Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2010
05/25/2010US7723732 Semiconductor light-emitting device and manufacturing method thereof
05/25/2010US7723731 Semiconductor light emitting device
05/25/2010US7723730 Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips
05/25/2010US7723719 Light emitting devices with inhomogeneous quantum well active regions
05/25/2010US7723718 Epitaxial structure for metal devices
05/25/2010US7722953 Light-emitting nanoparticles comprising octanol as a passivating agent, and method of making same
05/25/2010US7722235 Vehicle headlamp
05/25/2010US7722217 Light-emitting diode cluster lamp
05/20/2010WO2010057023A2 System and method for forming a thin-film phosphor layer for phosphor-converted light emitting devices
05/20/2010WO2010057019A2 Phosphor-coated light extraction structures for phosphor-converted light emitting devices
05/20/2010WO2010056596A2 Electrically pixelated luminescent device incorporating optical elements
05/20/2010WO2010056083A2 Vertical/horizontal light-emitting diode for semiconductor
05/20/2010WO2010055987A1 Method for manufacturing gallium oxide substrate, light emitting device, and method for manufacturing the light emitting device
05/20/2010WO2010055831A1 Semiconductor light-emitting device
05/20/2010WO2010055635A1 Nitride semiconductor device
05/20/2010WO2010054628A2 Radiation-emitting component and method for producing the same
05/20/2010WO2010054622A2 Optoelectronic component
05/20/2010WO2010033347A3 Optical cup for lighting module
05/20/2010WO2010027672A3 Phosphor-converted led
05/20/2010US20100124797 GaN COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME
05/20/2010US20100124794 Method for manufacturing semiconductor apparatus and mold assembly for the same
05/20/2010US20100124246 Method for production of a plurality of semicoductor chips, and a semiconductor component
05/20/2010US20100123168 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same
05/20/2010US20100123167 Method for manufacturing gallium oxide based substrate, light emitting device, and method for manufacturing the light emitting device
05/20/2010US20100123166 Semiconductor light-emitting device
05/20/2010US20100123165 Semiconductor material, method of producing semiconductor material, light emitting device and light receiving device
05/20/2010US20100123164 Light emiting device and method of making same
05/20/2010US20100123163 Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display
05/20/2010US20100123162 Optical semiconductor apparatus and method for producing the same
05/20/2010US20100123161 Light emitting diode, production method thereof and lamp
05/20/2010US20100123160 Light-Emitting Device, Method for Manufacturing the Same, and Cellular Phone
05/20/2010US20100123159 Side-view type light emitting device and line light source type light emitting device
05/20/2010US20100123158 Light emitting device and method of manufacturing the same
05/20/2010US20100123157 Circuit board for led
05/20/2010US20100123156 Light emitting device
05/20/2010US20100123155 Semiconductor nanoparticle-based light-emitting devices and associated materials and methods
05/20/2010US20100123154 Light emitting device package
05/20/2010US20100123153 Light-emitting device
05/20/2010US20100123152 Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device
05/20/2010US20100123151 Light-emitting device
05/20/2010US20100123150 Hybrid organic light emitting diode
05/20/2010US20100123149 Semiconductor light emitting device
05/20/2010US20100123148 Semiconductor light emitting device
05/20/2010US20100123147 Semiconductor light emitting device
05/20/2010US20100123146 Light-emitting device structure and semiconductor wafer structure with the same
05/20/2010US20100123145 Light emitting device and light emitting device package having the same
05/20/2010US20100123144 Circuit structure of package carrier and multi-chip package
05/20/2010US20100123143 Three-dimensional led light-emitting plate
05/20/2010US20100123142 Flat panel display apparatus
05/20/2010US20100123141 Emissive device with chiplets
05/20/2010US20100123138 Display device and method of manufacturing the same
