Patents for C25D 1 - Electroforming (4,571)
08/2004
08/31/2004US6782886 Metering pumps for an aerosolizer
08/26/2004US20040163842 Flexible printed wiring board for chip-on-film
08/26/2004US20040163441 Stamping tool, casting mold and methods for structuring a surface of a work piece
08/25/2004CN1524135A Production method and device for optical fiber-use metal coupler
08/25/2004CN1523137A Apparatus and process for manufacturing metallic fiber by electromoulding
08/25/2004CN1163638C Electrodeposit copper foil mfg method
08/19/2004WO2004070188A2 Production method for a perforated disk for discharging a fluid
08/19/2004WO2004055246A8 Copper electrolytic solution and electrolytic copper foil produced therewith
08/19/2004US20040159549 Apparatus and method for fabricating metal fibers using electroforming
08/18/2004EP1448036A1 Copper foil for fine pattern printed circuits and method of production same
08/18/2004EP1447462A1 Apparatus and method for fabricating metal fibres using electroforming
08/18/2004EP1238125A4 Method of manufacture of colloidal rod particles as nanobar codes
08/18/2004EP1227929A4 Colloidal rod particles as nanobar codes
08/18/2004CN1522316A Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same
08/18/2004CN1521288A Process for the production of niobium or tantalum parts by electrochemical etching
08/17/2004US6777108 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
08/12/2004WO2004067811A1 The manufacturing method of cut electro-forming member whitch have stepped form, and cut electro-forming member whitch have stepped form made by it
08/12/2004WO2004067810A1 The manufacturing method of cut electro-forming member and cut electro-forming member made by it
08/12/2004WO2004067806A1 Stencil manufacture
08/12/2004WO2004067805A1 Ultrafine pipe by electroforming and method for manufacturing the same
08/12/2004WO2004067199A1 The method of cutting a ultrafine pipe or bar, and ultrafine pipe or bar cutted by it
08/12/2004US20040157128 Metal foil for current collector of secondary battery and method for producing the same
08/12/2004US20040157080 Copper foil for fine pattern printed circuits and method of production of same
08/12/2004US20040154930 Copper foil for high frequency circuit and method of production of same
08/12/2004DE10305425A1 Herstellungsverfahren für eine Lochscheibe zum Ausstoßen eines Fluids und Lochscheibe zum Ausstoßen eines Fluids Manufacturing method of a perforated disc for ejecting a fluid, and orifice plate for jetting a fluid
08/12/2004CA2514265A1 Stencil manufacture
08/11/2004EP1445351A1 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
08/11/2004EP1445062A1 Work support
08/11/2004EP1444385A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
08/11/2004CN1161499C Anode electrode structure for mfg. metal foil
08/05/2004US20040149583 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same
08/05/2004US20040149568 Method for loading and unloading macro-molecules from microfluidic devices
08/04/2004CN1518099A Lead frame and its manufacturing method and semiconductor device using the lead frame
08/03/2004US6770976 Process for manufacturing copper foil on a metal carrier substrate
07/2004
07/29/2004WO2004064156A1 Laminate made by electro-forming and method for manufacturing the same
07/29/2004WO2004064155A1 Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master
07/29/2004WO2004064135A1 Composite shape electroforming member, its electroforming master and method for manufacturing the same
07/29/2004US20040147063 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
07/29/2004US20040146650 Electrochemisrtry forming structure; heating spraying; contact masking; etching; controlling thickness; multilayer, three-dimensional structure
07/29/2004US20040144653 With flexible hinge member connecting the microplatform to the support member allowing relative movement between them; improved mechanical strength, rigidity, low deformation, and high planarity.
