Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 11 - Features of adhesives not provided for in group , e.g. additives
Patents for C09J 11 - Features of adhesives not provided for in group , e.g. additives (14,955)
06/2003
06/04/2003EP1315772A2 Cross-linked foamed pressure sensitive adhesive and method for preparing the same
06/04/2003CN1422431A Cable tape and method for manufacturing a cable tape
06/03/2003US6571939 Imageable seamed belts having hot melt processable, thermosetting resin and conductive carbon filler adhesive between interlocking seaming members
05/2003
05/30/2003WO2003044115A2 Adhesives for bonding peroxide-cured elastomers
05/30/2003WO2003044094A1 Two-part polyurethane adhesives for structural finger joints and method therefor
05/30/2003CA2466447A1 Adhesives for bonding peroxide-cured elastomers
05/29/2003US20030100670 Emulsion polymerization of latex; for subjection to hot water spraying or immersion, improving adhesion
05/29/2003US20030100654 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
05/29/2003US20030100649 Autodepositable adhesive
05/28/2003EP1314197A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
05/28/2003EP1313800A2 Antimicrobial adhesive latexes, methods of making thereof, and carpet articles containing same
05/28/2003EP1141104B1 Heat debondable adhesive composition and adhesion structure
05/22/2003WO2003042319A1 Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape
05/22/2003WO2003042318A1 Adhesive material, method for unsticking adhesive material and bound structure
05/22/2003WO2003042315A1 Curable bonded assemblies capable of being dissociated
05/22/2003WO2003042314A1 Method for prolonging the pot life of two-part water-based polychloroprene adhesive
05/22/2003WO2003042311A1 Activator compositions for cyanoacrylate adhesives
05/22/2003WO2003042261A2 Process for forming solid pressure sensitive adhesive polymer microspheres
05/22/2003WO2002072162B1 Stretch removable adhesive articles and methods
05/22/2003US20030096933 Process for forming solid pressure sensitive adhesive polymer microspheres
05/22/2003CA2466920A1 Process for forming solid pressure sensitive adhesive polymer microspheres
05/21/2003EP1311555A1 Acrylate contact adhesive materials having tight molecular weight distribution
05/21/2003EP1144526B1 Light-colored rosin esters and adhesive compositions
05/20/2003US6566422 For bonding and connecting elements each having electrodes thereon
05/20/2003US6565959 Use of synthetic fibers in a glueline to increase resistance to sag in wood and wood composite structures
05/20/2003US6565696 Photopolymerization; using photoinitiator
05/20/2003US6565639 Functional glue mixed with crushed on ginko (leaves) and paulownia (leaves) materials and fabricating method thereof
05/15/2003WO2003040277A2 Branched reaction products
05/15/2003WO2003040026A2 Electrically conductive, optically transparent polymer/carbon nanotube composites and process for preparation thereof
05/15/2003WO2003039884A1 Image covering laminate film and image projection sheet
05/15/2003WO2002062914A9 Triboluminescent materials in adhesive compositions for use in adhesive tape
05/15/2003US20030092829 Binders based on oleochemical reaction products
05/15/2003US20030092246 Comprises ceramic holding block and aqueous adhesive composition comprising polyoxyethylene glycol release agent and polyvinyl acetate
05/15/2003US20030091778 Crosslinked acrylate polymers of both high solids content and low viscosity prepared using a surfactant blend and a split feed (low/high speed); bimodal particle size distribution; pressure sensitive adhesives; coatings
05/15/2003US20030089516 Attachment film for electronic display device
05/14/2003EP1309664A1 Adhesive tape for wrapping purposes
05/13/2003US6562888 Light-colored rosin esters and adhesive compositions
05/08/2003WO2003037849A2 Acicular crystals of hydrazine-based diurea derivatives and their use as rheology modifiers in coating and adhesive compositions
05/08/2003US20030087969 Alkyl glycidyl ether-capped polyamine foam control agents
05/07/2003EP1307521A2 Aqueous adhesive system, method for the production and use thereof
05/07/2003EP1000992B1 Pressure-sensitive adhesive fabric tape for wire harness bundling
05/06/2003US6559939 Method of high throughput haze screening of material
05/06/2003US6558576 Luminescent electroconductive adhesive
05/02/2003EP1306416A2 Transparent pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet thereof
05/02/2003EP1305982A1 Ferrogmagnetic resonance excitation and its use for heating substrates that are filled with particles
05/02/2003EP1305376A1 Method for accelerating the curing of adhesives
05/01/2003WO2003035789A1 Microsphere adhesive formulations
05/01/2003US20030079968 Imageable seamed belts having hot melt processable, thermosetting resin and conductive carbon filler adhesive between interlocking seaming members
