| Patents for C09J 11 - Features of adhesives not provided for in group , e.g. additives (14,955) |
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| 04/27/2005 | CN1610732A Composition containing a polymerizable reducing agent, kit, and method |
| 04/27/2005 | CN1610731A Metal salt modifiers for bonding compositions |
| 04/27/2005 | CN1609158A Thermally peelable double sided adhesive sheet, method for processing adherend and electronic part |
| 04/27/2005 | CN1608860A Heat-sensitive adhesive material, process and apparatus for thermally activating thereof |
| 04/27/2005 | CN1198831C Organic metal monoacylalkylphosphine compound |
| 04/26/2005 | US6884833 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 04/26/2005 | US6883969 Pivot bearing assembly and a method of manufacturing the same |
| 04/26/2005 | US6883908 Methods and compositions for ink jet printing of pressure sensitive adhesive patterns or films on a wide range of substrates |
| 04/21/2005 | WO2005035682A1 Two-component structural adhesive having high initial adhesion |
| 04/21/2005 | WO2004111151A3 Silicone-based pressure-sensitive adhesive and adhesive tape |
| 04/21/2005 | US20050085634 Using hydrocarbon solvent in condensation of phenolic compounds, aromatic diamines and aldehydes gives stability; preventing the ring-reopening polymerization at high temperature; useful in preparing laminates, copper foil adhesives, semiconductor packaging materials, phenolic resin |
| 04/21/2005 | US20050085578 Packages with bonding pads connected with bonding wires; terminals; coverings; seam welding; hermetic sealing; using mixture of polymer and fillers; controlling particle sizes |
| 04/21/2005 | US20050084682 Mechanical activation to produce heat and friction; crosslinkable urea-, melamine, phenol-, or resorcinol-formaldehyde resin or polyurethane is converted into duroplastic; heat resistance; curing |
| 04/21/2005 | US20050084678 Antimicrobial composite material |
| 04/21/2005 | US20050082338 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/21/2005 | US20050081995 Bonding substrate, forming foams, elastomers, roofing membranes, gaskets; using catalyst; laminating adhesive |
| 04/20/2005 | EP1524307A1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 04/20/2005 | EP1524306A1 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/20/2005 | EP1399519B8 Devices, compositions and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 04/20/2005 | CN1608092A Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 04/20/2005 | CN1607084A Masking film for textured surfaces |
| 04/19/2005 | US6882058 Organic acid containing compositions and methods for use thereof |
| 04/19/2005 | US6881775 Low emissions one part adhesive |
| 04/14/2005 | WO2005033242A1 Adhesive composition with barrier characteristics |
| 04/14/2005 | WO2005032854A1 Pneumatic radial tire |
| 04/14/2005 | US20050080181 Pressure-sensitive adhesive composition of a copolymer of a natural rubber based rubber and an acrylic monomer and styrene uniformly dispersed in a radiation setting compound, a second acrylic monomer |
| 04/14/2005 | US20050080157 Mixture of metallic silver and Group 1a and 1b compounds; sputtering, or vaporization silver vapor ; condensation; pressure sensitive adhesives |
| 04/14/2005 | DE10345799A1 Melaminharz enthaltende Haftklebstoffe Melamine resin-containing pressure-sensitive adhesives |
| 04/14/2005 | DE10343090A1 2-K-Montageklebstoff mit hoher Anfangshaftung 2-component construction adhesive with high initial adhesion |
| 04/13/2005 | EP0947189B1 Wet tacky compositions, plaster patches comprising the same, and methods for using the same |
| 04/13/2005 | CN1606606A Water-base composition and crosslinking agent for water-soluble polymers |
| 04/13/2005 | CN1606584A Polyurethane products produced from aluminum phosphonate catalyzed polyetherols |
| 04/13/2005 | CN1606507A 热敏记录材料 The thermosensitive recording material |
| 04/12/2005 | CA2155088C Adhesive composition for fiber |
| 04/07/2005 | WO2005031759A1 Conductive particle and anisotropic conductive adhesive using same |
| 04/07/2005 | WO2005030897A1 Adhesive and thermal material stuck in use produced therewith |
| 04/07/2005 | US20050075438 Composite adhesive |
| 04/07/2005 | US20050075428 Low emissions one part adhesive |
| 04/07/2005 | US20050075425 Phosphate ester having branched alkyl and/or alkenyl group and polyoxyalkylene group and tackifier resin; cohesive strength; storage stability |
| 04/07/2005 | US20050074039 Laser module |
| 04/06/2005 | EP1520898A2 Pressure-sensitive adhesives comprising melamin resin |
| 04/06/2005 | EP1519988A1 Polymeric compositions containing polymers and ionic liquids |
| 04/06/2005 | EP1519793A1 Method for producing as assembly comprising several mutually firmly adhering addition-polymerized silicone elements |
| 04/06/2005 | EP1191952B1 Hot melt pressure sensitive positioning adhesive (ii) |
| 04/06/2005 | CN1604942A Surface treating agents for organic polymer bases of polymerizable aerobic (meth)acrylate systems |
| 04/06/2005 | CN1604741A Adhesion inhibition of moulds |
| 03/31/2005 | WO2005028583A1 Destructuring agent for an adhesive composition, and glue and primer forming said composition |
| 03/31/2005 | WO2005028582A1 Water-resistant adhesive composition for wood |
| 03/31/2005 | US20050070653 Low viscosity adhesive; mixture of addition polymer and salt of phosphoric acid |
