Patents
Patents for B24B 7 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor (8,400)
03/2009
03/04/2009CN100464949C A digital controlled linear guide rail end surface and an end surface edge chamfering grinder
03/03/2009US7498239 Wafer processing method
03/03/2009US7497762 Apparatus and method for correcting grinding amount of liquid crystal display panel
03/03/2009US7497151 Method of machining a brake disc
03/03/2009CA2258200C Flexible abrasive member having interlocking deposits
02/2009
02/26/2009WO2008136887A3 Face finished honeycomb structures and methods of manufacturing same
02/26/2009US20090054243 Method of polishing tape-shaped substrate and substrate for oxide superconductor
02/26/2009US20090053978 Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc Grinding Method Using the Same for Semiconductor Wafer
02/26/2009US20090053976 Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
02/26/2009US20090050897 Substrate, method of polishing the same, and polishing apparatus
02/25/2009EP1915232B1 Floor treating machine with improved rotary drive
02/25/2009CN201198110Y Motor stand of plastic plate polisher
02/25/2009CN201198102Y Steel plate automatic sander
02/25/2009CN101374634A Method for profiling in cd-direction the surface qualities of a fibrous web to be manufactured/treated in a paper/board machine or in a finishing machine
02/25/2009CN101372090A Method for measuring thickness of substrate and equipment for processing substrate
02/24/2009US7494403 Knife sharpener with improved knife guides
02/24/2009US7494402 Ferrule holder assembly for optical-fiber-end-face grinding apparatus
02/19/2009US20090047884 Chemical mechanical polishing pad structure minimizing trapped air and polishing fluid intrusion
02/19/2009US20090047881 Combinatorial processing including rotation and movement within a region
02/19/2009US20090047879 Low load swinging mechanism for a sander
02/19/2009US20090047876 Chemical mechanical polishing pad with controlled wetting
02/19/2009US20090047873 Substrate retainer
02/19/2009US20090047872 Polishing pad
02/19/2009US20090047871 Interpenetrating network for chemical mechanical polishing
02/19/2009US20090047869 Precision Machining Method
02/19/2009US20090047785 CMP Polishing Method, CMP Polishing Apparatus, and Process for Producing Semiconductor Device
02/19/2009DE202008015415U1 Schleifwerkzeug Grinding tool
02/18/2009EP2025470A1 Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method
02/18/2009EP2025469A1 Multi-layer polishing pad material for CMP
02/18/2009EP2025460A2 Improved chemical mechanical polishing pad and methods of making and using same
02/18/2009EP2025458A2 Interpenetrating network for chemical mechanical polishing
02/18/2009EP2025456A2 Chemical mechanical polishing pad with controlled wetting
02/18/2009EP2025455A2 Chemical mechanical polishing method
02/18/2009EP2025454A2 Improved chemical mechanical polishing pad and methods of making and using same
02/18/2009CN201195268Y Processing device for double-straight flange edge grinding machine with glass two-plane frame film removed
02/18/2009CN201195267Y Bamboo splint surface sanding grinder with multi-groove guide device
02/18/2009CN101370619A Apparatus and method for edge processing of a glass sheet
02/18/2009CN101367251A Stone local defect repairing method and special grinding apparatus
02/18/2009CN101367183A Novel processing method for removing defect of veneer for manufacturing recombined decoration material and products thereof
02/18/2009CN101367182A High-accuracy large-scale surface-grinding machine
02/18/2009CN100462200C Residue removing type brick polishing machine
02/17/2009US7491117 Substrate holding apparatus
02/17/2009US7491114 Fiber optic polisher
02/12/2009US20090042490 Three-dimensional network for chemical mechanical polishing
02/12/2009US20090042488 Back grinding method for wafer
02/12/2009US20090042487 Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method
02/12/2009US20090042482 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
02/12/2009US20090042480 Polishing pad and polishing apparatus