05/20/2010US20100123136 Semiconductor device and manufacturing method thereof
05/20/2010US20100123131 Thin film transistor and display device
05/20/2010US20100123129 ZnO-CONTAINING SEMICONDUCTOR LAYER AND DEVICE USING THE SAME
05/20/2010US20100123119 Light emitting diode having indium nitride
05/20/2010US20100123118 LED Epitaxial Wafer with Patterned GaN based Substrate and Manufacturing Method For the Same
05/20/2010US20100122725 Nanostructured Devices
05/20/2010DE102009017148A1 Verbindungshalbleiter-LED und Verfahren zu deren Herstellung Compound semiconductor LED and processes for their preparation
05/20/2010DE102009010468A1 Method for manufacturing layer of radiation-emitting functional material arranged with light conversion material particle for substrate, involves supplying composition, which contains solvent and organic bonding agent
05/20/2010DE102009007625A1 Verbundsubstrat für einen Halbleiterchip Composite substrate for a semiconductor chip
05/20/2010DE102008057720A1 Radiation emitting device i.e. white light emitting device, has radiation converting layer provided with organic radiation converting luminescent material and arranged at distance from radiation emitting functional layer
05/20/2010DE102008057350A1 Strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung Radiation-emitting component and method for its production
05/20/2010DE102008057174A1 Oberflächenmontierbare Vorrichtung Surface mount device
05/20/2010DE102008021436A1 Optik-Konverter-System für (W)LEDs Optic converter system (W) LEDs
05/20/2010DE102004016416B4 Fahrzeugscheinwerfer und Halbleiterlichtemissionselement Vehicle headlights and semiconductor light emitting element
05/19/2010EP2187459A2 Light emitting device
05/19/2010EP2187458A2 Semiconductor light emitting device with shock protection
05/19/2010EP2187457A2 Light emitting device package
05/19/2010EP2187456A2 Semiconductor light emitting device
05/19/2010EP2187455A1 Semiconductor light emitting device
05/19/2010EP2187454A2 Semiconductor light-emitting device
05/19/2010EP2187453A2 Light Emitting Device and Method of Manufacturing the Same
05/19/2010EP2187442A2 Light emitting device and light emitting device package having the same
05/19/2010EP2186143A2 Light-emitting structure
05/19/2010EP2186142A1 Silicone based circuit board indicator led lens
05/19/2010EP2186141A2 Mounting structure for leds, led assembly, led assembly socket, method for forming a mounting structure
05/19/2010EP2186118A1 A method of manufacturing an organic electronic or optoelectronic device
05/19/2010EP2185952A1 Optical component, method for producing said component, and optoelectronic assembly unit comprising said component
05/19/2010CN201479470U Laminated panel of radiator-based copper foil printed circuit board
05/19/2010CN201478344U Light emitting diode epoxy resin encapsulation heating curing device
05/19/2010CN201478343U Compression structure for LED lamp packaging clamp
05/19/2010CN201478342U Funnel type BIN sorting mechanism
05/19/2010CN201478341U Novel light emitting diode with high heat conductivity and high power
05/19/2010CN201478340U Upper insulation base shaping structure for light emitting diode support metal band
05/19/2010CN201478339U LED heat dissipation device
05/19/2010CN201478338U Flip-chip element for golden ball to golden ball connection (GGI) welding process
05/19/2010CN201478337U Glue staining mechanism for LED glue pouring device
05/19/2010CN201478336U Die bond head device
05/19/2010CN201478309U Light emitting diode modified structure
05/19/2010CN201478302U Encapsulation structure of luminous element
05/19/2010CN201477362U Photoetching plate used for manufacturing LED chips
05/19/2010CN201477180U Detection carrier of semiconductor crystal grain with double-sided electrode
05/19/2010CN201475954U Radiating device
05/19/2010CN201475757U High power LED lamp
05/19/2010CN201475750U Led light source
05/19/2010CN201475744U LED packaging structure
05/19/2010CN201475740U Novel high-power LED lamp without halo
05/19/2010CN201475735U Lampwick structure of LED lamp
05/19/2010CN201475728U Ultra-high power integrated packaging LED module
05/19/2010CN201475700U Full-color LED lamp