Patents for C25D 5 - Electroplating characterised by the process; Pretreatment or after-treatment of workpieces (17,883)
10/2009
10/08/2009WO2009121443A1 Structured chrome solid particle layer and method for the production thereof
10/08/2009WO2001004928A3 Improved apparatus and method for plating wafers, substrates and other articles
10/08/2009US20090253573 Catalyst composition and deposition method
10/08/2009US20090250354 Pre-Treatment Method for Plating and Instrument for Waterworks of Lead-Contained Copper Alloy
10/08/2009US20090250353 Nanoporous Material
10/08/2009US20090250352 Methods for electroplating copper
10/08/2009US20090250351 Method for producing a hard coating with high corrosion resistance on articles made of anodizable metals or alloys
10/08/2009US20090249893 Measuring device including a layer of a magnetoelastic alloy and a method for production thereof
10/07/2009EP1560949B1 Integrated plating and planarization process and apparatus therefor
10/07/2009CN101553530A Resin composition for metal plating, molded article thereof, and metal-plated molded article
10/07/2009CN101550578A Microporous plugging device of flexible circuit board
10/07/2009CN101550577A Electroplating method of zinc-nickel alloy nano multilayer film
10/07/2009CN101550576A Zinc-nickel alloy nano multilayer film
10/07/2009CN101550575A A workpiece jig used for selective plating of workpieces
10/07/2009CN101550574A Selective plating device
10/07/2009CN101550571A Electroplating solution containing gold for partly electroplating
10/07/2009CN101550568A Method for plating nano nickel layer on metal workpiece
10/07/2009CN100548090C Method for preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
10/07/2009CN100547120C Method for producing electroplating button of mobile phone
10/06/2009US7597933 Coating a plastic substrate with a fluid containing a conductive metal powder and pressure-treating; polishing the coating to prevent dust from forming; electroless- or electrodeposition to plate and fix the image; labels; markings; shields to protect from electromagnetic waves
10/06/2009US7596855 Method for manufacturing a magnetic head
10/01/2009US20090243584 Fabrication of microstructures integrated with nanopillars along with their applications as electrodes in sensors
10/01/2009US20090242417 forming an electrode catalyst layer comprising precious metals and precious metal oxides, on a surface of metal oxide interlayer; heat sintering is 550 degrees Celsius or more; oxidation; higher density, higher electrolysis corrosion resistance and enhanced conductivity
10/01/2009US20090242416 Nanowire sensor, sensor array, and method for making the same
10/01/2009US20090242415 Method for manufacturing solid electrolytic capacitor
10/01/2009US20090242414 Electronchemical deposition of tantalum and/or copper in ionic liquids
10/01/2009US20090242412 Continuous plating system and method with mask registration
10/01/2009US20090242411 Polyimide-metal laminated body and polyimide circuit board
10/01/2009US20090242410 Method for electrochemical plating and marking of metals
10/01/2009US20090242250 Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board
10/01/2009US20090242236 Method of forming conductive tracks
10/01/2009US20090242016 Nanowire and microwire fabrication technique and product
09/2009
09/30/2009EP2105520A1 Coating method and electrolyzing apparatus used therefor
09/30/2009CN101545127A Process for producing electronically-encapsulated metal cover plate
09/30/2009CN101545126A Method for preparing surface coating of high chrome steel
09/30/2009CN101545123A Method for non-cyanide copper electroplating of steel parts
09/30/2009CN100545306C Copper plating solution and method for copper plating
09/24/2009WO2009116621A1 Bearing
09/24/2009WO2009116602A1 Terminal for connector and process for producing the terminal for connector
09/24/2009WO2009116601A1 Metallic material for connector and process for producing the metallic material for connector
09/24/2009WO2009116426A1 Electronic component and method for manufacturing the same
09/24/2009WO2009115230A2 Nanowires and method for the production thereof
09/24/2009WO2009115228A2 Nanowire structural element
09/24/2009WO2009115227A2 Nanowire structural element
09/24/2009WO2009115192A2 Ni-p layer system and process for its preparation
09/24/2009WO2009028182A4 Chrome-plated part and manufacturing method of the same
09/24/2009US20090236230 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
09/24/2009US20090236227 Method to electrodeposit metals using ionic liquids
09/24/2009DE102008019864B3 Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens A method for electroplating a substrate by brush plating and apparatus for carrying out this method
09/23/2009EP2103716A1 Method for Inhibiting Background Plating
09/23/2009EP2103712A1 Ni-P layer system and process for its preparation
09/23/2009EP2102900A1 Self-constrained anisotropic germanium nanostructure from electroplating
09/23/2009EP2102390A1 Process for providing aluminium cookware with a copper coating
