C09J 11 - Features of adhesives not provided for in group , e.g. additives

Patents for C09J 11 - Features of adhesives not provided for in group , e.g. additives (14,955)
11/2004
11/23/2004	US6822017 Method for anchoring a material in or to concrete or masonry
11/20/2004	CA2467354A1 High-solids binder combinations for scratch-resistant topcoats
11/18/2004	WO2004099332A2 Wood adhesives containing solid residues of biomass fermentations
11/18/2004	WO2004052784A3 Ultra-dry calcium carbonate
11/18/2004	US20040230000 Epoxy resins, phenolic resins, a synthetic rubber (acrylonitrile-butadiene), and microcapsules having a thermoplastic resin shell; improved bonding strength and storage stability; microelectronics; pressure sensitive adhesives
11/17/2004	EP1477541A1 Pressure sensitive adhesive and patch employing the same
11/17/2004	EP1476522A1 Reactive single-component coating and/or adhesive granulate
11/17/2004	EP1476521A1 Moisture curable adhesive composition
11/17/2004	CN1547742A Optical disc and manufacturing method thereof
11/16/2004	US6818684 Methods and compositions involving polar monomers and multivalent cations
11/11/2004	DE10318107A1 Wässrige Klebstoff-Dispersionen Aqueous adhesive dispersions
11/11/2004	DE10316617A1 Thermoplastic stiffening material for use in shoe production comprises a hot-melt adhesive, e.g. a mixture of linear polyester and ethylene-vinyl acetate copolymer, and a filler, e.g. wood flour
11/11/2004	DE10297501T5 Klebstoff, Kleberprodukt und verbundene Struktur Adhesive, adhesive product and related structure
11/10/2004	EP1475423A2 Repositionable glue stick
11/10/2004	EP1474493A2 Low-emission aqueous dispersion adhesive
11/10/2004	EP1474487A2 Stabilised aqueous polyurethane/polycarbamide dispersions
11/10/2004	EP1314197A4 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
11/10/2004	EP1114112B1 Method of stabilizing films or membranes using adhesive as a reservoir
11/10/2004	CN1545401A Stretch removable adhesive articles and methods
11/10/2004	CN1175035C Combination of solid solvent and melt-processible block copolymer
11/09/2004	US6813895 Supercritical pressure regulation of vapor compression system by regulation of adaptive control
11/04/2004	WO2004094529A1 Acrylic-based thermally conductive composition and thermally conductive sheet
11/04/2004	WO2004081095A8 Electrically heatable pressure-sensitive adhesive compound
11/04/2004	US20040220317 Emulsion polymerization methods involving lightly modified clay and compositions comprising same
11/04/2004	US20040219377 Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
11/04/2004	US20040219322 Synthetic rubber polymer, a thermoplastic polymer, a plasticizer, and an organic filler comprised of recycled automotive paint powder; seals out dust, moisture, and air
11/04/2004	US20040219193 mixtures of adhesive polymer and nonadhesive polymers having pressure sensitivity and tack inhibition which allows for accurate positioning during adhesion
11/04/2004	US20040216838 Processes for the production of components fo electronic apparatuses
11/04/2004	US20040216778 Solar panel including a low moisture vapor transmission rate adhesive composition
11/04/2004	DE10297225T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/04/2004	DE10297224T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/03/2004	EP1472321A1 Method of joining wood based materials
11/03/2004	EP1144535B1 Autodepositable adhesive
11/03/2004	CN1542076A Adhesives composition, adhesive film, and semiconductor apparatus using the same
11/03/2004	CN1542073A Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
11/03/2004	CN1174070C Small granularity adhesive composition for micro electronic device
11/03/2004	CN1173764C Alkyl glycidyl ether capped polyamine foam controlling agent
11/02/2004	US6811824 Repulpable wax
10/2004
10/28/2004	US20040213999 When emulsion polymerizing an alkyl (meth)acrylate ester of non-tertiary alcohol and an acid monomer, an electrolyte of salts of inorganic or organic acids having a Ka =/> than that of acetic acid, is present to promote solid rather than hollow microspheres; minimal microsphere adhesive transfer
10/28/2004	DE10318151A1 Selbstklebende Schutzfolie zum temporären Schutz von Fahrzeuglacken Self-adhesive protective film for the temporary protection of automotive coatings
10/27/2004	EP1471076A1 Aqueous adhesive compositions
10/27/2004	EP1470208A2 Alkylglycol alkoxylates or alkyldiglycol alkoxylates, mixtures thereof with tensides and their use
10/27/2004	EP1470198A2 Polymer derivatives for the treatment of metals
10/27/2004	EP1470181A1 Improved interface adhesive
10/27/2004	EP1470177A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine
10/21/2004	WO2004090061A1 Thermoplastic stiffening material used for manufacturing shoes, and a method for the production thereof
10/21/2004	US20040206943 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
10/20/2004	EP1469054A2 Self-adhesive foil for temporarily protecting vehicle paints
10/20/2004	EP1468058A2 Radiation-cured, laminated flexible packaging material, and radiation-curable, adhesive composition
10/20/2004	EP1467625A1 Adhesion inhibition of moulds
