Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
03/2004
03/30/2004US6711873 Apparatus for loading electronic packages of varying sizes
03/30/2004US6711797 Hydraulic tooling fixture
03/30/2004US6711796 Circuit board stripper
03/25/2004WO2004026016A1 Component placing head and origin detection method of component placing head
03/25/2004WO2004026015A1 Component placing head and component placing method
03/25/2004WO2004026014A1 Part feeding device and part feeding method
03/25/2004WO2004024594A1 Carrier with tacky surfaces
03/25/2004WO2004016532A3 Modular belt carrier for electronic components
03/25/2004US20040055853 Bladder based package control/singulation
03/25/2004US20040055150 Method of attaching electronic component and electronic component attaching tool
03/25/2004US20040055149 Apparatus for automatically resetting printed-circuit-board holding device
03/24/2004EP1400159A1 Device for assembling components on a substrate
03/24/2004EP1399951A2 Interchangeable microdeposition head apparatus and method
03/24/2004EP1399950A2 Formation of printed circuit board structures using piezo microdeposition
03/24/2004EP1399269A1 Waveform generator for microdeposition control system
03/24/2004EP1399268A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
03/24/2004EP1399267A1 Microdeposition apparatus
03/24/2004EP0975953B1 Device for inspecting test objects and the use thereof
03/24/2004CN1484937A Device for positioning a component picking unit of a pcb assembly machine for printed circuit boards
03/24/2004CN1483648A Tray for electronic components
03/23/2004US6711386 Method for mounting an apparatus, an apparatus and an apparatus part
03/23/2004US6710867 Device and method for inspecting a three-dimensional surface structure
03/23/2004US6710445 Coplanarity inspection system of package and method thereof
03/23/2004US6708402 Method and device for mounting electronic component
03/18/2004WO2004023858A1 Device for turning over electronic components
03/18/2004US20040053524 Pick and place cover for multiple terminal electronic components
03/18/2004US20040052010 Electrical part prevented from improper mounting on circuit board, and mounting structure for the electrical part
03/18/2004US20040051323 Position means for objects and more especially for pneumatic handling devices
03/18/2004US20040050571 Semiconductor chip package having an adhesive tape attached on bonding wires
03/18/2004DE10238740A1 Electrical switch for vehicle, has flat surface on movable actuator forming Pick-and-Place suction surface
03/17/2004EP1397948A1 Placing device and method for placing objects onto substrates
03/17/2004CN2606999Y Device for keeping information conformance of material supply device of sheet adhesive machine
03/17/2004CN1483208A Method and apparatus for making semiconductor device and the semiconductor device
03/17/2004CN1482709A Apparatus and methods for retaining and placing electrical components
03/17/2004CN1482450A Visual check supporting device for industrial products
03/16/2004US6707543 Mounting information-collecting device, connector, and mounting information-collecting method
03/16/2004US6707289 Method and apparatus for automatic registration for a board
03/16/2004US6705819 Feeder for chip components
03/16/2004US6705507 Die attach system and process using cornercube offset tool
03/16/2004US6705376 Device for supplying electronic components to a pick-up position
03/16/2004US6705004 Method and apparatus for mounting electronic part
03/16/2004US6705000 Device for removably mounting suction nozzle on nozzle holder
03/11/2004WO2004021760A1 Electronic cicuit part mounting machine and mounting position accuracy inspection method for the mounting machine
03/11/2004WO2004021759A1 Multiple source alignment sensor with improved optics
03/11/2004WO2004021758A1 Device for the fitting of electrical components to substrates
03/11/2004WO2004021757A1 Device for selectively displacing holding devices and fitting head for transporting components
03/11/2004WO2003101162A3 Connector packaging and transport assembly
03/11/2004US20040049758 Component mounting control method
03/11/2004US20040047108 Chip tray with tacky surface
03/11/2004US20040046405 Vacuum suction device and driving method thereof
03/11/2004DE10341046A1 Vacuum suction device and operating process for sucking and transporting light objects such as chip elements has valve control of suction and releasing overpressure
03/10/2004EP1396182A1 Optical sensor device
03/10/2004EP1396014A1 Apparatus for the measurement or machining of an object, provided with a displacement stage with wedge-shaped guides
