Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
04/2005
04/05/2005US6874910 Light source device using LED, and method of producing same
04/05/2005US6874686 Optical readout device
03/2005
03/31/2005WO2005029601A2 Multilayer coating package on flexible substrates for electro-optical devices
03/31/2005WO2005029600A1 Chip type led
03/31/2005WO2005029599A2 Semiconductor light-emitting device and its manufacturing method
03/31/2005WO2005029598A1 Gallium nitride-based compound semiconductor light-emitting device and electrode for the same
03/31/2005WO2005029597A1 Illuminating device
03/31/2005WO2005029596A1 Light-emitting device
03/31/2005WO2005029595A1 Group iii-nitride-based compound semiconductor device
03/31/2005WO2005029594A1 A structure of light emitting diode
03/31/2005WO2005029588A1 Nitride semiconductor device and method for manufacturing same
03/31/2005WO2005029587A1 Nitride semiconductor device
03/31/2005WO2005029580A2 Connector
03/31/2005WO2005029573A1 Fabrication of semiconductor devices
03/31/2005WO2005029572A1 Fabrication of conductive metal layer on semiconductor devices
03/31/2005WO2005029554A2 Multidirectional light emitting diode unit
03/31/2005WO2005029185A2 Led lighting source and led lighting apparatus
03/31/2005WO2005028536A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition
03/31/2005WO2005020287A9 Semiconductor device and method
03/31/2005WO2005017962A9 System and process for producing nanowire composites and electronic substrates therefrom
03/31/2005WO2005013379A3 Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip
03/31/2005WO2005013365A3 Semiconductor light emitting device, light emitting module, and lighting apparatus
03/31/2005WO2005013316A3 Method for the production of a plurality of opto-electronic semiconductor chips and opto-electronic semiconductor chip
03/31/2005WO2005004202A3 Full spectrum phosphor blends for white light generation with led chips
03/31/2005WO2004102632A3 High power allngan based mulit-chip light emitting diode
03/31/2005WO2004042831A3 Radiation-emitting semiconductor device and method of manufacturing such a device
03/31/2005US20050070105 Small volume process chamber with hot inner surfaces
03/31/2005US20050068776 Led and led lamp
03/31/2005US20050067948 Electroluminescent device having an improved contrast
03/31/2005US20050067944 Light emitting array with improved characteristics, optical writing unit, and image forming apparatus
03/31/2005US20050067636 Submount and semiconductor device
03/31/2005US20050067629 Semimetal semiconductor
03/31/2005US20050067628 Light emitting diode
03/31/2005US20050067627 High efficiency multi-active layer tunnel regenerated white light emitting diode
03/31/2005US20050067626 LCD having semiconductor components
03/31/2005US20050067625 Semiconductor light-emitting device
03/31/2005US20050067624 Contacting scheme for large and small area semiconductor light emitting flip chip devices
03/31/2005US20050067623 Semiconductor light emitting device and fabrication method thereof
03/31/2005US20050067613 Nitride-based semiconductor device
03/31/2005US20050066885 Group III-nitride semiconductor substrate and its manufacturing method
03/31/2005US20050066880 Process for preparing a bonding type semiconductor substrate
03/31/2005DE10346606A1 Radiation-emitting semiconductor component comprises a current expanding layer arranged on the n-conducting side of a semiconductor body and in an electrical conducting connection with a semiconductor layer sequence
03/31/2005DE10346605A1 Strahlungemittierendes Halbleiterbauelement Strahlungemittierendes semiconductor device
03/31/2005DE10340040A1 Beleuchtungseinheit mit Lichtleitkörper und integrierter optischer Linse Lighting unit with optical fibers and integrated optical lens
03/31/2005DE10340039A1 Beleuchtungseinheit mit Lichtquelle und dieser nachgeschaltetem transparenten Lichtleitkörper Lighting unit with light source and the downstream transparent light guide body
03/31/2005DE10339985A1 Optoelectronic component used as a light emitting diode comprises a semiconductor chip with a contact surface connected to a conducting transparent layer of a connecting region of the support body
