Patents
Patents for H05K 13 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components (22,634)
12/2002
12/24/2002US6497440 Gripper for parts having different shape in surface mount device
12/24/2002US6497319 Work transfer apparatus
12/24/2002US6497037 Production line for mounting electronic components
12/24/2002CA2141650C Marking system for printed circuit boards
12/19/2002WO2002102128A1 Optical sensor device
12/19/2002WO2002102127A1 Device for assembling components on a substrate
12/19/2002US20020189090 Apparatus for feeding electronic component and method for mounting electronic component
12/19/2002US20020189069 Feeder device and method of using same
12/19/2002DE10125399A1 Automatic electrical-components equipping device for circuit boards, includes device for reducing applied force of end-face against friction surface
12/19/2002DE10125392A1 System for assembling components on substrates has areas for assembling components on substrates fitted on the side of a conveyor track and fed with printed circuit boards via substrate supports.
12/18/2002EP1266550A1 Device for conveying printed boards
12/18/2002EP1018089B1 Component feeder configuration monitoring
12/18/2002EP0919323B1 Part supplying device and method for supplying parts using the same device
12/18/2002CN1096825C Apparatus and method for assembling electronics elements
12/18/2002CN1096647C Method of generating data on component arrangement
12/18/2002CN1096310C Method and apparatus for sheet products treatment like circuit board
12/17/2002US6496272 Illuminator for use in electronic component mounting apparatus and electronic component mounting apparatus having illuminator
12/17/2002US6496000 Apparatus and method for testing module devices
12/17/2002US6494671 Method and apparatus for collectively changing components at component supply section
12/17/2002US6494667 Component suction method
12/17/2002US6494359 Thermo-compression bonding apparatus for connecting a liquid crystal panel to an external drive circuit
12/17/2002US6493931 Method and device for mounting electronic component
12/17/2002US6493927 Linear-motor-driven chuck and electric-component mounting system
12/12/2002WO2002100146A2 Assembly head comprising a stepped-drive rotating rotor and a pneumatic pressure control device
12/12/2002WO2002100134A2 Assembly head comprising a pneumatic pressure control device and method for operating said assembly head
12/12/2002WO2002099851A2 Temperature controlled vacuum chuck
12/12/2002WO2002099850A2 Interchangeable microdeposition head apparatus and method
12/12/2002WO2002099849A2 Apparatus for microdeposition of multiple fluid materials
12/12/2002WO2002099848A2 Formation of printed circuit board structures using piezo microdeposition
12/12/2002WO2002099726A2 Multiple output reel taper apparatus
12/12/2002WO2002098576A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
12/12/2002WO2002098575A1 Over-clocking in a microdeposition control system to improve resolution
12/12/2002WO2002098574A1 Microdeposition apparatus
12/12/2002WO2002098573A1 Waveform generator for microdeposition control system
12/12/2002US20020185876 Parts suction head having non-contact sealing structure
12/12/2002US20020185875 Parts suction head of surface mount device
12/12/2002US20020185810 Conveyor and fixing unit for substrates
12/12/2002US20020184755 Electric-component mounting system and method of detecting positioning error in the system
12/12/2002US20020184747 Method and apparatus for feeding component, and method and apparatus for mounting component
12/12/2002DE10128386A1 Anordnung zur Lagerung von Transportwalzen Arrangement for storage of transport rollers
12/11/2002EP1265474A1 Method and device for part feeding and part mounting device using the method and device
12/11/2002EP1265473A2 Positioning arrangement for transport rolls
12/11/2002EP1264524A2 Single camera alignment system using up/down optics
12/11/2002EP1264334A2 Digital feature separation
12/11/2002EP1263649A1 Taper machine using inertial control of parts
12/11/2002CN1384774A Sucking nozzle and method and device for installing parts using the nozzle
12/11/2002CN1384704A Parts installation device
12/11/2002CN1384537A Flip-chip semiconductor chip bonding means
12/11/2002CN1096225C Circuit board conveying method and apparatus
12/11/2002CN1096224C Device and method for mounting electronic component and device
12/11/2002CN1096223C Component mounting apparatus and method
12/11/2002CN1095993C Integrated circuit conveying device
12/11/2002CN1095897C Balancing device for drum washing machine
12/11/2002CN1095698C Binder coating device
12/10/2002US6492825 Socket and printed circuit board for semiconductor device, and method of testing semiconductor device
