Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 7 - Constructional details common to different types of electric apparatus
Patents for H05K 7 - Constructional details common to different types of electric apparatus (98,845)
11/2008
11/04/2008US7447021 Air guiding cover
11/04/2008US7447020 Heat sink assembly
11/04/2008US7447019 Computer having an axial duct fan
11/04/2008US7447018 Display apparatus
11/04/2008US7447017 Computer having a heat discharging unit
11/04/2008US7447014 Bracket assembly for disk drive and a method of assembling a bracket to an enclosure for preventing resonance
11/04/2008US7447013 Mounting apparatus for storage device
11/04/2008US7447011 Data storage device carrier and carrier tray
11/04/2008US7447005 Portable computer having a detachable display, the detachable display, and a supporting device to support the same
11/04/2008US7447004 Portable display apparatus
11/04/2008US7447001 Electronic device having insulating cap for end of fastener protruding into housing
11/04/2008US7446410 Circuit module with thermal casing systems
11/04/2008US7446403 Carrier structure stacking system and method
11/04/2008US7445039 Heat pipe with multiple vapor-passages
11/04/2008US7444826 Fault current limiter
11/04/2008US7444743 Connecting device for connecting electrical foil conductors
11/04/2008US7444735 Process for manufacturing an integrated circuit system
10/2008
10/30/2008WO2008130717A2 Cable management system
10/30/2008WO2008129888A1 Projector, and its filter renewal control method
10/30/2008WO2008129831A1 Wiring board
10/30/2008WO2008129134A1 Method and arrangement for cooling equipment box
10/30/2008WO2008128311A2 Improvement in air-conditioner for cabinets
10/30/2008WO2008085422A3 Flat panel display mounting system
10/30/2008WO2008067182B1 Interconnecting electrical devices
10/30/2008WO2008020934A3 Minimal-temperature-differential, omni-directional-reflux, heat exchanger
10/30/2008WO2007120777A3 Dual led board layout for lighting systems
10/30/2008US20080268710 Next High Frequency Improvement by Using Frequency Dependent Effective Capacitance
10/30/2008US20080268666 Apparatus for providing controlled impedance in an electrical contact
10/30/2008US20080266828 Lead frame with solder flow control
10/30/2008US20080266827 Chip component mounting structure, chip component mounting method, and electronic device
10/30/2008US20080266826 Assemblable substrate for in-line package and assembly with same
10/30/2008US20080266824 Pad and circuit board, electronic device using same
10/30/2008US20080266818 Scanning module for a scanner system having a MEMS device or the like
10/30/2008US20080266817 Swappable electronic device having locking element
10/30/2008US20080266815 System and method to conjoin blade modules
10/30/2008US20080266814 Module Rear Wall for a Switchgear Assembly Module, Switchgear Assembly Module and Electrical Switchgear Assembly
10/30/2008US20080266813 Blade Server Assembly
10/30/2008US20080266812 Pressure-contact power semiconductor module and method for producing the same
10/30/2008US20080266811 Motor Drive Circuit And Outdoor Unit For Air Conditioner
10/30/2008US20080266810 Heat management system for a power switching device
10/30/2008US20080266809 Paste of thermally conductive particles in various particle size ranges correlated in mixture by volume % based on particle size range and particle size ratio of each size range dispersed in a nonaqueous dielectric carrier containing an antioxidant and a dispersant; connect electronics to cooling devices
10/30/2008US20080266808 Cooling Assembly
10/30/2008US20080266807 Electronic assembly with emi shielding heat sink
10/30/2008US20080266806 Electronic assembly that includes a heat sink which cools multiple electronic components
10/30/2008US20080266805 Carrier For Electrical Components With Soldered-On Cooling Body
10/30/2008US20080266804 Comprises 0 to about 49.5 weight percent of carrier oil, about 0.5 to about 25 weight percent of dispersant, and at least about 50 weight percent of thermally conductive particles such as diamond, silicon carbide, alumina, boron nitride; thermal interface material
10/30/2008US20080266802 Phase change cooled electrical connections for power electronic devices
10/30/2008US20080266801 Phase change cooled power electronic module
10/30/2008US20080266800 Heat sink with surface-formed vapor chamber base
10/30/2008US20080266799 Methods and Apparatuses for Cold Plate Stability
10/30/2008US20080266798 System and method for liquid cooling of an electronic system
10/30/2008US20080266797 Surface airflow heatsink device and the heatsink device components
10/30/2008US20080266796 Electronic device
10/30/2008US20080266795 Heat dissipating device
10/30/2008US20080266794 Processor control of cooling fluid
