Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
06/2010
06/10/2010US20100140629 Light-emitting diode and method for fabricating the same
06/10/2010US20100140624 Liquid Crystal Display Device
06/10/2010US20100140623 Array substrate for display device and method of fabricating the same
06/10/2010US20100140620 Flat-panel display semiconductor process for efficient manufacturing
06/10/2010US20100140601 Polymer compound and method for producing the same, and light-emitting material, liquid composition, thin film, polymer light-emitting device, surface light source, display device, organic transistor and solar cell, each using the polymer compound
06/10/2010US20100140585 Quantum dot white and colored light-emitting devices
06/10/2010US20100140551 Nanocrystal doped matrixes
06/10/2010US20100140549 Metal mixed oxide, phosphor, phosphor paste and light-emitting device
06/10/2010US20100140536 Gallium nitride-based material
06/10/2010US20100139852 Method for high-volume production of light emitting diodes with attached lenses
06/10/2010US20100139767 Chip package structure and method of fabricating the same
06/10/2010US20100139762 Compound-type thin film, method of forming the same, and electronic device using the same
06/10/2010US20100139759 Optical device
06/10/2010DE10230134B4 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production
06/10/2010DE102008063407A1 Eine optoelektronische oberflächenmontierte Vorrichtung und ein Verfahren zum Bilden einer optoelektronischen oberflächenmontierten Vorrichtung A surface-mounted opto-electronic device and a method for forming a surface-mounted optoelectronic device
06/10/2010DE102008061152A1 Optoelectronic semiconductor chip e.g. super luminescent diode, for use in e.g. backlight of display, has active layer for producing radiations whose pumping path is formed in meander shape and limited by mesa trenches in lateral section
06/10/2010DE102008061032A1 Beleuchtungseinrichtung Lighting device
06/10/2010DE102008060680A1 Oberflächenmodifizierte Silikat-Leuchtstoffe Surface-modified silicate phosphors
06/10/2010CA2745634A1 Energy conversion device
06/09/2010EP2194590A2 Light emitting device and display
06/09/2010EP2194589A2 Lead frame, light emitting diode having the lead frame and backlight unit having the light emitting diode
06/09/2010EP2194588A2 Light emitting device and method for manufacturing same
06/09/2010EP2194587A2 Light emitting device and method of manufacturing the same
06/09/2010EP2194586A1 Semiconductor device and method for manufacturing the same
06/09/2010EP2194585A1 Semiconductor light emitting device
06/09/2010EP2194167A1 Method for growth of GaN single crystal, method for preparation of GaN substrate, process for producing GaN-based element, and GaN-based element
06/09/2010EP2194099A1 Addition-curable silicone composition that produces cured product having high refractive index, and optical element encapsulating material formed from the compostion
06/09/2010EP2194085A1 Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
06/09/2010EP2194026A1 Large-area nanoenabled macroelectronic substrates and uses therefor
06/09/2010EP2193696A1 High thermal performance packaging for optoelectronics devices
06/09/2010EP2193556A2 Radiation-emitting semiconductor chip
06/09/2010EP2193555A1 Opto-electronic semiconductor body
06/09/2010EP2193554A1 Collimator
06/09/2010EP2193553A1 Optoelectronic semiconductor chip, optoelectronic component, and method for producing an optoelectronic component
06/09/2010EP2193551A1 Arrangement comprising an optoelectronic component
06/09/2010EP2193550A1 Radiation-emitting semiconductor body
06/09/2010CN201504362U Ceramic matrix circuit assembly
06/09/2010CN201503872U Light-emitting element of aluminum nitride ceramic substrate
06/09/2010CN201503871U High power LED structure with rapid heat dissipation
06/09/2010CN201503870U LED heat dissipation base
06/09/2010CN201503861U Light-emitting diode packaging structure capable of lightening light source in areas
06/09/2010CN201502997U High-efficiency heat dissipation aluminum substrate for LED illumination and LED light source
06/09/2010CN201502989U Industrial high-power LED lighting equipment