10/20/2004	CN1537912A Blends of high T.g polymer emulsions and pressure sensitive adhesive polymer emulsion usefuel as pressure sensitive adhesives
10/20/2004	CN1537899A Water-containing composition comtaining N-alkyltartaric acid imide and N-alkylmaloy
10/20/2004	CN1537897A Self-dhesive foil temporarily protecting vehicle paints
10/19/2004	US6806309 Maleimide containing monomer, cure initiator and polymers; controlled bond line thickness and uniformity; semiconductor packaging; stacking without need for spacer die
10/19/2004	CA2139929C Transdermal therapeutic system containing the active substance 17-.beta.-oestradiol (anhydrous)
10/14/2004	WO2004088395A2 Electro-optic assemblies
10/14/2004	WO2004087829A2 Method for bonding together two substrates, method for disassembling said bonded assembly and primer therefor
10/14/2004	US20040200564 Articles and methods for applying color on surfaces
10/13/2004	EP1466751A1 Heat-sensitive recording material
10/13/2004	EP1465961A1 Pressure sensitive adhesives having quaternary ammonium functionality, articles, and methods
10/13/2004	EP1465936A1 Cross-linkable polymer blends containing alkoxysilane-terminated polymers
10/13/2004	EP1465935A1 Pigment compositions with modified atrp copolymer dispersants
10/13/2004	EP1465930A2 Supramolecular polymers
10/13/2004	CN1537151A Pressure sensitive adhesive double coated tape and method for producing IC chip using it
10/13/2004	CN1170833C Organometallic compositions
10/12/2004	US6803400 Water-swellable hot-melt-type adhesive
10/12/2004	US6803090 Fluid transport assemblies with flame retardant properties
10/07/2004	US20040198897 Hot melt adhesives
10/07/2004	US20040197569 Polyolefin polymer and catalyst blend for bonding fluoropolymers
10/07/2004	US20040196734 Method of post mixing additives to hot melt adhesives
10/07/2004	DE10313652A1 Klebemasse Adhesive
10/06/2004	EP1464688A1 Heat-peelable double-faced pressure-sensitive adhesive sheet, method for adhering processed material onto said sheet, and electronic part
10/06/2004	EP1463492A1 Adhesive and binding agent for dermal or transdermal treatment systems
10/06/2004	EP1389408B1 Method for producing components for electronic devices
10/06/2004	EP1165716B1 Adhesives
10/06/2004	EP1163308B1 Plasticized pressure sensitive adhesive
10/05/2004	US6800371 Curable composition comprising mixture of epoxy resin, catalyst and epoxy reactive thioether-containing compound; resulting adhesives are water and/or solvent resistant and bond to plastics such as polycarbonates, metals, silicon
09/2004
09/30/2004	WO2004083333A1 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same
09/30/2004	WO2004039851A3 Fiber dispersant-containing systems
09/30/2004	US20040192856 comprises acrylic acid, butyl acrylate, ethyhexyl acrylate, vinyl monomer, and ethoxylated alkyamine plasticizer, and crosslinker; high shear strength and tack; for use in papermaking or paper-converting industry for flying roll changeover (flying splice) on coating/printing machines
09/30/2004	US20040191510 containing heat-expandable microspheres, and a pressure-sensitive adhesive layer on the other side of the substrate that are peelable from each other by heating.
09/30/2004	US20040191459 hermetic sealed containers for packaging frozen foods, having removable hot melt or pressure sensitive adhesives
09/30/2004	DE10312062A1 Schmelzhaftkleber mit geringem Rückschrumpf, Verfahren zu seiner Herstellung und Verwendung Hot melt pressure sensitive adhesive with low shrink-back, process for its preparation and use
09/30/2004	DE10312031A1 Schwerentflammbare Haftklebemasse, Verfahren zu ihrer Herstellung sowie ihre Verwendung zur Herstellung eines Haftklebebandes Flame-resistant PSA processes for their preparation and their use for producing an adhesive tape
09/29/2004	EP1462501A1 Compositions curable by Michael-addition reaction
09/29/2004	EP1462480A1 Adhesive matter
09/29/2004	EP1461496A1 Repulpable wax
09/29/2004	EP1461396A1 Metal salt modifiers for bonding compositions
09/29/2004	EP1461365A2 Initiator systems comprising ss-ketone compounds and bonding compositions made therewith
09/29/2004	EP1042422B1 Laminating adhesive hardenable by radiation and use of same
09/29/2004	CN1533421A Radiation hardenable adhesive composition containing displersed natural rubber fine particles
09/29/2004	CN1533415A Hot melt adhesives
09/29/2004	CN1533256A Dedusting cleaner
09/29/2004	CN1532247A Flame-retardant pressure sensitive adhesive, its preparing process and its use in producing pressure sensitive adhesive tape
09/28/2004	US6797752 Use of whitening pigments for whitening paper coating compositions
09/28/2004	US6797376 Overcoating metal substrate with epoxy resin adhesive blends
09/26/2004	CA2458150A1 Adhesive
09/23/2004	WO2004081136A1 Intrinsically heatable pressure-sensitive adhesive planar structures
09/23/2004	WO2004081095A1 Electrically heatable pressure-sensitive adhesive compound
09/23/2004	WO2004081058A1 Surfactant for emulsion polymerization, polymer emulsion composition obtained with the surfactant, and adhesive for fiber flocking comprising the composition

1 ... 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 ... 150