Patents for C25D 1 - Electroforming (4,571)
06/2008
06/05/2008US20080128284 Molybdenum, copper, or iron oxides; nucleation pulse applied to an aqueous solution forming a plurality of chains of metal oxide nanoparticles; reduced in hydrogen gas to metal wire; sensors, biosensors, wiring of semiconductor quantum dots
06/05/2008DE102006056303A1 Electrophoretic free forming process for forming metal and ceramic parts useful in dental technology enables all formed parts known in dental technology to be produced on one machine
06/04/2008CN100392458C Optical fiber connector and ferrule used for it and production method for ferrule
06/03/2008US7381475 Treated copper foil and circuit board
06/03/2008US7381318 Method of manufacturing biaxially textured metallic layer featured by electroplating on the surface of single-crystalline or quasi-single-crystalline metal surface, and articles therefrom
05/2008
05/29/2008WO2008062634A1 Three-dimensional microstructure, method for manufacturing the microstructure, and apparatus for manufacturing the microstructure
05/29/2008US20080121618 Method of Electrochemical Fabrication
05/28/2008EP1925696A2 Iron-gold barcode nanowire and manufacturing method thereof
05/28/2008EP1924413A2 Method and apparatus for and to make hair removal elements
05/28/2008CN100390325C Method for producing microelectromoulding metal mould
05/27/2008US7378160 Finely patterned, excellent elongation and tensile strength at normal and high temperatures; amine is a glycerol derivative with terminal tertiary amine groups and pendant hydroxy groups or an endcapped polyethylene glycol or poly(1,2-propylene glycol); bis(alkylenesulfonic or phosphonic acid) disulfides
05/20/2008US7375368 Superlattice for fabricating nanowires
05/15/2008US20080110857 Method of Electrochemical Fabrication
05/15/2008US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device
05/14/2008CN201058891Y Fully-suspended encapsulated type anode groove
05/14/2008CN100387756C Method for improving the bonding strength between nickel or nickel alloy cast layers in laminated micro devices
05/13/2008US7372616 Complex microdevices and apparatus and methods for fabricating such devices
05/08/2008US20080107869 Methods of making electroforms, mounting plates therefore, products made therefrom
05/07/2008CN101173751A High temperature bearing metal substrate of light processing equipment and manufacturing method thereof
05/07/2008CN101172257A Bubble iron chromium aluminum applied in vent gas filtering and catalyst carrier, and production technique thereof
05/01/2008US20080102239 End of roll paper sensing and system management
05/01/2008US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing
04/2008
04/23/2008CN101165219A Method for control size of electroforming nickel crystal in nickel sulphate electroforming liquid
04/23/2008CN100383289C Vanadium removal method for electrolytic stoste in metal gallium electrolysis
04/23/2008CN100383288C Method for preparing Fe-Ni, Fi-Ni-Cr alloy foil
04/16/2008CN101161870A Gas-tight cavity forming method
04/16/2008CN101161400A Method for manufacturing mould core of light conducting plate
04/03/2008WO2008037501A2 Method for applying a nickel layer with fluoropolymer particles
04/03/2008DE102006047357A1 Nickelschicht mit Fluorpolymerpartikel Nickel layer with fluoropolymer particles
04/02/2008CN101153402A Negative plate for electrolysis special for metallic round button
04/01/2008US7351321 Electroplating metal onto substrate in pattern corresponding to complement of conformable mask; forming multilayer, three-dimensional structure
04/01/2008US7351313 Production device and production method for conductive nano-wire
03/2008
03/27/2008WO2008034471A1 Method for the preparation of nanostructures and nanowires
03/27/2008WO2007073162A3 Method for electroplating an article having a surface with a nanostructure to be plated and apparatus for carrying out such a method
03/27/2008US20080075972 Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same
03/27/2008US20080073219 Electrolytes containing coppers for electrodeposition and adjuvants comprising polyglycerol polyglycidyl ethers condensed with amines, and sulfur compounds such as 3-mercaptopropanesulfonic acid sodium salt; sheets having tensile strength
03/26/2008EP1372520B1 Expanding dental model material
03/25/2008US7347572 Telescope mirror for high bandwidth free space optical data transmission
03/20/2008WO2008000520B1 Reflective optical systems and their fabrication
03/19/2008CN101146933A Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wi
03/18/2008US7344624 Reducing power consumption in electro-refining or electro-winning of metal
03/13/2008US20080061459 Process for Producing Microsphere with Use of Metal Substrate having Through-Hole
03/12/2008CN100374625C Gate bush producing method by electroforming
03/11/2008US7341824 Controlled-release layer is applied to a surface of substrate base; conductive metal layer is coated; creating dielectric peg; nozzle layer is applied; photolithography is used to define a trench; removing controlled-release layer
03/06/2008US20080054469 Electroformed metal structure
03/05/2008CN101135058A Electrodepositing rollor
03/04/2008US7338753 Forming a resin mold, interposing a photosensitive polymer forming layers, exposing the layered structure with an electron beam, ultraviolet radiation or visible radiaton, removing an exposed photosensitive polymer, and filling the vacant portion with a metal
