Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
08/2011
08/03/2011CN102144106A Rolling bearing
08/03/2011CN102144045A Electoless method for in-line metallization of substrates by spraying them, with prior surface treatment and device for implementing the method
08/03/2011CN102140639A Deposited metal stripping agent and preparation method thereof
08/03/2011CN102140633A Method for preparing nano silver film with wide plasma-adsorption wave band at constant temperature
08/03/2011CN102140632A Method for chemically plating platino electrodes on cadmium telluride, cadmium zinc tellutide and cadmium manganese tellutide
08/03/2011CN102140631A Environment-friendly high-phosphorus chemical nickel additive
08/03/2011CN101775606B Nickel plating process method of magnesium alloy
08/03/2011CN101578394B Plated material having metal thin film formed by electroless plating, and method for production thereof
08/03/2011CN101578393B Plated material having metal thin film formed by electroless plating, and method for production thereof
08/02/2011US7989081 Resin composite copper foil, printed wiring board, and production processes thereof
08/02/2011US7988774 Electroless deposition of cobalt alloys
08/02/2011US7988773 Gold cyanide salt, complexing agent, aldehyde, amine; plating copper, nickel, palladium base metal part; prevent diffusion of cobalt, prevent oxidation of nickel, improve corrosion resistance of circuits or terminals
07/2011
07/28/2011WO2011090153A1 Copper surface treatment agent
07/28/2011WO2011089933A1 Composite plating solution having diamond microparticles dispersed therein, and process for production thereof
07/28/2011WO2011089431A1 Anticorrosion sol-gel coating for metal substrate
07/27/2011EP2348544A2 Buffer layer manufacturing method and photoelectric conversion device
07/27/2011EP2347413A1 Metal plating additive, and method for plating substrates and products therefrom
07/27/2011EP2347033A2 Formulations containing a mixture of zno cubanes and method for producing semiconducting zno layers using said formulations
07/27/2011EP2347032A1 Method for reducing thin films on low temperature substrates
07/27/2011CN201908148U Copper-precipitating board-inserting frame for PCB (Printed Circuit Board) sheet
07/27/2011CN102138232A Compositions and methods for the manufacture of rare earth metal-Ba2Cu3O7-delta thin films
07/27/2011CN102136522A Formation of solar cells on foil substrates
07/27/2011CN102134711A Nano particle strengthened composite coating layer for realizing dropwise condensation heat transfer
07/27/2011CN101709461B Method for copper powder displacement for chemical silver plating
07/27/2011CN101613862B Plastic surface processing method
07/26/2011US7985285 Gold cyanide salt, complexing agent, aldehyde, amine; plating copper, nickel, palladium base metal part; prevent diffusion of cobalt, prevent oxidation of nickel, improve corrosion resistance of circuits or terminals
07/21/2011WO2011087374A1 Method for making an absorber coating for solar heating, the coating as such and its application
07/21/2011WO2011086972A1 Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation
07/21/2011WO2011086387A2 Metallized nanotubes
07/21/2011WO2011085584A1 Surface metalizing method, method for preparing plastic article and plastic article made therefrom
07/21/2011WO2011064276A3 Electroless ni-composite plated substrate and method
07/21/2011WO2011057745A3 Method for depositing a palladium layer suitable for wire bonding on conductors of a printed circuit board and palladium bath for use in said method
07/21/2011US20110177936 Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization
07/21/2011US20110177255 Method for producing an aldehyde containing coating
07/21/2011CA2786478A1 Method for making an absorber coating for solar heating, the coating as such and its application
07/20/2011EP1629136B1 Composition for coating metals to protect against corrosion
07/20/2011CN102131958A Method of forming a microstructure
07/20/2011CN102130087A Three-dimensional integrated circuit metallic conductor rail and preparation method thereof
07/20/2011CN102127781A Electrochemical copper plating applicable to hole metallization of printed board
07/20/2011CN102127760A Nano mirror spray coating method
07/20/2011CN102127759A Method for chemically plating cobalt on surface of graphite matrix
07/20/2011CN102127758A Silver plating process on workpiece surface
07/20/2011CN101775593B Heat treatment method of ultrahard aluminum alloy after chemical nickel-plating
07/20/2011CN101537491B Preparation method of copper-coated tungsten composite powder
07/20/2011CN101484387B Coating liquid, titanium oxide thin-film formed using coating liquid, and method of forming the same
07/20/2011CN101208023B Precious metal jewellery and method for manufacturing the same
07/19/2011US7981202 Electroless pure palladium plating solution
07/14/2011WO2011082782A1 Method for generating conductive or semi-conductive metal oxide layers on substrates and substrates produced in said manner
07/14/2011WO2011009858A4 Coating station and method for coating a workpiece
07/13/2011EP2342372A1 Method for enhancing the solderability of a surface