06/09/2010CN201502975U Packaging structure of high-power LED for indoor lighting
06/09/2010CN201502974U LED heat radiation base encapsulation structure
06/09/2010CN201502972U LED lamp support frame
06/09/2010CN201502955U Led lens
06/09/2010CN201502905U Led light source
06/09/2010CN201502896U LED module group
06/09/2010CN201502895U Light source device
06/09/2010CN201502893U Novel LED lighting module
06/09/2010CN201502884U Omnidirectional luminous LED lamp
06/09/2010CN1965614B Electroluminescent structure and LED with an EL structure
06/09/2010CN1877880B Camera
06/09/2010CN1840607B Complexes of form l2mx as phosphorescent dopants for organic LEDs
06/09/2010CN1825637B Light source apparatus and manufacture method thereof
06/09/2010CN1739202B Light emitting device
06/09/2010CN1682384B Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor
06/09/2010CN101730819A Led illumination device using diffraction member
06/09/2010CN101728476A High-thermal conductive metal base plate used for transferring gallium nitride epitaxial layer of LED and preparation method thereof
06/09/2010CN101728475A Optoelectronic component
06/09/2010CN101728474A Manufacturing technology of high heat-conductivity high-power LED substrate
06/09/2010CN101728473A High-power LED chip bracket
06/09/2010CN101728472A Multilayer LED chip structure and preparation method thereof
06/09/2010CN101728471A Semiconductor light emitting device
06/09/2010CN101728470A Light-emitting diode device and method for fabricating the same
06/09/2010CN101728469A Light-emitting diode and grain thereof
06/09/2010CN101728468A Method for realizing non-refrigeration package coupling of semiconductor super-radiation light emitting diode
06/09/2010CN101728467A Light-emitting device, backlight module and LCD
06/09/2010CN101728466A High-power LED ceramic packaging structure and manufacturing method thereof
06/09/2010CN101728465A Preparation method of light-emitting diode
06/09/2010CN101728464A Concentrating component of light-emitting diode
06/09/2010CN101728463A Photoelectric element
06/09/2010CN101728462A Multi-wavelength light-emitting diode and production method thereof
06/09/2010CN101728451A Semiconductor photoelectric element
06/09/2010CN101728449A Diamond-like carbon electronic device and manufacturing method thereof
06/09/2010CN101728411A Semiconductor light emitting device
06/09/2010CN101728288A Direct die attach utilizing heated bond head
06/09/2010CN101728280A Encapsulation structure of light-emitting diode and preparation method thereof
06/09/2010CN101728250A Method for growing p-type AlGaN
06/09/2010CN101728244A Method for blocking dislocation defects of semiconductor
06/09/2010CN101725930A Method for producing large-power LED lamp without halo
06/09/2010CN101725894A Method for secondary light distribution of LED
06/09/2010CN101725854A Light-emitting module and illuminating apparatus
06/09/2010CN101725850A 照明装置 Lighting device
06/09/2010CN101725847A Blue-green and green phosphors for lighting applications
06/09/2010CN101725843A System and method for configuring LED backlight module with high color saturation
06/09/2010CN101724401A Red luminous silicon-oxygen nitride fluorescent material, preparation method and light emitting device using same
06/09/2010CN101447545B Parallelogrammic LED chip
06/09/2010CN101447535B Luminescent element
06/09/2010CN101409318B Manufacturing method of LED chip
06/09/2010CN101399307B Flip chip type light-emitting element
06/09/2010CN101399301B Surface adhesion conducting wire rack
06/09/2010CN101393949B LED encapsulation construction and use thereof
06/09/2010CN101388430B Highly efficient LED having improved current spread layer construction and manufacturing method thereof
06/09/2010CN101388324B Preparation of germanium quantum point
06/09/2010CN101379626B Housing for a light-emitting diode component, and a light-emitting diode component
06/09/2010CN101373807B Preparation of conductive metallic layer on semiconductor device
06/09/2010CN101369623B Technique for coating fluorescent powder on LED chip
06/09/2010CN101359704B Light element device and method for manufacturing same
1 ... 500 501 502 503 504 505 506 507 508 509 510 511 512 513 514 515 516 517 518 519 520 ... 994