Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 7 - Constructional details common to different types of electric apparatus
Patents for H05K 7 - Constructional details common to different types of electric apparatus (98,845)
03/2003
03/20/2003US20030051859 Modular capillary pumped loop cooling system
03/20/2003US20030051338 Method of assembling a land grid array module and alignment tool for use therewith
03/20/2003DE20300690U1 Electronic systems have housings with forced convection air cooling and deflector units
03/20/2003DE20300689U1 Electronic systems have housings with forced convection air cooling and deflector units
03/20/2003DE20300298U1 Air curtain, highly efficient cooling system for external heat dissipation from switchgear cubicles and/or housings
03/19/2003EP1294219A2 Duct fan unit
03/19/2003EP1293112A1 Display monitor installed in a protective housing forming a confinement
03/19/2003CN2540724Y Ground protection spacer
03/19/2003CN1404707A Fan protection
03/19/2003CN1404357A Power supply structure for communication equipment
03/19/2003CN1404284A Apparatus for mounting rotary lens receptacle in folding telephone
03/19/2003CN1404206A Power inverter
03/19/2003CN1404145A Heat transferring vane unit
03/18/2003US6535603 Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
03/18/2003US6535409 Industrial power supply modules
03/18/2003US6535397 Interconnect structure for interconnecting electronic modules
03/18/2003US6535396 Combination circuit board and segmented conductive bus substrate
03/18/2003US6535395 Processor power delivery system
03/18/2003US6535394 Printed circuit board attachment structure
03/18/2003US6535390 Securing device and electronic appliance assembly applying the same
03/18/2003US6535387 Heat transfer apparatus
03/18/2003US6535386 Electronic assembly having a heat pipe that conducts heat from a semiconductor die
03/18/2003US6535385 High performance heat sink configurations for use in high density packaging applications
03/18/2003US6535384 Hard diskdrive mobile rack cooling arrangement
03/18/2003US6535382 Cooling system for electronic equipment cabinets
03/18/2003US6534722 Flat panel type display apparatus
03/18/2003US6534339 Semiconductor device comprising a socket and method for forming same
03/18/2003US6533840 Microchannel laminated mass exchanger and method of making
03/18/2003US6533613 Shielded zero insertion force socket
03/18/2003US6533608 Electronic component installation structure
03/18/2003US6533597 Electrical connector having improved housing structure
03/18/2003US6533595 Socket for electrical parts
03/18/2003US6533592 Assembly of an electrical connector and a pick-up cap
03/18/2003US6533587 Circuit board riser
03/18/2003US6533028 Heat sink, method of manufacturing the same, and cooling apparatus using the same
03/18/2003CA2278901C Electronic device cooling system having guides for guiding a flow of the air evenly
03/13/2003WO2003021975A2 Module, rear panel and bidirectional multiplexer
03/13/2003WO2003021774A2 Emi air filter
03/13/2003WO2003003520A3 Printed circuit board with isolated metallic substrate comprising an integrated cooling system
03/13/2003WO2002086968A3 Liquid-cooled power semiconductor device heatsink
03/13/2003WO2002078127A3 Stitched lga connector
03/13/2003WO2002056661A3 Printed circuit board ejector system with improved emi shielding
03/13/2003WO2002039205A3 Winding cassette for electric and computer and telecommunication connection cables, independent or integrated in any computer equipment component
03/13/2003US20030051185 Extended computer systems
03/13/2003US20030051168 Virus detection
03/13/2003US20030051167 Combined computer system
03/13/2003US20030051166 Privacy
03/13/2003US20030051088 Front access only CPCI computer system
03/13/2003US20030051057 Edge protection
03/13/2003US20030051024 Configuring external network connections
03/13/2003US20030050998 System management
03/13/2003US20030050003 Air flow management system for an internet data center
03/13/2003US20030050002 Ventilated outdoor electronics enclosure
03/13/2003US20030049887 Semiconductor device and a method of manufacturing the same
03/13/2003US20030048999 Optical unit with increased reliability
03/13/2003US20030048625 Mounting structure, mounting method and mounting apparatus for high frequency circuit components
03/13/2003US20030048623 Capture device for boards having variable thickness
03/13/2003US20030048618 Integrated wedge lock and elastic member
03/13/2003US20030048616 Memory module
03/13/2003US20030048615 Integrity monitoring
03/13/2003US20030048614 Removable media
03/13/2003US20030048613 Computer system storage
03/13/2003US20030048612 Electronic assemblies with high capacity curved fin heat sinks
03/13/2003US20030048611 Electronic control device for use in vehicles
03/13/2003US20030048084 Low profile motor
03/13/2003US20030048010 Housing for use in a vehicle to accommodate a printed circuit board containing electronic components
03/13/2003US20030047524 Shelf unit for communication system
03/13/2003US20030047304 Power feed and heat dissipating device for power semiconductor devices
03/13/2003US20030047302 Heat sink module and an arrangment of heat sink modules
03/13/2003DE20300949U1 High-efficiency protective counter-flow cooling system e.g. for switch-cabinets, includes plate mounted on partition wall and equipped with cooling fins
03/13/2003DE20300300U1 Fan-less chip- and/or processor- high capacity cooling-system for computer and controls, uses single-part and multi-part heat receiving/take-up plates
03/13/2003DE20300299U1 High-capacity protective cooling system for electrical components by external removal of heat from switch-cabinets and/or housings, uses external fan-unit with forced convection
03/12/2003EP1292178A1 Suspension for electronic module operated during, and after serious impact
03/12/2003EP1291960A2 Antenna with heat sink
03/12/2003EP1291913A2 Morphing fillers and thermal interface materials
03/12/2003EP1290928A1 Heatsink and heatsink device using the heatsink
03/12/2003EP1290527A1 Packaging system for mass memory units having uniform or mixed form factors
03/12/2003EP1290513A2 Two-wire field-mounted process device
03/12/2003EP0858578B1 Liquid cooled heat sink for cooling electronic components
03/12/2003CN2540081Y Improved heat airflow radiating apparatus for cabinet type machine case
03/12/2003CN1402895A Optical device contg. fiber-optic component
03/12/2003CN1402341A Socket for semiconductor device
03/12/2003CN1402319A IC chip installing structure and display apparatus
03/12/2003CN1402104A Screw-less mainframe board fixing device
03/12/2003CN1103073C Inputting/outputting module used in data main
03/11/2003US6532423 Method for determining fluid flow characteristic curves of heat-dissipating system
03/11/2003US6532154 Stack assembly housing
03/11/2003US6531942 Method of cooling an induction coil
03/11/2003US6530798 Ball grid array socket connector
03/11/2003US6530797 ZIF socket
03/11/2003US6530788 Structure of a ball grid array IC socket connection with solder ball
03/11/2003US6530784 Display connection structure of electronic appliance
03/11/2003US6530629 Retainer for retaining interface isolating pieces
03/11/2003US6530420 Heat carrier
03/10/2003CA2402182A1 Network protector locking spring loaded control connections
03/06/2003WO2003019841A2 Enhanced protocol conversion system
03/06/2003WO2003019728A2 Interconnect module
03/06/2003WO2003019703A1 Battery accessible modules for rack mount systems
03/06/2003WO2003019655A1 Radiation plate and power semiconductor module, ic package
03/06/2003WO2003019591A2 Housing for electrical components, in particular for capacitors
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