07/28/2004EP1441049A1 Process for the production of niobium or tantalum parts by electrochemical etching
07/28/2004EP1440931A1 Method for manufacturing metal microstructure
07/28/2004EP1439952A1 Copper foil with low profile bond enhancement
07/28/2004EP1313942B1 Swirl plate especially for fuel injection valves
07/28/2004CN1159958C Composite copper foil, process for preparing same, and copper-clad laminate and printed wiring board using the same
07/22/2004DE10136891B4 Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall A method for producing a sheet-like base material made of metal
07/21/2004EP1439575A2 Semiconductor device with a lead frame and method of manufacturing the same
07/20/2004US6764033 Swirl plate and fuel injection valve comprising such a swirl plate
07/15/2004WO2004059040A1 Copper electrolytic solution containing quaternary amine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith
07/15/2004US20040134788 electrochemistry; etching; electroplating; photoresists
07/15/2004US20040134786 Mold for a V-groove fiber array base block and fabrication method thereof
07/14/2004CN1511976A Method for producing anti-folding electrolytic copper foil
07/13/2004US6760959 Device for producing material having optically varying effects and method of producing the same
07/08/2004WO2004057669A1 Electro-forming master, its manufacturing method, and metal minute pattern made by it
07/08/2004WO2004057055A1 Plating of multi-layer structures
07/08/2004US20040129573 cells of the mask comprise independently controllable electrodes; pattern of dielectric material extends beyond the electrodes for contacting the substrate and for forming electrochemical process pockets when contacted ; deposition selectivity
07/08/2004DE10115655B4 Zahntechnisches Verfahren und Vorrichtung zur galvanischen Herstellung von Edelmetallkappen Dental Method and apparatus for electroplating production of precious metal caps
07/07/2004EP1435193A2 Nickel coated copper as electrodes for embedded passive devices
07/07/2004CN2623231Y Wall-hanging automatic sterilization liquid preparation device
07/07/2004CN1511260A 接触探针 The touch probe
07/01/2004WO2004055892A1 Electro-forming master, minute pattern by the master and the same manufacturing method
07/01/2004WO2004055246A1 Copper electrolytic solution and electrolytic copper foil produced therewith
07/01/2004WO2004012287A3 Metal-supported tubular fuel cell
06/2004
06/30/2004EP1433880A1 Electroforming system and electroforming method
06/30/2004CN1508296A Electroplating device and method thereof
06/29/2004US6755956 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
06/29/2004US6755953 Method for forming ordered structure of fine metal particles
06/29/2004US6755189 Methods and apparatus for storing chemical compounds in a portable inhaler
06/29/2004US6754953 Continuous electroform growing
06/24/2004WO2004053972A1 Lead frame and the same manufacturing method using electroforming
06/24/2004US20040121178 Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
06/24/2004US20040118698 electrodepositing and annealing a metallic composition within the pores of a mesoporous silica film to form a metal-containing silica nanocomposite; silica is dissolved to leave a self-supporting article
06/24/2004US20040118676 Plating apparatus and plating method
06/24/2004US20040118438 Method for removing electrically conductive materials containing silver from electrodeposited parts
06/23/2004EP1431424A2 Plating apparatus and plating method
06/23/2004EP1431418A1 Process for removing conductive silver from electrodeposited parts
06/23/2004CN1506500A Micro-electrforming die with pre-formed metal as base material and its making process
06/23/2004CN1506499A Making process of electrolytic copper foil with great high-temperature elongation
06/23/2004CN1506498A Electroformed diamond thin metal sheet shaping method
06/22/2004US6753068 Decorative plate, and decorative article and timepiece using the same
06/17/2004US20040115536 Method for producing electrical conductors, a solar collector, an electrochemical cell and use of conductors produced in this way
06/17/2004US20040113301 Method for producing two-membered or multi-membered all-ceramic dental shaped parts and corresponding device
06/17/2004DE10255702A1 Method for producing a nonferrous foil with required properties involves mixing of a nonferrous metal sulfate bath with an additional mixture of polypropylene glycol and phenol sulfone acid
06/16/2004CN1504592A Paste for electroless plating and method of producing metallic structured body, micrometallic component, and conductor circuit using the paste
06/16/2004CN1153853C Manufacturing method of nanometer material reinforced electroformed crystalline metal product
06/16/2004CN1153852C Device and method for controlling electric power line distribution
06/16/2004CN1153851C Device and method for controlling electric power line distribution
06/15/2004US6749737 Method of fabricating inter-layer solid conductive rods
06/09/2004EP1426978A1 CONDUCTIVE PASTE AND CONDUCTIVE FILM USING IT, PLATING METHOD AND PRODUCTION METHOD FOR FINE METAL COMPONENT
06/09/2004CN1502723A Electric casting device for making material composed of small diameter metal
06/03/2004US20040104739 Contact probe
06/03/2004US20040104495 Expanding dental model material
06/03/2004US20040104118 Adding to electrolyte mixture an additive, consisting of gelatin, hydroxyethyl Cellulose, and bis/sodiumsulfopropyl/disulfide, forming smooth surface, copper clad laminate for a printed circuit, lithium battery electrode
06/03/2004US20040104117 copper sulfate electrolyte solution contains, a sulfur compound selected from a disulfur compound, dialkylamino- T-oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; a nonionic polyoxyalkylene glycol surfactant as additives
06/03/2004US20040104111 Micro lens molding piece, micro lens molding piece producing method, micro lens stamper, micro lens stamper producing method, micro lens mold member, plastic lens array sheet, and projector
06/03/2004US20040103813 catalytic nickel powder is coated palladium; disperse tin coated nickel powder in palladium chloride solution; forming metallic film on substrate with catalytic paste as underlayer; conductor circuits; reduce the cost catalytic metal
06/02/2004EP1424406A1 Electroforming apparatus and electroforming method
06/02/2004CN1500915A Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same
06/02/2004CN1500914A Preparation method of special raw material for electrolytic copper foil factory
06/02/2004CN1152159C Method for preparing high strength and tight bond force type foamed nickel material
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