| Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634) |
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| 07/29/2004 | DE10300518A1 Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung Device for fitting components on substrates and methods for calibrating such a device |
| 07/29/2004 | DE10212935B4 Bestückkopf zum Bestücken von Substraten mit elektrischen Bauelementen Placement head for populating substrates with electrical components |
| 07/28/2004 | EP1440613A1 Supporting device |
| 07/28/2004 | EP0827374B1 Device for aligning printed board |
| 07/28/2004 | CN1516548A Electronic component supply device and its mounting method |
| 07/28/2004 | CN1515362A Surface processing equipment and method, and equipment and method for wiring using said equipment |
| 07/28/2004 | CN1159594C Horizontal transfer test handler |
| 07/22/2004 | WO2004062337A1 Waste electronic circuit parts storage device and method, and electronic circuit parts mounting machine |
| 07/22/2004 | WO2003103861A9 Material recycling apparatus using laser stripping of coatings |
| 07/22/2004 | US20040140338 Component feeding apparatus |
| 07/22/2004 | US20040139602 Electronic parts mounting apparatus and electronic parts mounting method |
| 07/22/2004 | US20040139597 Electronic component mounting apparatus |
| 07/22/2004 | DE19617618B4 Verfahren und Vorrichtung zum Auslöten von Bauelementen, insbesondere elektronischen Bauelementen Method and apparatus for desoldering of components, in particular electronic components |
| 07/22/2004 | DE10313255A1 Transfer- or bonding- head for transferring components e.g. for semiconductor components to a takeoff position, has second shaft enclosing first shaft and provided with control curve for radial adjustment of holder |
| 07/22/2004 | DE10258801A1 Applying paste material to electronic components, involves positioning component relative to material ejection unit, and controlling unit so paste material in nozzle is ejected and transferred to component |
| 07/22/2004 | DE10258798A1 Verfahren und Vorrichtung zum partiellen Aufbringen von Klebstoff auf elektronische Bauelemente, Bestückvorrichtung zum Bestücken von Bauelementen Method and apparatus for partial application of glue on electronic components, placement device for placing components |
| 07/21/2004 | EP1438884A1 Method, system and arrangement for handling component tapes |
| 07/21/2004 | EP1438883A1 Automatic filter changer for use on surface mounter inspection camera |
| 07/21/2004 | EP1175816B1 Method and device for placing components on substrates |
| 07/21/2004 | CN2627791Y Surface binding technical plant using continuous flexible circuit board as base plate |
| 07/21/2004 | CN1513605A Binder coating device |
| 07/21/2004 | CN1158730C Method and device for manufacturing connector onto host machine plate |
| 07/21/2004 | CN1158699C Method and apparatus for manufacture of electronic components, and method for driving the apparatus |
| 07/21/2004 | CN1158698C Pin package method for pin gate assembly |
| 07/20/2004 | US6765667 Method for inspection of circuit boards and apparatus for inspection of circuit boards |
| 07/20/2004 | US6764549 Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
| 07/20/2004 | US6763577 System for placing electronic components on circuit carriers |
| 07/15/2004 | WO2004059332A1 An ic transfer device |
| 07/15/2004 | US20040134083 Apparatus for the measurement or machining of an object, provided with a displacement stage with wedge-shaped guides |
| 07/15/2004 | US20040134054 Multi-package conversion kit for a pick and place handler |
| 07/14/2004 | EP1437933A2 Components mounting device for substrates and its calibrating methode |
| 07/14/2004 | EP1437301A1 Tape-shaped package |
| 07/14/2004 | EP1437300A1 System for embossing carrier tape and method for producing carrier tape |
| 07/14/2004 | EP1436827A2 Device for soldering contacts on semiconductor chips |
| 07/14/2004 | CN1512919A Microdeposition apparatus |
| 07/14/2004 | CN1512918A Interchangeable microdeposition head apparatus and method |
| 07/14/2004 | CN1512917A Waveform generation for microdeposition control system |
| 07/14/2004 | CN1512836A Part adsorptive position demonstration method for part mounting device |
| 07/13/2004 | US6762847 Laser align sensor with sequencing light sources |
| 07/08/2004 | WO2004057938A1 Device for transporting flexible planar material, in particular circuit boards |
| 07/08/2004 | US20040130863 Method and apparatus for mounting electronic components and program therefor |
| 07/08/2004 | US20040129756 Device for positioning a tool in relation to a workpiece |
| 07/08/2004 | US20040128828 Surface mounting device and the method thereof |
| 07/08/2004 | US20040128827 Apparatus and system for mounting components and program for controlling the same |
| 07/08/2004 | DE10338686A1 Randverbinderentfernungswerkzeug Edge connector removal tool |
| 07/08/2004 | DE10258800A1 Verfahren und Vorrichtung zum Aufbringen einer Klebstoffschicht auf flächige Bauelemente, Bestückvorrichtung zum Bestücken von flächigen Bauelementen Method and apparatus for applying an adhesive layer to area components, placement device for populating area components |
| 07/07/2004 | CN2624591Y Paster table for sticking electronic component on the surface |
