Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
12/2010
12/15/2010CN101918619A Highly electrically conductive surfaces for electrochemical applications
12/15/2010CN101918617A Method for obtaining a metal microstructure and microstructure obtained according to said method
12/15/2010CN101914796A Method for controlling semiconducting speed and degree of metal oxide material surface
12/15/2010CN101914795A Method for controlling diameters of coating grains on nickel-plated aluminum polar ear
12/15/2010CN101914794A Pulse plating experimental power supply
12/15/2010CN101914793A Printing method of metal patterns on surface of high-resistance metallic oxide material
12/15/2010CN101914792A Al-Cr alloy coating and preparation method thereof
12/15/2010CN101914789A Cyanide-free copper electroplating method
12/15/2010CN101914774A Bonding layer material having Re-Ni-Cr alloy diffusion barrier layer and preparation method thereof
12/15/2010CN101545126B Method for preparing surface coating of high chrome steel
12/15/2010CN101435097B Cyanideless metallic layer electroplating method for magnesium alloy surface
12/15/2010CN101054702B Method for manufacturing dimple on blood vessel metal support
12/15/2010CN101016634B Method of preparing metal roller with surface relief microstructure
12/14/2010US7851027 electrodeposition of chromium carbide coating ( a certain volume fraction of which is dispersed in cobalt matrix) on a substrate to form first layer, electrodepositing a 2nd layer of chromium carbide ( a volume fraction of which is dispersed in a cobalt matrix which is higher than volume fraction of 1st
12/14/2010US7850836 reduce the effective aspect ratio of the via and determine the magnitudes of the forward and reverse pulse currents of the subsequent pulse current cycle; forming copper vertically interconnected on 3-D wafer stacking; improve the hydrophilicity of the through-hole via towards an electrolyte
12/09/2010US20100310903 Electrodeposition of hard to deposit materials on aluminum and other substrates using improved water saving mercy cell
12/09/2010US20100310898 Plated steel sheet for cans and method for production of the same
12/09/2010US20100310297 Packaging device
12/09/2010US20100308451 Wiring substrate and method of manufacturing the same
12/09/2010US20100308448 Semiconductor Device and Method of Manufacturing the Same
12/09/2010US20100307926 Method and device for supplying electrical power
12/09/2010US20100307925 Copper filling-up method
12/09/2010US20100307924 Power control device of a power network of an electrochemical coating facility
12/09/2010US20100307923 Electrolytic Copper Plating Method, Pure Copper Anode for Electrolytic Copper Plating, and Semiconductor Wafer having Low Particle Adhesion Plated with said Method and Anode
12/09/2010US20100307804 Method for connecting a precious metal surface to a polymer
12/09/2010US20100307800 Anodised Aluminum, Dielectric, and Method
12/09/2010US20100307642 Method for Preparing Polycrystalline Structures Having Improved Mechanical and Physical Properties
12/08/2010EP2258013A2 Lithium-ion battery
12/08/2010EP2257498A2 Electrohydraulic and shear cavitation radial counterflow liquid processor
12/08/2010CN201665446U Horizontal loose sleeve
12/08/2010CN1920105B Method and apparatus for fluid processing a workpiece
12/08/2010CN1880515B Activation method for plastic substrate during electroplating of plastic surface
12/08/2010CN1864990B Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
12/08/2010CN101911257A ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer
12/08/2010CN101910301A Reinforced resin composition for plating base, molded article, and electroplated component
12/08/2010CN101906650A Preparation method of nickel-coated porous steel strip
12/08/2010CN101906648A Zinc-galvanizing once or twice electroplating method for preparing nickel-plating aluminium pole ears
12/08/2010CN101906630A Black surface treatment process of electrolytic copper foil
12/08/2010CN101608326B Method for directly electroplating lead on surface of aluminium and aluminium alloy
12/08/2010CN101603186B Preparation method of daisy-like structure consisting of silver nano bands
12/08/2010CN101554597B Method for preparing Pt/C nanometer catalyst and device thereof
12/08/2010CN101506409B Process and apparatus for plating articles
12/08/2010CN101358371B Method for preparing single structure ferricyanide film using single-stage pulse electrodeposition
12/08/2010CN101302635B Steel member acidic electroplating additive for copper pre-plating and pre-plating process
12/08/2010CN101300376B Device for the surface treatment of workpieces
12/08/2010CN101288165B Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays
12/08/2010CN101283119B Method of surface treatment for the inhibition of whiskers
12/08/2010CN101054701B Method of increasing electroplating evenness
12/07/2010US7846506 Metal coatings for reduced friction in composites
