| Patents for B24B - Machines, devices, or processes for grinding or polishing; Dressing or conditioning of abrading surfaces; Feeding of grinding, polishing, or lapping agents (137) | |
|---|---|
| 01/2005 | |
| 01/06/2005 | WO2005000523A2 Non glazing dressing wheel |
| 12/2004 | |
| 12/23/2004 | WO2004110698A2 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes |
| 12/23/2004 | US20040259329 Machining substrates, particulary semiconductor wafers |
| 12/16/2004 | WO2004108353A2 Integrated tool with interchangeable wet processing components and automated calibration systems |
| 12/16/2004 | WO2004014603B1 Polishing pad with window |
| 08/2004 | |
| 08/19/2004 | WO2003028949A8 Method of machining substrates |
| 08/05/2004 | WO2004014603A3 Polishing pad with window |
| 06/2004 | |
| 06/30/2004 | EP1433195A2 Method of machining substrates |
| 06/24/2004 | WO2004004971A3 Lapping method and lapping tool for glass balls |
| 06/10/2004 | WO2004009289A8 Rising after chemical-mechanical planarization process applied on a wafer |
| 06/10/2004 | US20040107648 Superabrasive wire saw and associated methods of manufacture |
| 04/2004 | |
| 04/29/2004 | US20040082271 Polishing pad with window |
| 04/22/2004 | WO2004009289A3 Rising after chemical-mechanical planarization process applied on a wafer |
| 04/01/2004 | WO2003028949A3 Method of machining substrates |
| 02/2004 | |
| 02/19/2004 | WO2004014603A2 Polishing pad with window |
| 01/2004 | |
| 01/29/2004 | WO2004009289A2 Rising after chemical-mechanical planarization process applied on a wafer |
| 01/15/2004 | WO2004004971A2 Lapping method and lapping tool for glass balls |
| 12/2003 | |
| 12/17/2003 | CN1131126C Method for sanding surface on items |
| 11/2003 | |
| 11/05/2003 | EP1051283B1 Method for sanding surfaces on items |
| 04/2003 | |
| 04/10/2003 | WO2003028949A2 Method of machining substrates |
| 02/2003 | |
| 02/05/2003 | EP1281199A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 10/2002 | |
| 10/10/2002 | WO2001085392A3 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 05/2002 | |
| 05/22/2002 | CN1085131C Apparatus and method for grinding card clothings |
| 01/2002 | |
| 01/02/2002 | CN1077003C Lapping apparatus |
| 11/2001 | |
| 11/15/2001 | WO2001085392A2 Metal chemical mechanical polishing process for minimizing dishing during semiconductor wafer fabrication |
| 05/2001 | |
| 05/22/2001 | US6234887 Method for sanding surfaces on items |
| 12/2000 | |
| 12/13/2000 | CN1276750A Method for sanding surfaces on items |
| 11/2000 | |
| 11/16/2000 | WO2000047366A3 Apparatus and method for grinding, lapping and polishing semiconductor wafers |
| 11/15/2000 | EP1051283A1 Method for sanding surfaces on items |
| 09/2000 | |
| 09/14/2000 | WO2000020167A9 Method and apparatus for automatically polishing magnetic disks and other substrates |
| 08/2000 | |
| 08/17/2000 | WO2000047366A2 Apparatus and method for grinding, lapping and polishing semiconductor wafers |
| 04/2000 | |
| 04/13/2000 | WO2000020167A2 Method and apparatus for automatically polishing magnetic disks and other substrates |
| 05/1999 | |
| 05/14/1999 | WO1999022905A1 Method for sanding surfaces on items |
| 02/1999 | |
| 02/17/1999 | CN1207977A Apparatus and method for grinding card clothings |
| 10/1998 | |
| 10/14/1998 | CN1195596A Lapping apparatus |
| 09/1994 | |
| 09/28/1994 | CN1092865A Apparatus for inspecting of diamond or jewelry with diamond and method for photography of diamond or jewelry with diamond by use of same |
| 09/1988 | |
| 09/20/1988 | CA1242076A1 Means for sharpening a studded rock drill crown |
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