| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/22/1993 | US5221726 Cured blend of epoxy resin, amine terminated poly(alkylene oxide) and aliphatic amine |
| 06/22/1993 | US5221704 Flame-retardant resin composition and molded article for electrical parts |
| 06/16/1993 | EP0546602A1 Liquid reactive compositions comprising polyisocyanates, epoxides and solutions of alkali metal halides in polyoxyalkylenic compounds |
| 06/16/1993 | EP0545985A1 Surface-coating compositions and composite materials |
| 06/15/1993 | US5219975 Polyurethane containing isocyanate groups blocked with secondary amine is reacted with amine |
| 06/15/1993 | US5219939 Powder coating compositions |
| 06/10/1993 | WO1993011193A1 Low vaporizable ethylenically unsaturated monomer emission vinyl ester and polyester resin compositions |
| 06/10/1993 | WO1993011176A1 Phosphorous containing resin |
| 06/10/1993 | CA2124465A1 Phosphorus containing resin |
| 06/10/1993 | CA2122466A1 Low vaporizable ethylenically unsaturated monomer emission vinyl ester and polyester resin compositions |
| 06/09/1993 | EP0591207A4 Plastic molded pieces having the appearance of a solid metallic piece. |
| 06/09/1993 | EP0545865A2 Stabilizing mixture |
| 06/09/1993 | EP0545640A1 Epoxy resin composition, prepreg containing same and process for the producing of prepreg using same |
| 06/09/1993 | EP0545354A1 Aqueous resin dispersions |
| 06/09/1993 | CN1072938A Low vaporizable ethylenically unsaturated monomer emission vinyl ester and polyester resin compositions |
| 06/09/1993 | CN1021166C Resin casting coil |
| 06/08/1993 | US5218063 For automobiles; reaction product of epoxy and amine-capped polyether and epoxy adduct of dimer acid; curable |
| 06/08/1993 | US5218037 Thermoplastic resin composition and method for preparing the same |
| 06/08/1993 | US5218029 Free flowing modified polypropylene powder for prime compositions with film-forming resin solvent |
| 06/08/1993 | US5218015 Zeolite, fine silica powder, silane coupling agent and a polysiloxane compound |
| 06/06/1993 | CA2084340A1 Aqueous resin dispersions |
| 06/02/1993 | EP0544618A1 Highly filled epoxy casting resin masses |
| 06/02/1993 | EP0544182A1 Polymeric reaction products |
| 06/02/1993 | EP0543975A1 Compositions derived from recycled polymers |
| 06/02/1993 | CN1021054C Two component epoxy resin composition without solvent impregnation |
| 06/01/1993 | US5216077 Homogeneity |
| 06/01/1993 | US5216073 A molding material of liquid crystal polymer and glycidyl ester-containing rubber handling like a thermoplastic; impact strength; mechanical properties; heat resistance |
| 06/01/1993 | US5215863 Resin composition and solder resist composition |
| 05/27/1993 | WO1993011188A1 Cross-linking agent and curable composition |
| 05/27/1993 | WO1993010540A1 Direct-hardening sealing compounds |
| 05/27/1993 | WO1993010202A1 Heat-seal coating using dispersions |
| 05/27/1993 | DE4138411A1 Haertende vergussmassen Encapsulants curing |
| 05/26/1993 | EP0543675A1 Adhesive containing microcapsules |
| 05/26/1993 | EP0502992A4 Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| 05/26/1993 | CN1020915C Adhesion primer composition for fluorinated coating |
| 05/25/1993 | US5214098 Hardenable epoxide resin mixtures containing a latent hardener, an amine and a thiol |
| 05/25/1993 | US5214049 Resin composition |
| 05/25/1993 | US5213897 Epoxy resins containing bound light stabilizing groups |
| 05/25/1993 | US5213886 Curable dielectric polyphenylene ether-polyepoxide compositions |
| 05/25/1993 | US5213747 Coating a mold with a release agent, applying a gel to a fiber reinforced resin layer and curing |
| 05/25/1993 | CA1318447C Curable compositions of polyether sulfone or polyether ketone copolymers and unsaturated imides |
| 05/25/1993 | CA1318089C Method of producing porous material having open pores |
| 05/24/1993 | CA2083466A1 Polymeric reaction products |
| 05/19/1993 | EP0552278A4 Flame retardant epoxy molding compound, method and encapsulated device. |
| 05/19/1993 | EP0542512A1 Oxygen-scavenging composition |
| 05/19/1993 | EP0542273A1 Room-temperature curable epoxy resin composition |
| 05/19/1993 | EP0542206A1 Binder composition, its preparation, coating composition containing it and its use |
| 05/19/1993 | EP0542160A1 Dispersion-based heat-seal coating |
| 05/19/1993 | EP0542114A1 Aqueous polyurethane dispersions |
| 05/19/1993 | DE4238261A1 Curable mixt. for coating, film, moulded prod. and composite, for high strength - contg. epoxy] resin with glycidyl] gps., polyarylene ether] contg. 4,4'-di:hydroxy-3,3'-di:phenyl bi:phenyl, and amino or phenolic hardener for sulphone] modifier |
| 05/18/1993 | US5212278 Polyarylene ethers |
| 05/18/1993 | US5212243 Coatings for electric and office appliances |
| 05/18/1993 | CA1318060C Film-forming resin compositions and their use for coating metals |
| 05/16/1993 | CA2082847A1 Binding-agent composition, its production, coating agent containing said binding agent, and the use thereof |
