Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
04/1993
04/07/1993EP0535955A1 Thermoplastic resin composition
04/07/1993EP0535667A2 Thermosetting compositions, thermal latent acid catalysts, method of coating and coated articles
04/07/1993EP0535163A1 Vulcanized blends of thermoplastic elastomers and epdm rubber and method for making
04/07/1993EP0276327B1 Resin composition and process for its preparation
04/07/1993CN1070661A Procedure for synthesis of white or light-coloured cross-linked halogen containing polymer
04/06/1993US5200494 Curing agent which is reaction product of N,N-dialkylaminoalkylamine, primary amine and diisocyanate; storage stable, quick curing
04/03/1993CA2079248A1 Thermoplastic resin composition
03/1993
03/31/1993EP0256130B1 Prepreg and its composite
03/30/1993US5198516 Heat resistance, prepregs, printed circuits, dielectrics, addition polymers
03/30/1993US5198510 Modification of vinyl ester resins with reactive liquid polymers
03/30/1993US5198497 Polyolefin, rubber and eva-maleic anhydride terpolymer blend
03/30/1993US5198489 Thermoplastic compositions for producing metallic moldings
03/30/1993US5198476 Ultraviolet-curable silicone composition for regulating peel strength
03/30/1993US5198286 Multilayer panels, epoxy resins, rubber elastomers, blowing agents, plasticizers and hardeners
03/30/1993CA1315443C Heat-curable resin mixture
03/30/1993CA1315430C Fortifiers for anhydride-cured epoxy resins
03/25/1993DE4230839A1 Polyarylene ether] with pyrazole units - useful for modification of matrix resins
03/24/1993EP0533465A2 Resin formulation
03/24/1993EP0532896A2 Cleavable diepoxide for removable device protection in electronic packaging
03/24/1993EP0313574B1 Potted electrical/mechanical devices, and dual cure potting method
03/23/1993US5196461 Styrenic copolymer/polyacetal blend compositions
03/23/1993US5196457 Dual cure epoxy prepreg containing unsaturated polyester
03/23/1993US5196296 Epoxy acrylate resins and photosensitive resin compositions therefrom
03/21/1993CA2078603A1 Resin formulation
03/18/1993WO1993005112A1 Procedure for synthesis of a white or light-coloured cross-linked halogen containing polymer
03/18/1993CA2116861A1 Procedure for synthesis of a white or light-coloured cross-linked halogen containing polymer
03/17/1993EP0532016A1 Composite focused load control surface
03/17/1993EP0531844A1 Thermosetting reactive resin mixtures, method for their preparation and their use for preparing press masses and molded articles
03/17/1993EP0531511A1 Post-extended anionic acrylic dispersion
03/17/1993EP0531510A1 Post-extended anionic polyurethane dispersion
03/16/1993US5194502 Epoxy resin, urethane-modified epoxy resin and carboxylated polyester
03/13/1993CA2077804A1 Thermosetting reaction mixtures, a process for their production and the use thereof for production of moldings and molding material
03/10/1993EP0530869A1 Modified epoxy resins for the production of endless objects
03/10/1993EP0530729A1 Method for grinding back side of semiconductor wafer and pressure-sensitive adhesive tape used in said method
03/10/1993EP0530602A1 Processes of preparation of aqueous epoxy resin dispersions
03/10/1993EP0530442A1 Process for producing a hydroxy-substituted poly (phenylene ether) resin
03/10/1993EP0530360A1 Glass-reinforced grafted branched higher alpha-olefins
03/09/1993US5192605 Epoxy resin bonded flexible graphite laminate and method
03/09/1993CA1314354C Encapsulating compositions
03/09/1993CA1314346C Latex adhesive for bonding polyether urethane foam
03/04/1993WO1993004130A1 Copolyetherimide ester compositions
03/04/1993WO1993004125A1 High melt viscosity filled polyester composition
03/04/1993WO1993004104A1 Internally flexibilized advanced epoxy resin compositions and coatings therefrom
03/04/1993WO1993004098A1 Macromonomers having reactive side groups
03/04/1993CA2114795A1 Internally flexibilized advanced epoxy resin compositions and coatings therefrom
03/03/1993EP0529936A1 Epoxy resin compositions
03/03/1993EP0529799A1 A process for producing a compatible thermoplastic resin composition comprising polyphenylene ether and polyamide.
03/03/1993EP0529124A1 Casting resin composition
03/03/1993EP0528874A1 Dispersion-based heat-seal coating.
