Patents for C25D 1 - Electroforming (4,571)
12/2001
12/26/2001CN1328651A Optical fiber connector and ferrule used for it and production method for ferrule
12/26/2001CN1328176A Method and equipment for producing electrolytic copper foil
12/19/2001CN1327489A Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
12/13/2001US20010051282 Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
12/13/2001US20010050444 Forming photoresist on substrate; electron beam cutting
12/12/2001CN2464745Y Electric controller for precision electric casting instrument
12/12/2001CN1325790A Copper film for TAB band carrier and TAB carried band and TAB band carrier
12/12/2001CN1076154C Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit
12/06/2001US20010049027 Copper foil overcoated with nickel, cobalt and molybdenum alloy; tape automatic bonding
11/2001
11/28/2001EP1158074A1 Method and apparatus for the production of a three-dimensional metallic structure
11/22/2001WO2001088228A1 Electrolysis apparatus for electrolytic copper foil and electrolytic copper foil produced in the electrolysis apparatus
11/22/2001WO2001088226A2 Method of manufacturing an aluminium product
11/22/2001US20010042686 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by use of the apparatus
11/21/2001EP1156138A2 Electrode material for forming stamper and thin film for forming stamper
11/20/2001US6319620 Making and using an ultra-thin copper foil
11/15/2001WO2001085053A1 Method for producing full ceramic substructures, especially consisting of alumina, in dentistry
11/15/2001DE10021490A1 Micro fabrication of geometric three-dimensional micro structures forms a laminate of a hydrophilic polymer and a hydrophobic resin with structured recesses for electroplating and final separation
11/15/2001DE10021437A1 Method of producing ceramic caps involves coating stump with fluid separating agent, applying slip, drying, and running electric current.
11/14/2001EP1154421A2 Production method for optical disc
11/14/2001CN1322259A Electrolytic copper foil with carrier foil and method for manufacturing same and copper-clad laminate using electrolytic copper foil with carrier foil
11/08/2001WO2001084747A2 Telescope mirror for high bandwidth free space optical data transmission
11/07/2001EP1152555A1 Telescope mirror for high bandwidth free space optical data transmission
11/07/2001EP1152070A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001EP1152069A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
11/07/2001CN1321121A Electrolytic copper foil with carrier foil and copper-clad laminate using electrolytic copper foil
11/07/2001CN1321061A Method for surface treatment of copper foil
11/01/2001US20010036378 High fatigue resistant metal sheet and fixing belt and fixing apparatus using the same and evaluation apparatus of metal material fatigue resistance and method thereof
10/2001
10/31/2001EP1149189A2 Method for producing a self-supporting metal film
10/30/2001US6309488 Manufacturing method for high precision mold
10/23/2001US6306274 Method for making electrodeposition blades
10/23/2001US6306268 Device for carrying out continuous electrolytic precipitation
10/18/2001WO2001077416A2 Thin copper foil, and process and apparatus for the manufacture thereof
10/18/2001WO2001077415A1 3-dimensional imprint tooling and method therefor
10/18/2001WO2001021282A3 Laminar structure
10/18/2001US20010031375 High porosity three-dimensional structures in chromium based alloys
10/17/2001EP0841412B1 High-tensile electrolytic copper foil and process for producing the same
10/11/2001US20010028936 Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer
10/11/2001US20010027609 Shaving system and foils
10/10/2001EP1143038A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
10/10/2001EP1140437A1 Hair clipper
10/10/2001EP0902848B1 Component produced by micro-electrodeposition
10/04/2001WO2001012880A3 Method for the production of a self-supporting copper foil
10/03/2001CN1072281C Method for manufacturing jet nozzle sheet with jet nozzle
09/2001
09/27/2001WO2001071065A1 Hole structure and production method for hole structure
09/26/2001EP1135192A2 Uniform expansion radioactive stents
09/20/2001WO2001068940A1 Methods for replication, replicated articles, and replication tools
09/19/2001EP1134603A1 Optical fiber connector and ferrule used for it and production method for ferrule
09/19/2001CN2448851Y Electric casting equipment for continuous making foamed metal
09/19/2001CN1313956A Metallic building element for optoelectronics
09/18/2001US6291081 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
09/18/2001US6291080 Thin copper foil, and process and apparatus for the manufacture thereof
09/11/2001US6287446 Electrodeposition in bath
09/07/2001WO2001064433A1 Carrier foil-pasted metal foil and production method thereof