12/07/2010US7846318 Polyaluminum chloride and aluminum chlorohydrate, processes and compositions: high-basicity and ultra high-basicity products
12/07/2010US7846317 Processing a printed wiring board by single bath electrodeposition
12/02/2010WO2010136383A1 Method for producing a flat steel product and flat steel product
12/02/2010US20100304172 Electrodeposited metallic-materials comprising cobalt
12/02/2010US20100304171 Metal-clad polymer article
12/02/2010US20100304065 Metal-clad polymer article
12/02/2010US20100304063 Metal-coated polymer article of high durability and vacuum and/or pressure integrity
12/02/2010US20100302803 Illumination devices and methods of fabrication thereof
12/02/2010US20100301276 Method of preparing bundle type silicon nanorod composite through electroless etching process using metal ions and anode active material for lithium secondary cells comprising the same
12/02/2010US20100301010 ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo
12/02/2010US20100301004 Fabrication of metallic stamps for replication technology
12/02/2010US20100300889 Anodically assisted chemical etching of conductive polymers and polymer composites
12/02/2010US20100300887 Preparing Electrodes for Electroplating
12/02/2010US20100300884 Electro-deposited passivation coatings for patterned media
12/01/2010EP2256231A1 Plated steel sheet for can and process for producing the plated steel sheet
12/01/2010CN201660703U Lead wire framework electric plating material claming detector
12/01/2010CN201660698U Metal button
12/01/2010CN101903566A Metallic structures with variable properties
12/01/2010CN101899700A Preparation method of ultrasonic microarc oxidation silver-carrying antibiotic bioactive coating on magnesium and titanium surface
12/01/2010CN101899698A Plating process of slip rings
12/01/2010CN101899696A Preparation method of nickel-plated aluminum tab
12/01/2010CN101899695A Method for preparing nickel-plated aluminum tab by two-step electroplating
12/01/2010CN101899694A Preparation method of bright nickel-plated aluminum lug
12/01/2010CN101899693A Method for locally plating rhenium on oxygen-free copper matrix
12/01/2010CN101899692A Electroless copper plating method for helical line for travelling wave tube
12/01/2010CN101899691A Method for electroplating stannum-cerium-bismuth alloy on microwave high-frequency circuit board
12/01/2010CN101899690A Multi-porous alloy material and method for preparing same
12/01/2010CN101899664A Electroplating method
12/01/2010CN101649475B Plating method for preventing hydrogen bubbles of copper-tin alloy plating layer
12/01/2010CN101575726B Method for preparing bioactive gradient film of fluor-hydroxyapatite
12/01/2010CN101545123B Method for non-cyanide copper electroplating of steel parts
12/01/2010CN101525761B 电镀方法 Electroplating method
12/01/2010CN101478038B Process for preparing lithium ionic cell tin negative pole material by electrodepositing-hydrothermal process
11/2010
11/30/2010US7843201 Method of testing light metal parts, in particular aluminum components, which have been coated by anodising, in particular by TSA anodising
11/30/2010US7842636 contains carrier particles and water-soluble or water-dispersible organic compounds, polyurethanes; electrolytic or electroless plating of metal or metal alloys; printed circuits, wiring boards, resistors, capacitors
11/30/2010US7842176 electroless plating; coating of color filter dyes, pigments, or conductive photoresistive material; electroless plating
11/30/2010US7842170 Device for selective plating of electrical contacts for connectors
11/30/2010US7842169 Method and apparatus for local polishing control
11/25/2010WO2010102808A3 Workpiece with two nickel-containing layers
11/25/2010WO2010102807A3 Workpiece having two nickel-containing layers
11/25/2010US20100298135 Porous aluminum oxide templates
11/25/2010US20100297904 Ultrahydrophobic substrate provided on its surface with metallic nanoparticles, method of production and use of same
11/25/2010US20100297465 Surface-treated steel sheet, process for producing the same, and resin-coated steel sheet
11/25/2010US20100296227 Solid electrolytic capacitors with improved reliabiilty
11/25/2010US20100295225 Method and apparatus for fluid processing a workpiece
11/25/2010US20100294668 Coating for decorative metals with improved mar and scratch resistance and methods of application
11/25/2010US20100294538 Plastic Lead Frame with Reflection and Conduction Metal Layer and Fabrication Method of the Same
11/25/2010DE102009023765A1 Method for chemical and electrolytic treatment of good such as printed circuit boards and conductor film with fluid jets in continuous treatment plant or band system, comprises guiding the fluid jet on the surface of the goods
11/24/2010EP2252727A2 Nanowire structural element
11/24/2010CN201648541U Nozzle for high speed electric spraying of ring-shaped work pieces
11/24/2010CN201648540U Brushing electroplating repairing device of thin-wall aluminum products
1 ... 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 ... 179