09/23/2009EP2102389A1 Method fr the galvanic coating of workpieces in an electrolyte bath containing zinc
09/23/2009EP1654470B1 Laminated composite material, production and use thereof
09/23/2009CN201313951Y Metal product
09/23/2009CN201313950Y Brush head used for vacuum brush-coating machine and vacuum brush-coating machine employing the same
09/23/2009CN201313949Y Brush head used for vacuum brush-coating machine and vacuum brush-coating machine employing the same
09/23/2009CN101542021A Deposition of conductive polymer and metallization of non-conductive substrates
09/23/2009CN101540303A 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers
09/23/2009CN101538730A Electrolytic treatment device and electrolytic treatment method
09/23/2009CN101538729A Method for quickly restoring partial oxidation film of aluminum alloy surface
09/23/2009CN101538728A Production method and equipment of flexible copper clad laminate and flexible copper clad laminate
09/23/2009CN101538727A PCB pore point electroplating method
09/22/2009CA2403882C Separator for fuel cell and method for producing the same
09/17/2009WO2009010473A3 Method of providing a metallic coating layer and substrate provided with said coating layer
09/17/2009WO2008129423A3 Conductive via formation
09/17/2009US20090229989 Method for the preparation of nanostructures and nanowires
09/17/2009US20090229857 Electrode and method of forming the electrode
09/16/2009EP2100987A1 Surface treated copper foil, surface treated copper foil with very thin primer resin layer, method for manufacturing the surface treated copper foil, and method for manufacturing the surface treated copper foil with very thin primer resin layer
09/16/2009CN101535531A Electroplating method
09/16/2009CN101533716A Preparation technique of composite film electrode used for a super capacitor
09/16/2009CN101532157A Method for applying conducting polymer to nonmetallic surface electroplating
09/16/2009CN101532156A Method for producing austenitic stainless steel heat-resistant anticorrosive electric heater
09/16/2009CN101532155A Application process of multi-layer electroplated coinage materials and products thereof
09/16/2009CN101532154A An electrolytic copper foil surface Chromium-free passivating treatment method
09/16/2009CN101532153A Amorphous nano-alloy plating layer of electrodeposition nickel-based series, electroplating liquid and electroplating process
09/16/2009CN101532150A Acid copper-aluminium nitride high-performance composite coating plating solution and coating method thereof
09/16/2009CN101532148A Zn-Fe-SiO/nano nickel composite deposite electrode material and preparation method thereof
09/16/2009CN101532133A Copper-base crystallizer surface laser cladding method
09/16/2009CN100541844C Silver layer and its manufacture method, substrate for mounting LED using the silver layer and its manufacture method
09/16/2009CN100541746C Electropolishing metal layers on wafers having trenches or vias with dummy structures
09/15/2009US7588837 Weld joins a thin overlay of low carbon steel to a base that contains high carbon steel, at least at its surface along which the weld is formed; heat affected zone (HAZ) in base around the weld contains enough austenite, and perhaps bainite as well, to render HAZ relatively ductile and crack resistant
09/15/2009US7588836 Solid solutions; corrosion resistance; blackening resistance; for household electric appliances
09/15/2009US7588674 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
09/11/2009WO2005118918A3 Efficient analysis of organic additives in an acid copper plating bath
09/10/2009US20090226788 Fuel cell, flow field plate, and method for producing a flow field plate
09/10/2009US20090226760 Inductive write head with slanted electroplated member and method for producing the same
09/10/2009US20090223828 Plating method
09/10/2009US20090223827 Pulse Reverse Electrolysis of Acidic Copper Electroplating Solutions
09/10/2009US20090223826 Manufacturing carbon nanotube ropes
09/10/2009DE19502358B4 Verfahren für die Vernickelung großflächiger Bauelemente Procedure for the nickel-plating of large-area devices
09/10/2009DE102008045260B3 Apparatus for galvanizing substrate, e.g. wafer or solar cell, has component with anode support, central space and electrolyte flow adjusting operating device to give even layer thickness
09/10/2009DE102008024271A1 Verfahren zur Herstellung einer Chromschicht auf einem metallischen Träger A process for producing a chromium layer on a metal support
09/09/2009EP2098362A1 Engraved plate and base material having conductor layer pattern using the engraved plate
09/09/2009CN201305639Y Threaded brush plating conductor pen
09/09/2009CN101525761A 电镀方法 Electroplating method
09/09/2009CN101525760A Electrodeposition technology for preparing electrode material of RuO2 of super capacitor
09/09/2009CN101525711A Magnesium alloy with zinc and nickel compound plating layers and preparation method thereof
09/09/2009CN100539034C Substrate proximity processing structures and methods for using and making the same
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