09/06/2001US20010019780 Preventing wrinkling
09/04/2001US6284120 Method of electroplating and electrodeposit structure
08/2001
08/30/2001WO2001063016A1 Composite copper foil and manufacturing method thereof
08/30/2001WO2001063015A1 Methods of manufacturing stamper and formed substrate
08/29/2001CN1310240A Method of utilizing beta-naphthol for eliminating Co in main and subsidiary zinc electrolyzing systems
08/28/2001US6280832 Component produced by micro-electrodeposition
08/23/2001DE10007754A1 Verfahren und Vorrichtung zur Ablösung von Zinkplatten von den Kathoden Method and apparatus for separation of zinc plates of the cathode
08/22/2001EP0871799B1 Device for transmitting electric current to disc elements in surface-coating thereof
08/22/2001EP0795046B1 Process for making copper metal powder, copper oxides and copper foil
08/22/2001EP0783627B1 Valve, in particular fuel injection valve
08/16/2001WO2001016402A8 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
08/16/2001US20010014410 Acid resistance; waterproof
08/16/2001US20010014409 Article, method, and apparatus for electrochemical fabrication
08/16/2001US20010014408 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
08/16/2001US20010014407 Acid resistance
08/16/2001US20010014406 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil
08/16/2001US20010013554 Aperture plate and methods for its construction and use
08/16/2001DE10006823A1 Flexible metallic substrate for CIS solar cells produced without vacuum technology, comprises copper foil strip with electroplated layered structure containing specified metals and alloys
08/16/2001DE10005680A1 Flexible metallic substrate for CIS solar cells produced without vacuum technology, comprises copper foil strip with electroplated layered structure containing specified metals and alloys
08/14/2001US6274275 Alkali storage cell employing a spongelike metal substrate
08/09/2001WO2001057932A1 Flexible metal substrate for cis solar cells, and method for producing the same
08/08/2001CN1307719A Method for poducing master disk for producing fomed substrate with groove and method for producing stamper for producing formed substrate with groove
08/08/2001CN1307651A Method for producing nickel foam and nickel foam thus obtainable
08/07/2001US6270889 For making printed wiring boards
08/07/2001US6270648 Having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two ?super anodes? on a rotating drum cathode to deposit the treatment
08/07/2001US6270645 Simplified process for production of roughened copper foil
08/02/2001WO2001056345A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056344A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056343A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
08/02/2001WO2001056342A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
07/2001
07/31/2001US6268025 Multilayer
07/19/2001WO2001051687A1 Production method for ferrules
07/19/2001US20010008091 Electrodeposited copper foil, method of inspecting physical properties thereof, and copper - clad laminate employing the electrodeposited copper foil
07/12/2001WO2001049903A1 Electrolytic copper foil and method for inspecting physical property thereof, and copper clad laminate using the electrolytic copper foil
07/11/2001CN1303309A Improved method and apparatus for storing chemical compounds in portable inhaler
07/05/2001WO2001048272A1 Electrolytic copper foil
07/05/2001WO2001048271A1 Method of producing metal ferrules, and device therefor
07/05/2001WO2001048270A1 Metal ferrule and method of producing the same
07/05/2001US20010006151 Providing a base foam having a conductive surface, nickel plating the base foam in an electroplating bath, removing the base foam
06/2001
06/28/2001DE10037521A1 Production of rotational screen printing blocks involves ultrasound-assisted electrolytic deposition of metal onto a blank in a bath containing polyethyleneimine or substituted polyethylene, stress reducer and brightener
06/27/2001EP1110188A1 A metallic building element for optoelectronics
06/27/2001EP0930835B1 Method for setting stones in the surface of a jewel produced by electroforming and resulting jewel
06/27/2001EP0695377B1 Process for making copper metal powder, copper oxides and copper foil
06/27/2001CN1300880A High-speed selective electroforming equipment and method
06/26/2001US6251565 Forming photoresist sensitive to x-rays; overcoating witth electroconductive layer; masking; exposur eto ultraviolet radiation
06/26/2001US6251248 Micromachining polymer substrate for forming pattern with deep cavities; electroforming system; mass transport of electrolyte solution into said polymer to swell substrate; desorption of solvent to shrink polymer
06/21/2001WO2000032273A9 Uniform expansion radioactive stents
1 ... 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 ... 46