Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
05/2001
05/17/2001WO2001035707A1 Component mounting machine and method
05/17/2001WO2001035706A1 Device and method for mounting parts
05/17/2001WO2001035049A1 Method and apparatus for component recognition
05/17/2001US20010001167 Electric-component transferring apparatus, method of taking images of electric components, and electric-component mounting system
05/17/2001DE10043401A1 Permanent magnet for surface mounted devices kept in packaging suitable for surface mounted device assemblies activates magnetically sensitive components while using surface mounted device pick-and-place machines
05/16/2001EP1100303A1 Programmer systems
05/16/2001EP1100302A1 Pick and place system
05/16/2001CN1295783A Supply module for feeding electrical components to automatic placement device
05/16/2001CN1295528A Device for treating plate-shaped work pieces, especially printed-circuit boards
05/16/2001CN1295021A System for conveying and supporting sheets
05/16/2001CN1065955C Apparatus and method for surface inspection
05/15/2001US6230398 Connector manufacturing method
05/15/2001US6230396 Tool for assembling/disassembling retainer to/from connector
05/15/2001US6230394 X-Y table shield for component placement device
05/15/2001US6230393 Method and device for mounting electronic component
05/10/2001WO2001033934A1 Chip card system and method for assembling circuit carriers with electronic components
05/10/2001WO2001033933A1 Method and apparatus for controlling a dispensing system
05/10/2001WO2001033932A1 A component tape including a printed component count
05/10/2001WO2001033931A1 Method and apparatus for controlling a production operation using printed information on a component tape
05/10/2001WO2001033930A1 Method and device for part feeding and part mounting device using the method and device
05/10/2001WO2001033929A1 Method and apparatus for determining and printing a component count on a component tape
05/10/2001WO2001033928A1 Component placement machine
05/10/2001US20010000904 Solder bump measuring method and apparatus
05/10/2001DE19953169A1 Arrangement to allow precise drilling of contact mounting holes in an existing test adapter board for use in testing printed circuit boards with components already mounted on it
05/09/2001EP1098559A1 Transport and holding device for panels
05/09/2001EP1098167A2 Jig for use in measuring mounting accuracy of mounting device and method of measuring mounting accuracy of mounting device
05/09/2001EP1097387A2 Device without set-up kit for the targeted moving of electronic components
05/09/2001EP1097025A1 Device for the automated tooling of works
05/08/2001US6230067 In-line programming system and method
05/08/2001US6229608 Procedure and system for inspecting a component with leads to determine its fitness for assembly
05/08/2001US6227755 Parts supply device and fixing device therefor
05/08/2001US6227372 Component carrier tray for high-temperature applications
05/08/2001US6227345 Transfer apparatus of chip components
05/03/2001WO2001031988A1 Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine
05/03/2001WO2001030543A1 Sucking nozzle and method and device for installing parts using the nozzle
05/03/2001WO2001004567A3 Method and apparatus for three dimensional inspection of electronic components
05/03/2001US20010000551 Method and device for positioning a printed-circuit board in a press
05/03/2001DE19952281A1 Component placing method involves aligning positioning element, removing it , applying component and moving on positioning element, and moving positioning element to alignment position
05/03/2001CA2324893A1 A device for transferring and supporting panels
05/02/2001EP1096846A1 Inspection method and inspection apparatus for printed circuit boards
05/02/2001CN1293597A Apparatus and method for applying viscous fluid
05/02/2001CN1293536A Manufacturing system possessing feeding/prognamming buffering system
05/01/2001US6224936 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
05/01/2001US6224675 Multiple head dispensing system and method
05/01/2001US6224404 Apparatus for removing electrical component
05/01/2001US6224298 Object transport apparatus having a floating conveying means
05/01/2001US6223968 Solder bonding/debonding nozzle insert
05/01/2001US6223893 Surface package type semiconductor package and method of producing semiconductor memory
05/01/2001US6223428 Parts distributing method
05/01/2001US6223425 Circuit-component supplying system
04/2001
04/26/2001WO2001030124A1 Feeder/programming/buffer operating system
04/26/2001WO2001029627A1 Manufacturing and carrier system with feeder/programming/buffer system
04/26/2001US20010000366 Electronic component mounting apparatus for exchanging support blocks which support circuit boards
