Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
01/2010
01/20/2010CN101630633A Substrate proximity processing structures and methods for using and making the same
01/20/2010CN100582318C Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
01/20/2010CN100582316C Method for preparing stable and dispersed composite plating solution used for carbon nanotube electro brush plating
01/20/2010CN100582314C Polish-plating machine
01/19/2010US7648621 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
01/19/2010CA2451600C Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus
01/14/2010WO2010005993A2 Low stress property modulated materials and methods of their preparation
01/14/2010WO2010005773A1 Underpotential deposition-mediated layer-by-layer growth of thin films
01/14/2010WO2010005475A1 Alkaline electrolyzer
01/14/2010WO2010005088A1 Electronic component and method for manufacturing the same
01/14/2010WO2009142864A3 Electroplating methods and chemistries for deposition of group iiia-group via thin films
01/14/2010WO2009083487A3 Method for obtaining a metal microstructure and microstructure obtained according to said method
01/14/2010US20100008621 Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby
01/14/2010US20100006447 Method of preparing an ultra sharp tip, apparatus for preparing an ultra sharp tip, and use of an apparatus
01/14/2010US20100006445 Electroplating method and apparatus
01/14/2010US20100006444 Plating apparatus and plating method for forming magnetic film
01/14/2010US20100006443 Electrochemical Fabrication Method for Producing Compliant Beam-Like Structures
01/14/2010DE102008032772A1 Corrosion resistant steel component, e.g. high pressure hydraulic line connecting component, is coated with zinc-nickel layer and friction reducing, protective wax layer
01/14/2010CA2730252A1 Low stress property modulated materials and methods of their preparation
01/14/2010CA2728173A1 Alkaline electrolyzer
01/13/2010EP2144274A1 Method of preparing an ultra sharp tip, apparatus for preparing an ultra sharp tip, and use of an apparatus
01/13/2010EP2143829A2 Control of electromagnetic signals of coins through multi-ply plating technology
01/13/2010EP2143822A1 Plated steel sheet for can and process for producing the same
01/13/2010EP2142685A1 Barrier layer and method for making the same
01/13/2010EP2142683A2 Conductive via formation
01/13/2010EP2142678A1 AMORPHOUS Fe100-a-bPaMb ALLOY FOIL AND METHOD FOR ITS PREPARATION
01/13/2010CN101624716A Method for pretreating aluminum tubes before electroplating
01/13/2010CN101624715A Process flow for selective thick-gold electroplating without gold plated lead
01/13/2010CN100580151C Sn crystal flower induced electrodeposition plaque-imitating copper crystal flower surface finishing process
01/13/2010CN100580142C Method for electrically plating Ti-Cu-Zn ternary alloy meeting three-prevention demand
01/13/2010CN100580139C One-step acid washing activating plating pre-processing technique for magnesium alloy surface
01/12/2010US7645494 Pre-plating surface treatments for enhanced galvanic-corrosion resistance
01/12/2010US7645371 Process of ceramic coating for silver or silver plated
01/12/2010US7645370 Pretreatment removal of fats; electroless plating
01/12/2010CA2349242C Electrodeposition of catalytic metals using pulsed electric fields
01/07/2010WO2010001208A2 Plated member and method of forming plating layer
01/07/2010WO2009055116A3 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
01/07/2010WO2009023628A3 Chromium-free pickle for plastic surfaces
01/07/2010US20100003474 Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter
01/07/2010US20100000871 Copper anode with a purity of 99.9-99.9999 wt % excluding gas components, and a crystal grain diameter of 100-2000 mu m.; generation of sludge in a copper sulfate bath is inhibited
01/06/2010EP2141750A2 Method of light induced plating on semiconductors
01/06/2010CN101622380A Production method and device of surface roughened copper plate, and surface roughened copper plate
01/06/2010CN101619476A Treatment process before plating environment-friendly copper alloy
01/06/2010CN101619475A Aluminum alloy electroplating method
01/06/2010CN101619474A Manufacturing method of zinc-nickel double-layer electroplating steel plate
01/06/2010CN101619473A Method for galvanizing workpiece surface for anticorrosion
01/06/2010CN101619472A Electroplating apparatus
01/06/2010CN100577891C Anodic oxidation method for raising rigidity and corrosion resistance of plated aluminum on surface of metal base
01/06/2010CN100577890C Method for improving uniformity of electrochemical plating films
01/05/2010US7641783 Process for electroplating for producing an iron platinum magnetic material having an especially strong coercive force and excellent properties by using electroplating solution containing ionic iron, ionic platinum, and a complexing agent
01/05/2010US7641782 Method and apparatus for improving corrosion resistance of chrome plated material