03/10/2004CN1481001A Electronic parts encapsulation, non-volatile strong mesocolloid memory, mounting machine and method
03/10/2004CN1141861C Parts installation method and parts mounter
03/10/2004CN1141860C Apparatus and methods for fastening of electronic units
03/09/2004US6702173 Reflow apparatus in continuous printing and mounting apparatus for film-like printing body
03/09/2004US6701611 Electronic component mounting apparatus operable to mount electronic components onto a mount object
03/09/2004US6701610 Pick and place machine with varied nozzle lengths
03/04/2004WO2004019670A1 Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system
03/04/2004WO2004019669A1 Mounting machine and controller of the mounting machine
03/04/2004US20040044750 Method for transferring software to programmable components and placement system for placing components on substrates
03/04/2004US20040043514 Pre-aligner
03/04/2004US20040042890 Component-placing apparatus
03/04/2004US20040041002 Alignment weight for floating pin field design
03/04/2004US20040040998 Tape feeder
03/04/2004US20040040886 Anti-corrosion overcoat cover tape
03/04/2004US20040040147 Electronic parts installation device and cassette control device
03/04/2004DE10250778B3 Semiconductor chip used in flip-chip technology for producing circuit boards has a buffer body with a protective layer made from a damping material arranged between a contact surfaces and above a semiconductor component structures
03/04/2004DE10236604A1 Twin gripper handling unit for use in assembling electronic components onto a circuit board uses parallel gripper elements
03/03/2004EP1395106A2 Parts mounting method and parts mounting apparatus
03/03/2004EP1395105A2 Component-placing apparatus
03/03/2004EP1393609A2 Assembly head comprising a pneumatic pressure control device and method for operating said assembly head
03/03/2004EP1393608A2 Assembly head comprising a stepped-drive rotating rotor and a pneumatic pressure control device
03/03/2004EP1393237A2 Multiple output reel taper apparatus having linear and push-out reel changer
03/03/2004EP1392449A1 Over-clocking in a microdeposition control system to improve resolution
03/03/2004EP1112675B1 Supporting device for mounting components on a printed circuit board
03/03/2004EP1044590B9 Pick and place machine with varied nozzle lengths
03/03/2004CN1478708A Belt type feeding device
03/03/2004CN1140833C Monitoring equipment and method for tape automatic combination processing
03/02/2004US6699355 Method and means for exposing components in a component carrier tape
02/2004
02/26/2004WO2004017704A1 Method and equipment for mounting part
02/26/2004WO2004017702A1 Method and device for fitting substrates with components
02/26/2004WO2004016532A2 Modular belt carrier for electronic components
02/26/2004WO2003103861A3 Material recycling apparatus using laser stripping of coatings
02/26/2004WO2003020003A3 Horizontal component retention socket
02/26/2004US20040039480 Electronic component placement
02/26/2004US20040037055 Method for mounting electric components on a printed-wiring board
02/26/2004US20040036041 Device for assembling components on a substrate
02/26/2004US20040035840 Component installation, removal, and replacement apparatus and method
02/26/2004US20040035747 Temporary electronic component-carrying tape with weakened areas and related methods
02/26/2004DE10334863A1 Vorrichtung und Verfahren zur Herstellung von elektrischen Verbindern Device and method for the production of electrical connectors
02/26/2004DE10236004A1 Device for mounting electrical components on substrates, has sensor arranged between substrate supporting tables, for determining position of component on mounting head
02/26/2004DE10032718B4 Vorrichtungssystem zum definierten Zuführen von zu verarbeitenden Leiterplatten The apparatus defined system for supplying processed boards
02/25/2004EP1391394A1 Electronic component container
02/25/2004CN1477692A Thin film clamping device for keeping thin film planeness
02/25/2004CN1477689A Eqipment and method for mounting electronic part
02/24/2004US6697749 Correction method of measurement errors, quality checking method for electronic components, and characteristic measuring system of electronic components
02/24/2004US6697621 Method and apparatus for providing services in a private wireless network
02/24/2004US6695129 Uncovering device on a belt conveyer of a pick-and-place installation and method for picking and placing component using the same