04/2003
04/30/2003CN1414054A Silica collosol binder and its manufacturing method
04/30/2003CN1107096C Self-adhesive compositions with improved resistance to creepage usable for coating metal substrates
04/24/2003WO2003033613A1 Environmentally friendly adhesives for bonding vulcanized rubber
04/24/2003WO2003033610A1 Method of gluing wood based materials
04/24/2003WO2003033609A1 Method of gluing wood based materials
04/24/2003WO2003033208A1 Assembly system for stationing semiconductor wafer and process f or manufacturing semiconductor wafer
04/24/2003US20030077443 Blends of high Tg polymer emulsions and pressure sensitive adhesive polymer emulsions useful as pressure sensitive adhesives
04/24/2003US20030076386 Inkjet print head and method for making the same
04/24/2003CA2463635A1 Method of gluing wood based materials
04/23/2003EP1303571A1 Polyimide hybrid adhesives
04/23/2003EP0950082B1 Reducing void formation in curable adhesive formulations
04/23/2003CN1413240A Conductive adhesive and biomedical electrode
04/17/2003WO2003031530A1 Transfer tape
04/17/2003WO2003031490A1 Modified reactive melt adhesive and the use thereof
04/17/2003WO2003031488A1 High solids content, low-viscosity emulsion polymers
04/17/2003US20030073765 Low emissions one part adhesive
04/17/2003CA2462830A1 Modified reactive melt adhesive and the use thereof
04/15/2003US6548579 Adhesive composition comprising a particulate thermoplastic component
04/15/2003US6548566 Laminating adhesives hardenable by radiation
04/15/2003US6547985 Composition of 2-cyanoacrylate, Lewis acid metal salt and clathrate
04/10/2003WO2003029381A1 Silicone pressure sensitive adhesive compositions
04/10/2003WO2002098999A3 Process for printing adhesives, adhesive articles and printing equipment
04/10/2003US20030069335 Structural hot melt material and methods
04/10/2003US20030069333 A single-liquid type adhesive contains a main polymer, an imidazole serving as a hardener(its surface is covered by a thermoplastic resin), and a hardening promoter(its imino group(-NH-) having H replaced by a reaction retarder group
04/09/2003CN1105160C Reducing void formation in curable adhesive formulations
04/09/2003CN1104877C Dental adhesive
04/08/2003US6545086 Disperse silicone phase comprises the product of mixing a a silanol-polydiorganosiloxane with a silanol-containing silicone resin in a volatile silicone fluid having a boiling point below 300 degrees C.
04/08/2003US6545066 Fillers comprises hollow resin microspheres having a mean particle size of less than 75 microns; enhances adhesion of said joint compound to a substrate
04/08/2003US6544643 Pressure sensitive adhesive comprising poly(1-alkene) elastomer and multifunctional (meth)acrylate, articles prepared therefrom and a method of making
04/08/2003US6544591 Tartaric acid diesters as biodegradable surfactants
04/03/2003WO2003027178A2 Polyimide copolymer and methods for preparing the same
04/03/2003WO2002103333B1 Method of high throughput haze screening of material
04/03/2003WO2002072162A3 Stretch removable adhesive articles and methods
04/03/2003WO2002062914A8 Triboluminescent materials in adhesive compositions for use in adhesive tape
04/03/2003WO1999006496A3 Adhesive composition for electrical ptc heating device
04/03/2003US20030065086 Mixing polydiorganosiloxane with glass transition temperature < -20 c with a silanol-containing silicone resin of glass transition temperature > 0 c dispersed in 60-20 % of a volatile silicone fluid with boiling point < 300 c
04/02/2003EP1298121A1 Bis(cis-3,3,5-trimethylcyclohexyl) phthalate, process for producing the same, and thermoplastic resin composition
04/02/2003EP1297091A1 Uv-resistant hot-melt contact adhesive, a method for producing the same and adhesive objects produced therefrom
04/02/2003CN1104482C Adhesive for lignocellulose forming board adhesive, said lignocellulose forming board and its manufacturing
03/2003
03/27/2003WO2003025964A2 Lamp-capping cement for electric lamps
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003WO2003025030A1 Hydrocarbon resins from aryl norbornene derivatives
03/27/2003WO2003024494A1 Antimicrobial adhesive and coating substance and method for the production thereof
03/27/2003WO2002069387A3 Die attaching adhesive with a low curing temperature
03/27/2003US20030059607 Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
03/27/2003US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
03/27/2003CA2460487A1 Capping cement for electric lamps
03/26/2003EP1294822A1 Improved luminous materials
03/26/2003EP1294479A1 Method for producing capsules containing an active ingredient and having an ultra-thin coating
03/20/2003WO2003022953A1 Structural hot melt material and methods
03/20/2003US20030055161 Process for improving water-whitening resistance of pressure sensitive adhesives
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