07/13/2011EP2342272A2 Preparation of nanostructured microporous composite foams
07/13/2011EP2342167A1 Mirror
07/13/2011CN201896588U Sucker rod
07/13/2011CN102124143A Non-electrolytic deposition method
07/13/2011CN102124142A Method for forming metal coating film, and electrically conductive particle
07/13/2011CN102124141A Half mirror and process for producing same
07/13/2011CN102123970A Surface-treated ceramic member, method for producing same, and vacuum processing device
07/13/2011CN102121102A Chemical plating method for quartz fiber surface
07/13/2011CN102121101A Method for chemically plating copper without palladium on polyester film
07/13/2011CN102121100A 'Copper/straw' electromagnetic wave shield composite material and preparation method thereof
07/12/2011CA2452229C Article including a substrate with a metallic coating and a protective coating thereon, and its preparation and use in component restoration
07/07/2011WO2011079950A1 Method and device for the wet chemical treatment of material feedstock
07/07/2011WO2011057937A3 Metal island coatings and method for synthesis
07/06/2011CN201890930U Flexible board fixture for immersion gold process
07/06/2011CN1989080B Nanostructured coatings and related methods
07/06/2011CN102119134A Method for deposition of ceramic films
07/06/2011CN102115885A Oil-free self-lubricating plating technique of aluminum alloy parts
07/06/2011CN101671819B Non-noble metal activating solution of polyimide film and surface activating process thereof
07/06/2011CN101613858B Device for automatically coating organic electro-thermal films
07/05/2011US7972652 Electroless plating system
06/2011
06/30/2011WO2011078353A1 Negative electrode, electrolytic cell for electrolysis of alkali metal chloride, and method for producing negative electrode
06/30/2011US20110159191 Sensitizing solution for electroless plating and electroless plating method
06/29/2011EP2339594A1 Composition for producing metal film, method for producing metal film, and method for producing metal powder
06/29/2011EP2339050A1 Stabilizers for electroless plating solutions and methods of use thereof
06/29/2011CN102112664A Metal material with a bismuth film attached and method for producing same, surface treatment liquid used in said method, and cationic electrodeposition coated metal material and method for producing same
06/29/2011CN102112660A Plated object with copper thin film formed by electroless plating
06/29/2011CN102112281A Apparatus and method for depositing and curing flowable material
06/29/2011CN102108537A Solar battery electroplating pretreatement process
06/29/2011CN102108511A Electroplating and chemical plating composite protecting process for NdFeB permanent magnet and NdFeB permanent magnet with composite protective layer
06/29/2011CN102108505A Method for directly depositing metal line patterns based on screen printing method
06/29/2011CN101717929B Semi-bright lead-free chemical tinning liquid and using method thereof
06/29/2011CN101431885B All-directional conductive foam and producing method thereof
06/29/2011CN101054483B Silvering graphite and preparation method thereof
06/28/2011US7968192 Oxidation inhibition of carbon-carbon composites
06/23/2011WO2011075712A2 Inorganic phosphate corrosion resistant coatings
06/23/2011WO2011072506A1 Surface metallizing method, method for preparing plastic article and plastic article made therefrom
06/22/2011EP2336394A2 Metal plating composition and method for the deposition of copper-zinc-tin suitable for manufacturing thin film solar cell
06/22/2011EP2334844A1 Method for the electrolytic plating of an article, and an electrolytic solution
06/22/2011DE102006055763B4 Verfahren zur Metallisierung von Polyester, metallisierter Polyester und dessen Verwendung Method for the metallization of polyester, metallized polyester and its use
06/22/2011CN201873754U Plating through hole thin board basket
06/22/2011CN102106195A Electroless copper plating method, printed wiring board, method for manufacturing printed wiring board and semiconductor device
06/22/2011CN102102227A Preparation method of hydrophobic light trapping structure on silicon surface
06/22/2011CN102102198A Method for regulating distribution of metal nano granules in resin carrier
06/22/2011CN102102197A Palladium complex and catalyst-imparting treatment solution using the same
06/22/2011CN101831641B Acid zinc dipping solution of magnesium-lithium alloy and zinc dipping method
06/22/2011CN101195911B Preprocessing solution and method for forming coating metal layer on substrate with plastic surface
06/22/2011CN101018743B Mold for glass shaping and process for producing the same
06/21/2011US7964746 Copper borohydrides, copper compounds with cyclopentadienyl-type ligands, copper compounds with cyclopentadienyl-type and isocyanide ligands, and stabilized copper hydrides; can be utilized in solid or liquid forms that are volatilized to form precursor vapor for contacting with the substrate
06/21/2011US7964289 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
06/21/2011US7964174 Nanotube growth and device formation
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