Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
11/2008
11/20/2008US20080285270 Light emitting diode package
11/20/2008US20080284946 Lighting System and Liquid Crystal Display Using the Same
11/20/2008US20080284471 Current load driving circuit
11/20/2008US20080284346 Light emitting diode array driving apparatus
11/20/2008US20080284330 Light Emitting Module, and Method for Producing the Same
11/20/2008US20080284329 Led with Improve Light Emittance Profile
11/20/2008US20080284315 Light emitting device and light emitter
11/20/2008US20080284311 Assembling Lighting Elements Onto a Substrate
11/20/2008US20080284310 Light emitting device, light source and method of making the device
11/20/2008US20080284309 insulating material high both in thermal conductivity and light reflectance, and submount high in heat radiatability for mounting LED element thereon, capable of raising light utilization factor and quickly radiating heat generated; hermetic sealing
11/20/2008US20080284308 Low profile and high efficiency lighting device for backlighting applications
11/20/2008US20080283968 Group III-Nitride Semiconductor Crystal and Manufacturing Method Thereof, and Group III-Nitride Semiconductor Device
11/20/2008US20080283869 Method for manufacturing semiconductor light emitting device
11/20/2008US20080283865 III-Nitride Compound Semiconductor Light Emitting Device
11/20/2008US20080283863 Transparent electrode
11/20/2008US20080283862 Side-emission type semiconductor light-emitting device and manufacturing method thereof
11/20/2008US20080283861 Power light emitting die package with reflecting lens and the method of making the same
11/20/2008US20080283860 Light emitting device
11/20/2008US20080283859 Light-emitting diode apparatus and manufacturing method thereof
11/20/2008US20080283858 Light-emitting diode and method for manufacturing same
11/20/2008US20080283857 Novel phosphor for white light-emitting diodes and fabrication of the same
11/20/2008US20080283856 Light-emitting diode module and the manufacturing thereof
11/20/2008US20080283855 Optoelectronic Thin-Film Chip
11/20/2008US20080283854 Light emitting diode device layer structure using an indium gallium nitride contact layer
11/20/2008US20080283853 Light-Emitting Diode, Light-Emitting Diode Substrate and Production Method of Light-Emitting Diode
11/20/2008US20080283851 GaN Substrate, and Epitaxial Substrate and Semiconductor Light-Emitting Device Employing the Substrate
11/20/2008US20080283850 Reflective Positive Electrode and Gallium Nitride-Based Compound Semiconductor Light-Emitting Device Using the Same
11/20/2008US20080283849 Led device and method by which it is produced
11/20/2008US20080283846 Method for growing semiconductor layer, method for producing semiconductor light-emitting element, semiconductor light-emitting element, and electronic device
11/20/2008US20080283843 Display device and electronic device using thin-film transistors formed on semiconductor thin films which are crystallized on insulating substrates
11/20/2008US20080283838 Semiconductor device and manufacturing method thereof
11/20/2008US20080283836 Light emitting display device and method for fabricating the same
11/20/2008US20080283823 Gallium Nitride-Based Semiconductor Stacked Structure
11/20/2008US20080283822 Semiconductor light emitting device
11/20/2008US20080283821 Method of growing gan crystal on silicon substrate, and light emitting device and method of manufacturing thereof
11/20/2008US20080283820 LED packaged structure and applications of LED as light source
11/20/2008US20080283819 Semiconductor light emitting device
11/20/2008US20080283818 Semiconductor Heterostructure
11/20/2008US20080283797 Covered alkaline earth ortho-silicate particle activated by Eu2+, and either La, Cs, Gd or K; orthorhombic crystal structure; emits luminescence of colors ranging from green to orange.
