatus and electrolytic processing method |
| 01/20/2005 | WO2005005693A1 Process control methods of electropolishing for metal substrate preparation in producing ybco coated conductors |
| 01/20/2005 | WO2004099469A3 High resolution electrolytic lithography, apparatus therefor and resulting products |
| 01/13/2005 | WO2005002794A2 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 01/13/2005 | US20050006244 Electrode assembly for electrochemical processing of workpiece |
| 01/13/2005 | US20050005963 Photoelectrolysis of water using proton exchange membranes |
| 01/12/2005 | EP1495164A1 Comprehensive cleaning device for jewelry and the like |
| 01/11/2005 | US6841057 Conductive polishing pad and electrode having membrane disposed therebetween; membrane orientated relative to conductive pad in manner that facilitates removal of entrained gas from electrolyte flowing towards conductive pad |
| 01/06/2005 | WO2005000512A1 Rotation surface-reducing head, electrolytic surface-reducing device, and electrolytic surface-reducing method |
| 01/06/2005 | US20050000826 Process control methods of electropolishing for metal substrate preparation in producing YBCO coated conductors |
| 01/05/2005 | EP1492907A1 Electropolishing and/or electroplating apparatus and methods |
| 01/05/2005 | EP1492906A1 Transfer and insulation device for electrolysis |
| 01/04/2005 | US6837984 Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
| 01/04/2005 | US6837983 Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| 01/04/2005 | US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion |
| 12/30/2004 | US20040267351 Positioning a design on gig to form stent, immersion in liqud baths with electrolytes, electropolishing or electrodepositing |
| 12/29/2004 | WO2004113595A1 Portable electrolytic marking unit |
| 12/28/2004 | US6835300 Electropolishing solution and methods for its use and recovery |
| 12/23/2004 | WO2004111314A2 Algorithm for real-time process control of electro-polishing |
| 12/23/2004 | US20040259365 Polishing method polishing system and method for fabricating semiconductor device |
| 12/23/2004 | US20040256245 Moveable nozzle moves from a first to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion when the wafer is rotated by the wafer chuck; shorter polishing time and uses less quantity of slurry |
| 12/23/2004 | US20040256244 Selective electrochemical etching method for two-dimensional dopant profiling |