Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2008
03/25/2008US7348605 Organic electroluminescent display device
03/25/2008US7348604 Light-emitting module
03/25/2008US7348603 Anisotropic collimation devices and related methods
03/25/2008US7348602 Nitride semiconductor device
03/25/2008US7348601 Nitride-based compound semiconductor light emitting device
03/25/2008US7348600 Nitride semiconductor device, and its fabrication process
03/25/2008US7348584 Infrared projector
03/25/2008US7348212 Interconnects for semiconductor light emitting devices
03/25/2008US7348205 Method of forming resistance variable devices
03/25/2008US7348195 Semiconductor light-emitting device and method for fabricating the device
03/25/2008US7347604 LED lantern structure
03/25/2008US7347603 Light-emitting diode
03/25/2008US7347589 LED and LED lamp
03/25/2008CA2406347C Gan substrate, method of growing gan and method of producing gan substrate
03/25/2008CA2279066C An integrated optics chip with reduced thermal errors due to pyroelectric effects
03/20/2008WO2008033563A2 Support for flip-chip bonding a light emitting chip
03/20/2008WO2008032812A1 Phosphor, method for producing the same, phosphor-containing composition, light-emitting device, image display and illuminating device
03/20/2008WO2008032676A1 Light emitting module
03/20/2008WO2008031391A1 Surface-mountable housing for a semiconductor chip
03/20/2008WO2008031345A1 Semiconductor light emitting device
03/20/2008WO2008031339A1 Light emitting diode device, and manufacture and use thereof
03/20/2008WO2008031338A1 Semiconductor light emitting device
03/20/2008WO2008031281A1 A plugin, combined with a cooler, and thermoelectric separate led bulb
03/20/2008WO2008031280A1 Light emitting diode structure
03/20/2008WO2008031249A1 Backlight module with oval lenses
03/20/2008WO2007141664A3 Apparatus, system and method for use in mounting electronic elements
03/20/2008US20080070413 Fabrication methods of a patterned sapphire substrate and a light-emitting diode
03/20/2008US20080070387 Semiconductor device manufacturing method
03/20/2008US20080070380 Production Method of Compound Semiconductor Device Wafer
03/20/2008US20080070337 Light emitting element and method of making same
03/20/2008US20080070336 Semiconductor layer formed by selective deposition and method for depositing semiconductor layer
03/20/2008US20080070334 LED Including Photonic Crystal Structure
03/20/2008US20080070333 Optical Semiconductor Device And Method Of Manufacturing Thereof
03/20/2008US20080070332 Method of fabricating display substrate and method of fabricating display panel using the same
03/20/2008US20080069169 Spatial bandgap modifications and energy shift of semiconductor structures
03/20/2008US20080069168 Vertical cavity surface emitting laser and fabricating method thereof
03/20/2008US20080069162 Nitride-based semiconductor device and method of fabricating the same
03/20/2008US20080068845 Optical device and method for making the same
03/20/2008US20080068842 Semiconductor Light-Emitting Device with Improved Heatsinking
03/20/2008US20080068836 Illuminating device and backlight device employing the illuminating device
03/20/2008US20080067920 Light emitting device
03/20/2008US20080067919 Phosphor of White LED and the Manufacturing Method of the Same
03/20/2008US20080067918 Light emitting module
03/20/2008US20080067916 Light emitting device having a patterned substrate and the method thereof
03/20/2008US20080067911 Method of manufacturing optical element and method of manufacturing resin-sealed light emitting element as well as optical element, resin-sealed light emitting element and planar light source device
03/20/2008US20080067541 Nitride-based semiconductor device and method of fabricating the same
03/20/2008US20080067540 Semiconductor device
03/20/2008US20080067539 Semiconductor light emitting element and method of making the same
03/20/2008US20080067538 Electrode Structure of a Transistor, and Pixel Structure and Display Apparatus Comprising the Same
03/20/2008US20080067537 Support for flip-chip bonding a light emitting chip
03/20/2008US20080067536 Image display device and light emission device