| 07/07/2004 | CN1511437A Assembly system and method for assembling components on substrates |
| 07/07/2004 | CN1510987A Electronic component mistake assembling preventing system |
| 07/07/2004 | CN1510743A Film carried belt for mounting electronic components thereon |
| 07/07/2004 | CN1509970A Reel rotary devices |
| 07/07/2004 | CN1156970C Electronic element |
| 07/07/2004 | CN1156789C Vision recongnizing apparatus and elements recognizing method |
| 07/07/2004 | CN1156673C Inspection result output device and base plate inspection system |
| 07/06/2004 | US6759862 Method and apparatus for evaluating a set of electronic components |
| 07/06/2004 | US6758384 Three-dimensional soldering inspection apparatus and method |
| 07/06/2004 | US6757967 Method of forming a chip assembly |
| 07/06/2004 | US6757966 Component mounting system and mounting method |
| 07/01/2004 | WO2004056166A1 Wiring and piping apparatus of part mounting machine |
| 07/01/2004 | WO2004054761A1 Tool exchange device and tool |
| 07/01/2004 | US20040127076 Fine resolution pin support fixture with light weight design |
| 07/01/2004 | US20040124119 Carrier tape for use in the automated parts-implanting machine for carrying parts therewith |
| 07/01/2004 | US20040123687 Cam apparatus and pick and place apparatus utilizing the same |
| 07/01/2004 | DE10348192A1 Integrierte Luftstromsteuerung für eine Positionierspindelbaugruppe Integrated airflow control for a Positionierspindelbaugruppe |
| 06/30/2004 | EP1432526A2 Method and apparatus for detecting a liquid spray pattern |
| 06/30/2004 | CN1509223A 电动镊子 Electric Tweezers |
| 06/30/2004 | CN1508856A After-stage through-hole discrete circuit element and manufacturing method thereof |
| 06/29/2004 | US6755677 Electronic circuit unit having a penetration-type connector housing |
| 06/24/2004 | WO2004054345A1 A feeder cart used to integrate feeder mechanisms and surface mount machines of varying types |
| 06/24/2004 | US20040119987 Multiple source alignment sensor with improved optics |
| 06/24/2004 | US20040118935 Method of jetting viscous medium |
| 06/24/2004 | US20040118522 Removable heated end effector |
| 06/24/2004 | US20040117983 Method for the operation of a component placement unit, component placement unit for carrying out said method and feed device for said component placement unit |
| 06/24/2004 | DE19580814B4 IC-Handler mit IC-Träger IC handler with IC carrier |
| 06/24/2004 | DE10255963A1 Mounting head for automatic component mounting machine, has joined segments that can be displaced relative to each other by separately controllable displacement elements, and component holding devices |
| 06/24/2004 | DE10249669B3 Verfahren zur Bestimmung der relativen räumlichen Lage zwischen zwei Kameras und Kamera zum optischen Erfassen von Objekten A method for determining the relative spatial position between two cameras and camera for optically detecting objects |
| 06/23/2004 | EP1432300A2 Method and apparatus for applying a glue layer on flat components and mounting device for placing flat components |
| 06/23/2004 | EP1432299A2 Method and apparatus for partially coating components with a glue and mounting device for placing components |
| 06/23/2004 | EP1432013A1 Semiconductor-mounting apparatus for dispensing an adhesive on a substrat |
| 06/23/2004 | EP1430759A1 Head for implanting electrical components on substrates |
| 06/23/2004 | EP0874540B1 Method and apparatus for mounting electronic components |
| 06/23/2004 | CN1507317A Integrated airflow controller for picking up & putting rotating shaft assembly |
| 06/23/2004 | CN1155307C Apparatus for transporting parts |
| 06/23/2004 | CN1155302C Holding device for holding printed circuit board |
| 06/23/2004 | CN1155020C Method for producing electronic element |
| 06/22/2004 | US6754549 Parts mounting apparatus and parts checking method by the same |
| 06/22/2004 | US6753474 Pick and place cover for multiple terminal electronic components |
| 06/22/2004 | US6752291 Component feeding method, component feeding apparatus, and component feeding unit |
| 06/22/2004 | US6751862 Method of making an electronic device |
| 06/17/2004 | WO2004052072A1 Parts mounting device and method |
| 06/17/2004 | WO2004052071A1 Electronic parts mounting apparatus and method |
| 06/17/2004 | WO2004052070A1 Method for fixing a miniaturised component to a carrier plate |
| 06/17/2004 | WO2004052068A1 Board carrier, component mounter, and method for carrying board in component mounting |
| 06/17/2004 | WO2004051731A1 Component-supplying head device, component-supplying device, comonent-mounting device, and method of moving mounting head portion |
| 06/17/2004 | US20040111879 Circuit board component installation tools and methods of using |
| 06/17/2004 | US20040111860 Edge connector removal tool |
| 06/17/2004 | DE10253954A1 Process for attaching electronic components such as ball grid arrays and flip chips to a carrier, involves using a prehardened adhesive layer which is softened by radiation |
| 06/16/2004 | EP1429593A1 Electronic component mounting apparatus |
| 06/16/2004 | EP1228676B1 Method and apparatus for holding a printed circuit board in a precise position during processing |
| 06/16/2004 | EP1197132B1 Support rod and base plate for supporting substrates in component mounting machines |