| 05/16/1993 | CA2082570A1 Aqueous polyurethane dispersions |
| 05/13/1993 | DE4227132A1 Resin mixt. contg. phenolic and epoxy] resins |
| 05/13/1993 | DE4136615A1 Injection-moulding binders for metal or ceramic powder - contain dimer acid-based polyamide, polyfunctional epoxide] and mould lubricant, esp. wax or long-chain fatty acid, alcohol or ester |
| 05/12/1993 | EP0540986A1 Thermoplastic resin composition |
| 05/12/1993 | EP0540838A1 Binder composition based on epoxy-phenol resins |
| 05/11/1993 | US5210246 Amino group-containing silicate composition and dehydrating agent containing it |
| 05/11/1993 | US5210157 Interpenetrating network of ring-containing allyl polymers and epoxy resin, and a laminate prepared therefrom |
| 05/11/1993 | US5210115 Allyl magnesium halide modified epoxy resin composition |
| 05/11/1993 | CA1317696C Encapsulating compositions containing ultra-pure, fused-silica fillers |
| 05/05/1993 | EP0540467A1 Stabilised epoxy resin compositions |
| 05/05/1993 | EP0540466A2 Solvent-free curable resin compositions, especially for the production of prepregs |
| 05/05/1993 | EP0540289A2 Electrical and electronic parts formed of polybutylene naphthalenedicarboxylate |
| 05/05/1993 | CN1020430C Composite aluminium protective material and tech thereof |
| 05/04/1993 | US5208290 Epoxy resin crosslinked with polyamine and chlorosulfonated polyolefin |
| 05/04/1993 | US5208289 Curing resin composition and its cured product |
| 04/29/1993 | CA2081404A1 Thermoplastic resin composition |
| 04/28/1993 | EP0539327A1 Epoxy novolac resins stabilised with organic phosphor compounds |
| 04/28/1993 | CN1071438A Plastics for plastic moulded motors and preparation thereof |
| 04/28/1993 | CN1071428A Pyrroliaylthiocarbapenem derivatives |
| 04/27/1993 | US5206313 Process for preparing powder coating composition |
| 04/27/1993 | US5206295 Coating composition comprising an anhydride-containing polymer and a structured epoxy-containing polymer |
| 04/27/1993 | US5206287 Reactive systems and a process for the preparation of modified duroplasts |
| 04/27/1993 | US5206281 Blend of polyphenylene ether, propylene polymer, rubber and filler; molding material |
| 04/27/1993 | US5206077 Laminated substrates impregnated with mixtures of curable unsaturated monomers, drying oils, curing agents and ceresin wax as emission suppression agent |
| 04/27/1993 | CA1317055C Impact resistant filler-containing polymer/elastomeric fiber composites |
| 04/23/1993 | CA2081000A1 Epoxy novolaks stabilised with organic phosphorus compounds |
| 04/22/1993 | DE4222233A1 Urea and-or urethane gp.-contg. imidazole cpds. - useful as hardeners for epoxy] resins prepd. e.g. by reaction of (meth)acrylic acid or ethyl (meth)acrylate with imidazole and reaction with e.g. N-aminoethyl:piperazine |
| 04/21/1993 | EP0537767A1 Thermoplastic resin composition |
| 04/21/1993 | EP0521997A4 Crosslinkable surface coatings and methods for producing same |
| 04/20/1993 | US5204025 Polyepoxides containing diglycidylamino groups and cured by a nitrogen-containing Phenol-Formaldehyde Resin resole and copper powder; moisture resistance; adhesion; shields |
| 04/18/1993 | CA2080553A1 Thermoplastic resin composition |
| 04/14/1993 | EP0537005A1 Process for making thermoset polyphenylene oxide/epoxy laminates |
| 04/14/1993 | EP0536749A1 Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom |
| 04/14/1993 | EP0536239A1 Compatibilized epoxy/polyamide compositions containing polyolefins |
| 04/14/1993 | CN1070925A Solid compositions of polyglycidyl compounds having a molecular weight of less than 1500 |
| 04/13/1993 | US5202753 Thermosetting seals consisting of base resin, aluminum oxide and fused silica is used to connect lead frame and silicon chip |
| 04/13/1993 | US5202409 Coatings, plating, adhesion, gas barrier |
| 04/13/1993 | US5202390 Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer |
| 04/13/1993 | US5202382 Thermosetting powder coating composition containing a mixture of low Tg and high Tg polymers with acid functional groups |
| 04/13/1993 | US5202009 Electrolyte solid polymer reticule |
| 04/13/1993 | CA1316284C Epoxide and rubber based curable compositions having good adhesion direct to metal |
| 04/10/1993 | CA2079991A1 Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom |
| 04/08/1993 | DE4233097A1 New semiconductor encapsulation compsn. - contains epoxy] and phenolic] resins both contg. naphthalene rings and has high heat resistance and low moisture adsorption |
| 04/08/1993 | DE4232213A1 Unsatd. ester(s) prodn. with large variation in mol. structure - by esterifying poly:carboxylic acid with epoxy-(meth)acrylate using zinc salt, and then with polyepoxide using amine catalyst etc. |
| 04/08/1993 | DE4132982A1 Additives improving elasticity and strength of epoxy] resins for stators - comprising polyoxyalkylene amine(s) and opt. also poly:alkylene glycol(s) and/or thermoplastic phenoxy] resins |
| 04/07/1993 | EP0536085A2 Solid compositions based on polyglycidyl compounds having a molecular weight lower than 1500 |