01/05/2010US7641781 External currentless and electrolytic deposition of one of nickel, cobalt and platinum in a deposition bath in which metallic particles including at least one of magnesium, titanium, and zinc are suspended, the metallic particles becoming occluded in coating; bath includes suspended particles of silicon
01/05/2010US7641776 System and method for increasing yield from semiconductor wafer electroplating
12/2009
12/31/2009US20090325333 Display device and method for manufacturing the same
12/31/2009US20090324992 Metal clad laminate and manufacturing method thereof
12/31/2009US20090324988 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
12/31/2009US20090321712 Plasmonic coupling devices
12/31/2009US20090321268 Electrodeposited film having sliding function and coated article therewith
12/31/2009US20090321267 Method for surface treating plastic products
12/31/2009US20090321123 Method for producing structured electrically conductive surfaces
12/31/2009US20090321113 High contrast transparent conductors and methods of forming the same
12/31/2009US20090321052 Method of Producing Body Having Flow Path Formed Therein, and Body Having Flow Path Formed Therein
12/31/2009US20090320884 Controls of ambient environment during wafer drying using proximity head
12/30/2009EP2139012A1 Silver-coated material for movable contact component and method for manufacturing such silver-coated material
12/30/2009EP2139009A1 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure
12/30/2009CN201372316Y Micropore plugging device for flexible printed circuit
12/30/2009CN201372315Y Rotating and swinging type cathode rack plating machine
12/30/2009CN101617068A Method for producing a catalyst layer
12/30/2009CN101613867A Preparation method of electrodepositing Bi2Te3 mixed with thin-film thermoelectric material
12/30/2009CN101613866A Pre-plating method and surface processing device
12/30/2009CN100575562C Method for surface electroplating of high-resistivity metallic oxide material
12/30/2009CN100575561C Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire
12/30/2009CN100575560C Connecting terminal
12/29/2009US7638028 Probe tip plating
12/24/2009US20090317746 Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
12/24/2009US20090317656 Aluminum alloy article with micro-arc oxide for film and method for making the same
12/24/2009US20090317590 Method for fabricating superhydrophobic surface and solid having superhydrophobic surface structure by the same method
12/24/2009US20090316335 Method for the Electrolytic Production of Self-Supporting Conductive Nanocomposite Elements
12/24/2009US20090314650 Process of package substrate
12/24/2009US20090314649 Precursor containing copper indium and gallium for selenide (sulfide) compound formation
12/24/2009US20090314648 Method of manufacturing stamper
12/24/2009DE102008046197B3 Degradierbares Implantat und Verfahren zu seiner Herstellung sowie deren Verwendung Degradable implant and method for its preparation and use thereof
12/24/2009DE102008029219A1 The method for flat printing and electric plating, comprises providing an article to be plated made of metallic or non-metallic materials and pre-plating for the formation of pre-plated metallic layer on surface of the article to be plated
12/23/2009WO2009153361A1 Method for electrochemically covering an insulating substrate
12/23/2009WO2009152896A1 Apparatus and process for the one-sided wet-chemical and/or electrolytic treatment of material
12/23/2009WO2009152640A1 Method for repairing the polar terminal of a lead-acid battery
12/23/2009WO2009127518A3 Method for the electrochemical coating of a substrate by brush plating and device for carrying out said method
12/23/2009EP2135974A1 Method of surface treatment for metal glass part, and metal glass part with its surface treated by the method
12/23/2009EP2135735A1 Slide member
12/23/2009EP2134889A2 Material system, and method for the production thereof
12/23/2009EP2134887A2 Method for the precision processing of substrates and use of said method
12/23/2009CN101611176A Electroforming method and part or layer obtained using said method
12/23/2009CN101608327A Novel conductive roller device
12/23/2009CN101608326A Method for directly electroplating lead on surface of aluminium and aluminium alloy
12/23/2009CN101608325A Spare part membrane-coating method before partially plating gold on reed
12/23/2009CN100574563C Metal pattern and process for producing the same
12/23/2009CN100572609C Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
12/17/2009WO2009150915A1 Electrolytic gold plating solution and gold film obtained using same
12/17/2009WO2009150083A1 Method for selectively depositing a precious metal on a substrate by the ultrasound ablation of a mask element, and device thereof
12/17/2009US20090311621 Support for planographic printing plate material, manufacturing method thereof, and planographic printing plate material employing the same
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