02/12/2009US20090042479 Grinding apparatus and method of controlling grinding apparatus
02/12/2009US20090042392 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method
02/12/2009US20090041563 Wafer Transferring Apparatus, Polishing Apparatus, and Wafer Receiving Method
02/11/2009CN201192861Y Jig for plastic flat-plate shaping
02/11/2009CN201192801Y Hydraulic cylinder control device for moving stone grinding machine main engine
02/11/2009CN201192800Y Hydraulic lift bridge type stone grinding machine
02/11/2009CN201192799Y Machine for renewing stone
02/11/2009CN201192798Y Thrust bearing ring double end-face grinding and processing apparatus
02/11/2009CN201192797Y Ceramic material lapping device of metallographical polish-grinding machine
02/11/2009CN201192796Y Precision surface grinding machine
02/11/2009CN101362312A Glazing machine
02/11/2009CN101362309A Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method
02/11/2009CN100460149C Frame of mechanical polishing clamp and the mechanical polishing machine table
02/10/2009US7488241 Precision control of sharpening angles
02/10/2009US7488236 Polishing pad and method of producing the same
02/05/2009US20090036039 Methods and apparatus for polishing an edge of a substrate
02/05/2009US20090036035 Apparatus and methods for conditioning a polishing pad
02/04/2009CN201189623Y Electric wall polishing machine capable of being equipped with extending lever
02/04/2009CN101360584A Method and device for polishing plate-like body
02/04/2009CN101357447A Plate glass surface grinding device and method
02/03/2009US7485029 Double face polishing apparatus
01/2009
01/29/2009WO2009014836A1 Scratch removal device and method
01/29/2009US20090029634 Semiconductor wafer polishing machine
01/29/2009US20090029633 Method of polishing a silicon-containing dielectric
01/29/2009US20090029631 Mitigation of stress corrosion and fatigue by surface conditioning
01/29/2009US20090029627 Polishing apparatus and polishing method
01/29/2009CA2691843A1 Scratch removal device and method
01/28/2009CN101352822A Special purpose grinder for piston ring helical supporting spring head face
01/28/2009CN100455410C Method and device for precisely controlling axial fiber polishing thickness
01/27/2009US7481698 Sintered rare earth magnetic alloy wafer surface grinding machine
01/22/2009WO2009012086A1 Method and apparatus for refinishing wooden floors
01/22/2009US20090023369 Floor processing machine with tiltable finishing units
01/22/2009US20090023368 Polishing head and edge control ring thereof, and method of increasing polishing rate at wafer edge
01/22/2009US20090023367 Device and method for sharpening blades
01/22/2009US20090023366 Method of making abrasive article
01/22/2009US20090023365 Pneumatic grinder
01/21/2009CN101349029A Method and device for controlling the optical properties of a fiber web
01/21/2009CN101347923A Method and apparatus for improving insufficiency of wafer grinding and thick thickness
01/21/2009CN101347913A Bistrique structure with surface-grinding and chamfering-machining functions
01/21/2009CN100453269C Substrate holdfast and its fixing member
01/21/2009CN100453268C Straight line rolling guiding rail, and guideway slider multiple grinding head combined grinding machine
01/20/2009CA2320460C Sanding block
01/15/2009US20090017735 Device for polishing hard surfaces, especially glass surfaces
01/15/2009DE112007000523T5 Polierkopf zum Polieren von Halbleiter-Wafern Polishing head for polishing semiconductor wafers
01/14/2009CN101342669A Wood block wiredrawing bench
01/14/2009CN101342668A Holding jig
01/08/2009US20090011689 Grinding machine
01/08/2009US20090011687 Eyeglass lens processing apparatus
01/08/2009US20090011685 Polishing Machine Comprising Sliding Means Transverse to the Front Face
01/08/2009US20090011683 Method For Grinding Semiconductor Wafers
01/08/2009US20090008794 Thickness Indicators for Wafer Thinning
01/08/2009DE102008030067A1 Metal workpiece holder for polishing machine has ring shaped apertures with soft liners to reduce damage risk to workpieces
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