03/20/2008US20080067535 Side view LED package structure
03/20/2008US20080067534 Light emitting device
03/20/2008US20080067533 Flexible circuit light-emitting structures
03/20/2008US20080067532 Semiconductor Materials and Devices
03/20/2008US20080067531 Light emitting diode having light diffusion member and method for manufacturing the same
03/20/2008US20080067530 Organic laser
03/20/2008US20080067529 Manufacturing a semiconductor device
03/20/2008US20080067527 Photo-radiation source
03/20/2008US20080067526 Flexible circuits having improved reliability and thermal dissipation
03/20/2008US20080067525 Light emitting devices
03/20/2008US20080067522 Gallium Nitride-Based Semiconductor Stacked Structure, Production Method Thereof, and Compound Semiconductor and Light-Emitting Device Each Using the Stacked Structure
03/20/2008US20080067518 Pixel structure and repairing method thereof
03/20/2008US20080067497 Light emitting device and manufacturing method thereof
03/20/2008DE202007012162U1 LED-Gehäuse LED housing
03/20/2008DE19939471B4 Halbleiterleuchtdiode mit Stromdiffusionsschicht Semiconductor light-emitting diode with current diffusion layer
03/20/2008DE112004002083T5 Lichtemittierende Vorrichtung A light emitting device
03/20/2008DE112004000155T5 Anschlussrahmen für ein Halbleiterbauelement Lead frame for a semiconductor device
03/20/2008DE102007040811A1 Einkapselungsmittel-Profil für lichtemittierende Dioden Encapsulant profile for light-emitting diodes
03/20/2008CA2680353A1 Background light module with oval lenses
03/19/2008EP1901358A1 Method of fabricating light emitting device
03/19/2008EP1901357A2 Optoelectronic semiconductor chip
03/19/2008EP1900859A1 Composite comprising array of acicular crystal, process for producing the same, photoelectric conversion element, luminescent element, and capacitor
03/19/2008EP1900044A1 Nanostructure based light emitting devices and associated methods
03/19/2008EP1900043A1 Light-emitting diode and method for fabrication thereof
03/19/2008EP1900042A1 Compound semiconductor light-emitting diode and method for fabrication thereof
03/19/2008EP1900041A1 Semiconductor device, method for fabricating an electrode, and method for manufacturing a semiconductor device
03/19/2008EP1900040A1 Light emitting diode and method of fabricating the same
03/19/2008EP1900023A2 Package, subassembly and methods of manufacturing thereof
03/19/2008EP1900013A2 Technique for the growth and fabrication of semipolar (ga,al,in,b)n thin films, heterostructures, and devices
03/19/2008EP1899435A1 Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
03/19/2008EP1493187A4 Lighting device and method
03/19/2008EP1390966A4 Uv reflectors and uv-based light sources having reduced uv radiation leakage incorporating the same
03/19/2008EP1328014B1 Semiconductor base material and method of manufacturing the material
03/19/2008EP1206802B1 Led-based white-light emitting lighting unit
03/19/2008CN201039255Y LED mobile phone flashing device
03/19/2008CN201038190Y LED package structure
03/19/2008CN201038189Y Elliptical light-emitting diode with pin ranked along short axis and display screen display module
03/19/2008CN201038188Y High light extraction efficiency semi-sphere GaN based large power LED chip
03/19/2008CN201038187Y Boring insert type light-emitting diode package structure
03/19/2008CN201038186Y Large power LED
03/19/2008CN201038185Y LED with optical refraction and scattering medium
03/19/2008CN201038184Y Large power LED packaging glass mirror
03/19/2008CN201038144Y LED heat dissipation structure
03/19/2008CN201038137Y Infrared tube, tube holder and infrared tube module device
03/19/2008CN201038132Y Magnetic adsorption guide wire material-feeding device
03/19/2008CN101147270A Light emitting element storing package, light emitting device and lighting apparatus
03/19/2008CN101147269A Zinc oxide compound semiconductor light emitting element
03/19/2008CN101147268A Zinc oxide-based compound semiconductor element
03/19/2008CN101147267A Production method of group iii nitride semioconductor element
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