12/10/2002US6492598 Printed circuit board assembly and method for making a printed circuit board assembly
12/10/2002US6492187 Method for automatically positioning electronic die within component packages
12/10/2002US6491250 Rotary-type circuit-component supplying apparatus
12/10/2002US6491155 Device for hooking pieces, in particular printed circuits, on transport lines present in tunnel type kilns and the like
12/10/2002US6490787 Method and apparatus for aligning and supplying electrical component
12/10/2002US6490784 Automatic electronic component-mounting apparatus
12/10/2002US6490781 Component mounting machine and safety device thereof
12/05/2002WO2002096773A1 Electronic component container
12/05/2002US20020180962 Device and method for inspecting a three-dimensional surface structure
12/05/2002US20020179679 Three-dimensional soldering inspection apparatus and method
12/05/2002US20020179460 Surface package type semiconductor package and method of producing semiconductor memory
12/05/2002US20020178578 Component suction device, component mounting apparatus and component mounting method
12/05/2002US20020178577 Fixture to couple an integrated circuit to a circuit board
12/05/2002DE10125398A1 System for assembling components on substrates has substrate carriers moving vertical to a conveyor track, loading devices and handling devices for removing components from feeder devices to put them on substrates.
12/05/2002DE10125396A1 System for transferring circuit boards from path leading from loading to unloading zone, to second path at angle to it comprises carriages moving on guide rails passing through zone where paths overlap
12/05/2002DE10125391A1 System for transferring circuit boards from path leading from loading to unloading zone, to second path at angle to it comprises carriages moving on guide rails passing through zone where paths overlap
12/05/2002DE10119232C1 Einrichtung zum Kennzeichnen von mit einer Mehrzahl zu bestückender elektrischer Bauelemente versehenen Bauelemententrägern und Verfahren zur Verwendung der Einrichtung Means for identifying provided with a plurality of electrical components to bestückender component carriers and methods of using the device
12/04/2002EP1181854B1 Method for fitting a substrate with components
12/04/2002EP0940229B1 Cartesian coordinates robot
12/04/2002CN1383237A Integrated circuit socket and absorbent sheet for same
12/04/2002CN1383199A Driving gear of manipulator
12/04/2002CN1383158A Method and structure for mounting subpanel on electronic parts
12/04/2002CN1095625C Component mounting head
12/04/2002CN1095624C Electronic component mounting appts.
12/04/2002CN1095585C Method and appts. of mfg. wiring harness
12/03/2002US6490048 Tomographic reconstruction of electronic components from shadow image sensor data
12/03/2002US6489586 Method and apparatus for verification of assembled printed circuit boards
11/2002
11/28/2002WO2002096179A1 Assembly system and method for assembling components on substrates
11/28/2002WO2002095793A2 Assembly system and method for assembling components on substrates
11/28/2002WO2002094691A2 Manipulation device for displacing objects
11/28/2002WO2002041680A3 Component release device for multiple component tapes and release system for pick-and-place components
11/28/2002WO2002017357A3 Three dimensional inspection of leaded ics
11/28/2002US20020174627 Surface package type semiconductor package and method of producing semiconductor memory
11/27/2002EP1260128A1 Method and device for determining the pick-up position of electrical components in a component placement device
11/27/2002EP1260127A2 Suction nozzle for holding component by suction
11/27/2002EP1260126A2 Component mounting apparatus and component mounting method, and, recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
11/27/2002EP1190612B1 Method and device for transmitting data between pick-and-place robots and a feeding unit, pick-and-place robot and feeding unit
11/27/2002EP1169899B1 Insertion head with a twisting device for electrical components
11/27/2002EP1155604B1 Device for fitting substrates with electrical components
11/27/2002EP1020104B1 Method for mounting semiconductor element to circuit board, and semiconductor device
11/27/2002EP0951809B1 Device for feeding electric components to an assembly automaton
11/27/2002EP0918453B1 Carrier tape cutter and component packaging machine
11/27/2002CN2523175Y Automatic assembling mechanism of electronic components
11/27/2002CN1382012A Installing device and method for electronic component
11/27/2002CN1381891A Semiconductor packaging device and mounting method of semiconductor packaging device