03/31/2005CA2538016A1 Multidirectional light emitting diode unit
03/30/2005EP1519423A1 Semiconductor light-emitting device
03/30/2005EP1519105A2 Light emitting diode carrier, in particular for automobiles
03/30/2005EP1518824A1 sp3 BOND BORON NITRIDE EMITTING LIGHT IN ULTRAVIOLET REGION, ITS PRODUCING METHOD, AND FUNCTIONAL MATERIAL USING SAME
03/30/2005EP1518445A1 A system for maintaining light characteristics from a multi-chip led package
03/30/2005CN2689462Y Packing structure for organic LED
03/30/2005CN1602650A Electroluminescent device having an improved contrast
03/30/2005CN1602555A Conductor frame for a radiation-emitting component, radiation emitting component and method for producing the same
03/30/2005CN1602519A Optical readout device
03/30/2005CN1602124A Light emitting cell having composite conductive layer
03/30/2005CN1601780A Mfg method of fall carrier capture structure organic LED
03/30/2005CN1601777A Light emitting diode
03/30/2005CN1601776A Led
03/30/2005CN1601775A Method of mfg, semiconductor light emitting component
03/30/2005CN1601774A Structure of LED and its mfg method
03/30/2005CN1601773A Semiconductor light-emitting component
03/30/2005CN1601772A Modular structure of array LED and its packing method
03/30/2005CN1601770A Cadmium sulfide quantum point synthetized by 2-phase heating process
03/30/2005CN1601769A Mfg method of light-emitting component having heat absorbing layer
03/30/2005CN1601768A LED structure
03/30/2005CN1601767A Backlight plate of LED
03/30/2005CN1601766A Reduction method of sapphire substrate
03/30/2005CN1601765A Nitride element
03/30/2005CN1601764A Semiconductor LED
03/30/2005CN1601693A Material with composite substrate of (Mg, Cd) In2O4/MgAl/204 and its prepn method
03/30/2005CN1601371A Solid luminous element, its mfg.method and projector
03/30/2005CN1601352A Polarized light source
03/30/2005CN1601350A LED Light Source and backlight modular
03/30/2005CN1600759A Luminescence oligomer in PPV category of containing biphenyl center
03/30/2005CN1195330C Method for making N electrode of chip of gallium nitride LED
03/30/2005CN1195329C Process for preparing plarization controllable photoelectric device
03/29/2005US6873380 Providing optical elements over emissive displays
03/29/2005US6873092 Display unit
03/29/2005US6872986 Nitride semiconductor device
03/29/2005US6872983 High speed optical transceiver package using heterogeneous integration
03/29/2005US6872982 Semiconductor device and method of fabricating the same and method of forming nitride based semiconductor layer
03/29/2005US6872981 Diamond ultraviolet luminescent element
03/29/2005US6872967 Nitride-based semiconductor device and manufacturing method thereof
03/29/2005US6872965 Group III nitride compound semiconductor device
03/29/2005US6872649 Method of manufacturing transparent conductor film and compound semiconductor light-emitting device with the film
03/29/2005US6872585 LED device and manufacturing method thereof
03/29/2005US6872249 Synthesis of colloidal nanocrystals
03/29/2005US6871986 Interior illuminating apparatus for vehicle
03/29/2005US6871982 High-density illumination system
03/29/2005US6871977 Light source portion for backlight module, backlight module using the same, and connection structure of backlight module
03/29/2005CA2243593C An led illuminated lamp assembly
03/24/2005WO2005027576A2 Light efficient packaging configurations for led lamps using high refractive index encapsulants
03/24/2005WO2005027233A2 Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
03/24/2005WO2005027232A1 GaN LIGHT-EMITTING DIODE
03/24/2005WO2005027231A1 White light emitting lighting system
03/24/2005WO2005026671A2 Focal plane arrays in type-ii superlattices
03/24/2005WO2005025933A2 Led light source
03/24/2005WO2005025831A1 Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
03/24/2005WO2004100276A3 Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same
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