02/2008
02/27/2008EP1892322A1 Copper/niobium composite piping material produced by copper electroforming, process for producing the same and superconducting acceleration cavity produced from the composite piping material
02/27/2008EP1516076B1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
02/27/2008CN101130879A Electroforming net preparation method
02/21/2008WO2008021940A2 Sorbent for selective removal of contaminants from fluids
02/20/2008CN101128624A Anodising aluminium alloy
02/20/2008CN101126168A Surface treatment electrolysis copper foil, method for manufacturing the same , and circuit board
02/20/2008CN101126167A Method and device for manufacturing optical cable connector metal lock pin
02/14/2008WO2008018261A1 Method for manufacturing electroformed mold, electroformed mold, and method for manufacturing electroformed parts
02/14/2008US20080035564 Sorbent For Selective Removal Of Contaminants From Fluids
02/14/2008US20080035485 Apparatus for Manufacturing Biochip and Method for Manufacturing Biochip Tip Array Module
02/13/2008EP1322277B1 Dental moulded part and method for the production thereof
02/13/2008CN201020906Y Electromoulding metal film silk screen plate
02/13/2008CN101122035A Method for manufacturing copper foil
02/07/2008US20080029397 Hot embossing tooling with integrated heating/cooling fluid channels and method
01/2008
01/31/2008US20080023337 Metal membrane filter, and method and apparatus for the production thereof
01/30/2008EP1882056A2 Mask and method for electrokinetic deposition and patterning process on substrates
01/29/2008US7324324 Multilayer electronic component and manufacturing method thereof
01/29/2008US7323093 Producing method of flexible wired circuit board
01/24/2008US20080017515 Forming method for manufacturing model
01/22/2008US7320936 Plating of multi-layer structures
01/09/2008EP1876266A1 Electrolytic copper foil and process for producing electrolytic copper foil, surface treated elctrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic copper foil
01/09/2008CN201003077Y Electromoulding supercharger
01/03/2008WO2008000520A1 Reflective optical systems and their fabrication
01/03/2008US20080000773 Apparatus and method for manufacturing carbon nano-tube probe by using metallic vessel as an electrode
01/02/2008EP1873570A1 Reflective optical systems and their fabrication
01/02/2008EP1872406A2 Optical coatings with narrow conductive lines
01/02/2008EP1871925A2 Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die
01/02/2008EP1227929B1 Colloidal rod particles as nanobar codes
12/2007
12/27/2007WO2007104171A3 Uv-liga process for fabricating a multilayer metal structure having adjacent layers that are not entirely superposed, and structure obtained
12/27/2007US20070295029 Process for forming hollow costume jewelry articles coated with a film of precious metal or metallic alloy
12/26/2007CN101092720A An electroform method
12/26/2007CN101092719A Jet electroform method and equipment for manufacturing foamed metal
12/26/2007CN101092718A Composite material of foamed metal, and preparation method
12/26/2007CN101092717A Method and equipment for manufacturing metal parts directly by using electrodeposition technique of laminated form board
12/26/2007CN101092716A Superfine electroform technique of supercutical fluid, and equipment
12/19/2007EP0857402B1 High performance flexible laminate
12/13/2007WO2007140766A2 Method for arranging a powder layer on a substrate and a layer structure with at least one powder layer on a substrate
12/13/2007US20070284257 Apparatus for Manufacturing Metal Nanotube and Process for manufacturing Metal Nanotube
12/13/2007DE10143126B4 Verfahren zur Herstellung von metallischem Halbzeug sowie danach hergestelltes Halbzeug und dessen Verwendung Process for the preparation of metallic semi-finished and semi-finished manufactured after and its use
12/12/2007CN101087679A Molding die or master pattern for electroforming each having release layer
12/12/2007CN101086081A Precision electrocasting method of radiation device and the final product
12/12/2007CN101086080A Method for producing rotary allotype metal micropore nozzle using galvanoplastics
12/12/2007CN100354752C Masks for vaporation, frame assembly therewith and manufacture of both
12/11/2007US7306965 Oxygen ion conductor device, method for fabricating oxygen ion conductor device, and oxygen concentration control system
12/11/2007US7306962 Electroformed metallization
12/11/2007US7306706 Method and apparatus for stripping electrodeposited metal sheets from permanent cathodes
12/06/2007WO2007138619A1 Method for rapid production of objects anyhow shaped
12/06/2007WO2006123049A3 Method for the electrolytic production of self-supporting conductive nanocomposite elements
11/2007
11/29/2007WO2007135972A1 Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier sheet
11/29/2007WO2005123985A3 Germanium and germanium alloy nanoparticle and method for producing the same
11/28/2007CN101078798A Backlight assembly light guide board production method
11/28/2007CN100351434C Electroplating device and method thereof
11/22/2007WO2007092363A3 Hybrid slip casting-electrophoretic deposition (epd) process
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