03/03/1993EP0343219B1 Use of a solid phenol formaldehyde condensation product as a hardener in epoxy resin mixtures and process for making a powder paint from said mixtures
03/02/1993US5191033 Adhesives or high strength polymers
03/02/1993US5191030 Process for producing amino group terminated polyphenylene ether
03/02/1993US5191020 Polyphenylene sulfide resin composition
03/02/1993US5190995 Polyepoxides, block polymer with polysiloxane
03/01/1993CA2075879A1 Process for the preparation of aqueous epoxy resin dispersions
02/1993
02/24/1993EP0528678A1 A pyrrolidylthiocarbapenem derivative
02/24/1993EP0528595A1 Hardenable resin composition
02/24/1993EP0527740A1 Azeotropic composition of perfluoro-1,2-dimethylcyclobutane with 1,1-dichloro-1-fluoroethane.
02/23/1993US5189082 Imide epoxy resins for sealing semiconductor elements
02/20/1993CA2076333A1 Hardenable resin compositions and methods
02/18/1993WO1993003094A1 A coating composition for a clearcoat with improved solvent and acid resistance
02/17/1993EP0527706A1 High performance epoxy adhesive composition with high flexibility and toughness
02/17/1993EP0527548A1 Curable resin compositions and process for the preparation thereof
02/17/1993EP0496805A4 Liquid electrical tape formulation
02/17/1993CN1069147A Epoxy molding composition for surface mount applications
02/16/1993WO1993004121A1 Aminoplast resin or aminoplast resin precursor
02/16/1993US5187253 Method of manufacturing polyetherurethane urea amines, and use of same
02/13/1993CA2075656A1 High performance epoxy adhesive composition with high flexibility and toughness
02/10/1993EP0526991A1 Aqueous coating composition
02/10/1993EP0526895A2 Epoxy resin composition for sealing
02/10/1993EP0526575A1 Epoxy resin systems modified with low viscosity statistical monofunctional reactive polymers
02/10/1993EP0526463A1 Energy curable cationically and free-radically polymerizable pressure-sensitive compositions.
02/10/1993EP0187855B1 Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions
02/10/1993CA2065185A1 Curable resin compositions useful as hot-melt adhesives
02/09/1993US5185388 Epoxy resin electrical encapsulation composition
02/08/1993CA2075510A1 Epoxy resin composition for sealing
02/04/1993WO1993002143A1 Thermoplastic elastomer composition
02/04/1993WO1993002142A1 Thermoplastic elastomer composition
02/04/1993WO1993002132A1 Stabilization of mineral filled polyesters using epoxy compounds
02/03/1993EP0526190A1 Method for curing an epoxy resin with a curing agent
02/03/1993EP0525418A1 Toughened, fiber-reinforced thermosetting resin matrix prepregs and composites made therefrom
02/03/1993EP0510117A4 Modified polyoxyethylene epoxy resin amphiphiles and stable aqueous epoxy dispersions thereof
02/03/1993EP0263129B1 Structural epoxy paste adhesive curable at ambient temperature and process for preparation thereof
02/02/1993US5183863 Viscoelastic resin composition for vibration-damping material
02/02/1993US5183838 Nonhydrolyzing, storage-stable and solvent-soluble complex of dianhydride and organic base; varnishes, fibers and films; polyamic and polyimide polymers
02/02/1993US5183593 Electrically conductive cement
02/02/1993US5183592 Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin
01/1993
01/28/1993DE4224070A1 Adhesive for circuit board - comprises cured resin powder in uncured resin matrix, with both resin being heat resistant and insol. in acid or oxidant
01/27/1993EP0524705A2 Thermoplastic resin composition
01/27/1993EP0524433A2 Poly-hydroxynaphthalene compounds and epoxy resin composition
01/27/1993EP0429556A4 Reinforced composite resin
01/26/1993US5182344 Transesterification; free of secondary hydroxyl groups; thermoforming; melt-processible; latently thermosetting
01/26/1993US5182340 Blends of mesogenic polythiiranes, epoxy resin and curing agent
01/26/1993US5182318 Coating composition containing metal-coated microspheres exhibiting improved resistance to environmental attack of metallic substrates
01/26/1993US5182151 Thermoplastic resin composition
01/23/1993CA2073904A1 Thermoplastic resin composition
01/21/1993WO1993001235A1 Chemical treating composition for glass fibers having emulsified epoxy with good stability and the treated glass fibers
01/21/1993WO1992020745A3 Polyacetal resin composition
01/21/1993DE4223310A1 Planarising agent for surface irregularities - comprises resin with planarising temp. under 200 deg. C and melamine- or epoxide]- type heat-hardener
01/20/1993EP0523933A1 Stabilization of mineral filled polyesters using epoxy compounds