10/30/2008US20080266793 Cooling structure for power supply
10/30/2008US20080266792 Power supply apparatus
10/30/2008US20080266791 Redundant power supply system
10/30/2008US20080266790 Server with a flexible cooling scheme
10/30/2008US20080266789 Telecommunication cabinet with airflow ducting
10/30/2008US20080266788 Radiation device for computer or electric appliances
10/30/2008US20080266787 On-Chip Interconnect-Stack Cooling Using Sacrificial Interconnect Segments
10/30/2008US20080266786 Method and apparatus for heat dissipation
10/30/2008US20080266784 Electronic apparatus
10/30/2008US20080266781 Small form factor hard disk drive bracket latch/release mechanism
10/30/2008US20080266777 Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modules
10/30/2008US20080266774 Wireless card module
10/30/2008US20080266763 Portable electronic apparatus
10/30/2008US20080266762 Electronic device casing with a plug housing
10/30/2008US20080265845 Specially improved automotive replacement voltage regulator
10/30/2008US20080265586 Energy storage device
10/30/2008US20080264768 Side key assembly and electronic device using the same
10/30/2008US20080264614 Cooling components in electronic devices
10/30/2008US20080264613 Structure of memory heat sink
10/30/2008US20080264611 Heat plate
10/30/2008US20080264610 Protection apparatus and methods
10/30/2008US20080264608 Cooling mechanism comprising a heat pipe and water block
10/30/2008US20080264604 Cooling appartaus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
10/30/2008US20080264165 Electronic Device Installed in an Engine Room
10/30/2008DE202008009218U1 Wärmeübertragungsplatte in Art eines Kühlmoduls Heat transfer plate in the manner of a cooling module
10/30/2008DE19747397B4 Befestigungsvorrichtung für die Befestigung eines Gerätes an einer Tragschiene Fastening device for fixing an appliance to a support rail
10/30/2008DE10329397B4 Schweißkonstruktion und Schweißverfahren unter Verwendung derselben Welded construction and welding method using the same
10/30/2008DE102008011187A1 Textile Halbleiter-Baugruppe und Verfahren zur Montage und zur Fertigung der Baugruppe Textile semiconductor assembly and method of assembling and manufacturing of the assembly
10/30/2008DE102008001230A1 Kühldose für Bauelemente oder Schaltungen Cooling box for devices and circuits
10/30/2008DE102007023058A1 Cooling plate system has cooling plate with coolant channel, which is composed of multiple high-grade steel pipe and cooling plate is made of aluminum casting
10/30/2008DE102007020618B3 Verfahren zum Herstellen eines festen Leistungsmoduls und damit hergestelltes Transistormodul A method for producing a solid power module and thus produced transistor module
10/30/2008DE102007020037A1 Multistage cooling system for electronic entertainment system in aircraft has inner circuit connected to feed line by valve such that opening valve supplies additional coolant from outside to inner circuit
10/30/2008DE102007020019A1 Housing for computer, has locking bolt causing retraction of locking bolt into hole of installation housing during movement of closing slide from open position into closed position and held in hole when slide is in closed position
10/30/2008DE102007017848A1 Components e.g. application-specific integrated circuit, connecting system, has arrangement of boards and switching unit forming structure such that shortest connection possibilities between adjacent components have same signal running time
10/30/2008DE102007017623A1 Assembly plate for electrical or electronic components, has plate body made of metal, which is streaked by cooling channels for conducting cooling fluid
10/30/2008DE102004063061B4 Modul, insbesondere für ein Fahrzeug, Verfahren zur Herstellung des Moduls und Verwendung des Moduls Module, in particular for a vehicle, method of manufacturing the module and using the module
10/30/2008DE10103193B4 Verfahren zur Herstellung von Leiterbahnstrukturen A process for the production of conductor track structures
10/29/2008EP1986482A1 Additional device for electrically heating an air flow included in a ventilation, heating and/or air-conditioning installation of an automobile vehicle
10/29/2008EP1986076A1 Improvements in cooling of a data centre
10/29/2008EP1985162A2 Holder for a flexible circuit board
10/29/2008EP1984211A2 Electrical power distribution unit and electrical punched grid therefor
10/29/2008EP1911042A4 Thermally improve conductive carbon sheet base on mixed carbon material of expanded graphite powder and carbon nano tube powder
10/29/2008EP1678742A4 Liquid cooling system
10/29/2008EP1610875A4 Electrically conductive block toy
10/29/2008EP1381959A4 A global tree network for computing structures
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