| 03/31/2005 | US20050070639 Pressure sensitive adhesives comprising melamine resin |
| 03/31/2005 | US20050069721 Adhesive tape especially for packaging purposes |
| 03/31/2005 | DE10341428A1 Verwendung von Isononylbenzoaten als Filmbildehilfsmittel Use of Isononylbenzoaten as film-forming agent |
| 03/30/2005 | EP1518892A1 Aqueous polymer dispersions having a high solid content, process for their preparation and their use |
| 03/30/2005 | EP1517970A1 Biomedical adhesive |
| 03/30/2005 | EP1517812A1 Soundproofing floor covering and method for the production thereof |
| 03/30/2005 | EP1311555B1 Acrylate contact adhesive materials having tight molecular weight distribution |
| 03/30/2005 | CN1602343A Dual cure B-stageable adhesive for die attach |
| 03/30/2005 | CN1602154A Inhibition of the asexual reproduction of fungi |
| 03/29/2005 | US6872770 Moisture-curing adhesives |
| 03/29/2005 | CA2174153C Transparent film incorporating colored adhesives |
| 03/26/2005 | CA2480041A1 High-solids aqueous dispersions their preparation and use |
| 03/24/2005 | WO2005026854A1 Supercritical pressure regulation of vapor compression system |
| 03/24/2005 | WO2005026269A1 Microorganism coating components, coatings, and coated surfaces |
| 03/24/2005 | WO2005026249A1 Use of isononyl benzoate as a film-forming agent |
| 03/24/2005 | US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate |
| 03/24/2005 | US20050064167 Carbon nanotubes |
| 03/24/2005 | US20050062024 Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof |
| 03/24/2005 | US20050061435 Applying plasticizer to form pressure sensitive adhesives |
| 03/23/2005 | EP1516891A1 A binder composition for lamination and an adhesive film using the same |
| 03/23/2005 | EP1516025A1 Radiation-cured coating agent |
| 03/23/2005 | EP1515950A1 Cationic alkoxyamines and their use in producing nano particles from natural or synthetic clays |
| 03/23/2005 | CN1599781A Adhesive substance, adhesive product, and connected structure |
| 03/23/2005 | CN1599761A Process for forming solid pressure sensitive adhesive polymer microspheres |
| 03/23/2005 | CN1597825A Adhesive for dry laminate and complex plastic film laminated by the adhesive |
| 03/23/2005 | CN1597822A Water-resisting enhancer of corrugated paper board/box and preparation process thereof |
| 03/23/2005 | CN1194051C Preparation type volatile organic matter trapping agent |
| 03/23/2005 | CN1194050C New use of plant polyphenol compound |
| 03/22/2005 | US6869682 Combination of a base and a crown ether promote adhesion through dehydrofluorination of the fluoropolymer and activates the pendant functional groups of the non-fluorinated polymer to chemically interact with fluoropolymer |
| 03/22/2005 | US6869678 Removable pressure-sensitive adhesive and adhesive sheet of the same |
| 03/17/2005 | WO2005023954A1 Adhesive agent and method for production thereof |
| 03/17/2005 | WO2004110125A3 Electromagnetic shielding adhesive composite material |
| 03/17/2005 | US20050059769 Aqueous nanocomposite dispersions: processes, compositions, and uses thereof |
| 03/17/2005 | US20050059754 Particles of flame retarders overcoated with electroconductive materials; for adhesives, foams, elastomers |
| 03/16/2005 | EP1513905A1 Pressure-sensitive adhesive material for film strips that are contact adhesive on one or both sides, and method for the production thereof |
| 03/16/2005 | EP1513891A2 Aqueous adhesive dispersions |
| 03/15/2005 | US6866934 A thermoplastic resin having a functional group and carbodiimide compound impregnated only in the surface layer section or both surface layer section and inside the base particle and both are strongly bonded by crosslinking reaction |
| 03/15/2005 | US6866928 Cleanly removable tapes and methods for the manufacture thereof |
| 03/10/2005 | WO2005021623A1 Paper laminates manufactured using foamed adhesive systems |
| 03/10/2005 | US20050054785 Curative of a light-stable isomer of a 2,4,5-triarylimidazolyl dimer, such as bilophine activated by solvent or friction, combined with an ethenically unsaturated polymerizable material; articles with an adhesive having a detackified surface, such as adhesive bandages |
| 03/10/2005 | US20050054758 Contains an azo compound generating gas by means of irradiation with light, with at least some of the gas discharged to the outside to faciliate peeling off without damage; 2,2'-azobis(N-ethyl-2-methyl propionamide) for example; can be handled without releasing gas; use e.g. making integrated circuits |
| 03/10/2005 | US20050053646 Pressure-sensitive adhesive and patch employing the same |
| 03/10/2005 | CA2536792A1 Paper laminates manufactured using foamed adhesive systems |
| 03/09/2005 | EP1511820A1 Wax for hot melt adhesive applications |
| 03/09/2005 | CN1590489A Mold release agent composition for polyorganosiloxane adhesive and mold release plate using the composition |
| 03/09/2005 | CN1590227A Device for checking a glued-on object and method for checking a glued-on object |
| 03/09/2005 | CN1590084A Adhesive sheet for steel plate |
| 03/09/2005 | CN1192113C Heteropolysaccharide produced by agrobacterium radiobacter |
| 03/09/2005 | CN1192072C Conductive adhesive and biomedical electrode |
| 03/09/2005 | CN1192071C Connection material for sticking and connecting elements |
| 03/08/2005 | US6864295 Gas-generating, pressure-sensitive adhesive composition |