04/24/2001US6222629 Procedure and system for inspecting a component with leads to determine its fitness for assembly
04/24/2001US6220503 Rework and underfill nozzle for electronic components
04/24/2001US6220481 Separating feeder for chip components
04/24/2001US6219905 Heat sink clip tool
04/24/2001US6219897 Electronic component mounting apparatus for exchanging support blocks which support circuit boards
04/24/2001CA2205763C Ultrasonic vibration bonding chip mounter
04/19/2001DE19930207A1 Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte- und Fixierelement zur Verwendung bei diesem Verfahren A method of manufacturing substrates with structured metallizations as well as the holding and fixing element for use in this method
04/19/2001DE10031933A1 Bauteilmontagevorrichtung und Montageverfahren The component mounting apparatus and mounting method
04/18/2001EP1093332A2 Micro device production manufacturing system
04/18/2001CN1292208A Component recognizing method and apparatus
04/17/2001US6219240 Three-dimensional electronic module and a method of its fabrication and repair
04/17/2001US6217949 Marking a semiconductor and exposure to energy
04/17/2001US6216419 Tape-shaped parts package, parts storing tape, tape-shaped cover and parts packaging apparatus
04/17/2001US6216341 Surface mounting method of electronic components
04/17/2001US6216336 Electronic component mounting device
04/12/2001WO2001026441A1 Parts assembling device
04/12/2001WO2001026440A1 Device for transferring/holding sheetlike member and its method
04/12/2001WO2001025123A1 Pusher, puller, loader, unloader, and working device
04/12/2001WO2000051169A3 Device for wetting a surface
04/12/2001DE19948131A1 Einrichtung für das Beladen und Entladen bei der Behandlung von plattenförmigen Gegenständen Means for loading and unloading in the treatment of plate-shaped articles
04/12/2001DE19944290A1 Vorrichtung zum Zuführen von elektronischen Bauteilen An apparatus for supplying electronic components
04/12/2001DE10040095A1 Automatic contact assembling device for printed circuit board assembly, has carriage that supports cutter, transportation unit and supports setting finger, at desired orientation by cam grooves in support cylinder
04/12/2001DE10037704A1 Bauelement-Montagemaschine und Montageverfahren Component mounting machine and assembly processes
04/12/2001DE10037703A1 Display device for factory automation apparatus e.g. electronic component mounting apparatus, has switching unit to switch display mode that is displayed along with data on screen
04/12/2001DE10032718A1 Magazine used to store and process electronic circuit boards, has boards stacked on pallets in designated locations in magazine
04/11/2001EP1090965A2 Rust preventive composition and method of preventing zinc or zinc alloys from rusting
04/11/2001EP1090857A2 Loading and unloading device for the treatment of platelike objects
04/11/2001EP1090539A1 Gripping device
04/11/2001EP1090267A1 Inspection system and method for leads of semiconductor devices
04/11/2001CN1291422A Electronic component mounting apparatus
04/11/2001CN1291069A Electronic element plug and electronic element plug-in device
04/11/2001CN1290946A Method for producing electronic element
04/10/2001US6216046 Method for controlling successive machine processes
04/10/2001US6214117 Dispensing system and method
04/10/2001US6212765 Method for removing microelectronic circuits from substrates and tool used in removal
04/10/2001US6212751 Method and apparatus for examining position of board-support pin, and method and apparatus for positioning board-support pin
04/05/2001WO2001024598A1 Component mounting method and component mounting apparatus
04/05/2001WO2001024597A1 Method for generating data for component mounting and apparatus for the same, and method for component mounting and apparatus for the same
04/05/2001WO2001023133A1 Processing assembly and method
04/05/2001US20010000100 Method for mounting devices on a printed circuit board despite misalignment of resist
04/05/2001DE10021078A1 Surface mounting device for assembling electronic components on printed circuit board, has one pair of X frame and multiple pairs of Y frames, with heads mounted on Y frames
04/05/2001DE10020339A1 Circuit boards transfer device for surface mounting device with various electronic components such as chips and surface mount devices, has X-Y portal mounted on upper part of frame and movable along X- or Y-axis
04/04/2001EP1089608A2 Component recognizing method and apparatus
04/04/2001EP1089607A2 Component recognizing method and apparatus
04/04/2001EP1089347A2 Method and apparatus for automatically soldering a lead wire to a solar battery
04/04/2001CN2425857Y Soldering iron adjusting mechanism for braiding machine
04/04/2001CN1290229A Quick fastener for punched tapes