11/20/2008US20080283492 Method for manufacturing light reflecting metal wall
11/20/2008DE112007000290T5 Lichtemittierende Vorrichtung und lichtemittierendes Modul A light emitting device and light-emitting module
11/20/2008DE112006002927T5 Licht emittierende Diode mit ITO-Schicht und Verfahren zur Herstellung einer solchen Light-emitting diode with the ITO layer and methods for producing such
11/20/2008DE10312214B4 Verfahren zum Herstellen von mindestens einer Mesa- oder Stegstruktur oder von mindestens einem elektrisch gepumpten Bereich in einer Schicht oder Schichtenfolge A method for producing at least one mesa or ridge structure or of at least one electrically pumped region in a layer or layer sequence
11/19/2008EP1993152A2 Light-emitting semiconductor construction element with luminescence conversion element
11/19/2008EP1993151A2 Light emitting device and method of manufacturing the same
11/19/2008EP1993150A2 Method for growing semiconductor layer, method for producing semiconductor light-emitting element, semiconductor light-emitting element, and electronic device
11/19/2008EP1993149A2 LED device and method by which it is produced
11/19/2008EP1993148A1 Optical transmission/reception device
11/19/2008EP1992050A1 High efficiency leds with tunnel junctions
11/19/2008EP1992020A1 Method for preparing a semiconductor
11/19/2008EP1992019A1 Semiconductor light emitting diode that uses silicon nano dot and method of manufacturing the same
11/19/2008EP1991977A1 Driver for controlling light emitting polymer and method thereof
11/19/2008EP1991907A2 Light emitting diode projection system
11/19/2008EP1741315B1 Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
11/19/2008EP1741145A4 Led lighting assembly with improved heat management
11/19/2008CN201153128Y Encapsulation construction of LED
11/19/2008CN201153127Y Sheet type LED with double side encapsulated
11/19/2008CN201153121Y Omnidirectional luminous diode construction
11/19/2008CN201152470Y Semiconductor lamp
11/19/2008CN101310567A Lighting apparatus
11/19/2008CN101310392A Gallium nitride-based compound semiconductor light-emitting device
11/19/2008CN101310140A Illumination device
11/19/2008CN101310139A Led lamp
11/19/2008CN101309536A Lighting device, illumination device and liquid crystal display apparatus
11/19/2008CN101308971A Socket
11/19/2008CN101308899A Semiconductor light emitting device
11/19/2008CN101308898A Light emitting device and method of manufacturing the same
11/19/2008CN101308897A Led device and method by which it is produced
11/19/2008CN101308896A Gan substrate, and epitaxial substrate and semiconductor light-emitting device employing the substrate
11/19/2008CN101308895A Metal semiconductor field effect light emitting transistor and preparing method thereof
11/19/2008CN101308894A Manufacture method of LED support
11/19/2008CN101308893A Grain binding material and method for light emitting diode
11/19/2008CN101308892A Manufacture method of light emitting diode encapsulation
11/19/2008CN101308891A Manufacture method of light emitting diode encapsulation having prefocus cup
11/19/2008CN101308890A Light emitting diode element and manufacture method thereof
11/19/2008CN101308889A Method for enhancing light-emitting efficiency of semiconductor type carbon nano-tube
11/19/2008CN101308888A Material construction for enhancing optical property and temperature stability of self-organizing quantum point
11/19/2008CN101308887A High-brightness LED and manufacture thereof
11/19/2008CN101308886A Light-emitting component construction and manufacturing process
11/19/2008CN101308885A High power LED lens encapsulation process
11/19/2008CN101308884A Manufacture process of white light LED with high power
11/19/2008CN101308828A Great power LED cooling method
11/19/2008CN101308801A Cutting method of lamination substrate, semiconductor device and manufacturing method thereof and luminescent device
11/19/2008CN101308800A Method for manufacturing light reflecting metal wall
11/19/2008CN101308780A Method for preparing semiconductor substrate
11/19/2008CN101307893A 照明装置 Lighting device
11/19/2008CN101307880A Highly effective curved face reflecting type LED power optical module group
11/19/2008CN101307872A Lighting system and liquid crystal display using the same
11/19/2008CN101307870A Phosphor based illumination system having a long pass reflector and method of making same
11/19/2008CN101307867A Liquid immersion type packaged large power LED light source
11/19/2008CN101307498A Iii-v nitride substrate wafer and its manufacture method and uses
11/19/2008CN101307229A Phosphor
11/19/2008CN101307183A Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
11/19/2008CN100435601C Organic electroluminescent element and making method thereof
11/19/2008CN100435436C Method for making semiconductor substrate
11/19/2008CN100435369C Light-emitting semiconductor device having radiation converting covering element
11/19/2008CN100435368C Flip chip light emitting diode and method of manufactureing the same
11/19/2008CN100435367C Light-emitting diode
11/19/2008CN100435366C Method for low temp sintering, packaging and connecting high power LED by nano-silver soldering paste
11/19/2008CN100435365C Light-emitting diode, backlight device and method of manufacturing the light-emitting diode
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